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Books in Engineering and technology

The Engineering and Technology portfolio includes comprehensive overviews of all major research and practical developments in aerospace and automotive engineering, civil and environmental engineering, mechanical and industrial engineering, materials engineering, electrical engineering, communications engineering, and more. In-depth coverage, innovative state-of-the-art approaches, and real-world case studies provide valuable, actionable insights for researchers, applied engineers and students. The content in Elsevier's Engineering and Technology books program addresses core issues in industry and society, such as sustainability, the circular economy, AI, and automation.

  • Nanotechnology Environmental Health and Safety

    Risks, Regulation and Management
    • 1st Edition
    • Matthew Scott Hull + 1 more
    • Matthew Scott Hull + 1 more
    • English
    This book tackles the debate over nanotechnology's environmental health and safety (EHS) by thoroughly explaining EHS issues, financial implications, foreseeable risks (i.e. exposure, dose, hazards of nanomaterials), and the implications of occupational hygiene precautions and consumer protections. Real-world case studies are included, e.g. the discussion of a leading chemical company's unusual pairing with the USA's largest environmental NGO, and an innovative program designed for small- to mid-sized businesses, which became a model approach for proactive nanotechnology EHS risk management.

  • Encapsulation Technologies for Electronic Applications

    • 1st Edition
    • Haleh Ardebili + 1 more
    • English
    Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-s... (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packagin... (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechan... systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

  • Hot Embossing

    Theory and Technology of Microreplication
    • 1st Edition
    • Matthias Worgull
    • English
    This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to revolutionize a wide range of medical and industrial processes over the coming decade.The hot embossing process for replicating microstructures was developed by the Forschungszentrum Karlsruhe (Karlsruhe Institute of Technology) where the author is head of the Nanoreplication Group. Worgull fills a gap in existing information by fully detailing the technology and techniques of hot embossing. He also covers nanoimprinting, a process related to hot embossing, with examples of actual research topics and new applications in nanoreplication.

  • Handbook of Deposition Technologies for Films and Coatings

    Science, Applications and Technology
    • 3rd Edition
    • Peter M. Martin
    • English
    This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.

  • The Effect of Creep and Other Time Related Factors on Plastics and Elastomers

    • 2nd Edition
    • Laurence W. McKeen
    • English
    The second edition of the classic data book, The Effect of Creep and Other Time Related Factors on Plastics and Elastomers (originally published in 1991), has been extensively revised with the addition of an abundance of new data, the removal of all out-dated information, and the complete rebuilding of the product and company listings.This new edition also has been reorganized from a polymer chemistry point of view. Plastics of similar polymer types are grouped into chapters, each with an introduction that briefly explains the chemistry of the polymers used in the plastics. An extensive introductory chapter has also been added, which summarizes the chemistry of making polymers, the formulation of plastics, creep-testing, test methods, measurements, and charts, as well as theory and plastic selection.Each chapter is generally organized by product and concludes with comparisons of brand or generic products. The appendices include a list of trade names, plastics sold under those names, and manufacturer. A list of conversion factors for stress measures is also included.ABOUT THE AUTHORLaurence W. McKeen earned a B.S. in Chemistry from Rensselaer Polytechnic Institute in 1973 and a Ph.D. in 1978 from the University of Wisconsin. He began his career with DuPont in 1978 as a mass spectroscopist, but moved into product development in the Teflon® Finishes group in 1980. Dr. McKeen has accumulated over 28 years of experience in product development and applications, working with customers in a wide range of industries, which has led to the creation of dozens of commercial products.

  • Sputtering Materials for VLSI and Thin Film Devices

    • 1st Edition
    • Jaydeep Sarkar
    • English
    An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. .

  • Micromanufacturing Engineering and Technology

    • 1st Edition
    • Yi Qin
    • Yi Qin
    • English
    Micromanufacturing Engineering and Technology presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering. It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with an analysis of future potential. The machining, forming, and joining of miniature / micro-products are all covered in depth, covering: grinding/milling, laser applications, and photo chemical etching; embossing (hot & UV), injection molding and forming (bulk, sheet, hydro, laser); mechanical assembly, laser joining, soldering, and packaging.

  • Rotational Molding Technology

    • 1st Edition
    • R.J. Crawford + 1 more
    • English
    This book clarifies and quantifies many of the technical interactions in the process. It distinguishes itself from other books on the subject by being a seamless story of the advanced aspects of the rotational molding process. There are seven chapters within the book. The US market for rotational molding products was one billion pounds in the year 2000. The growth of the rotational molding industry has grown at 10 to 15% per year. With this growth has come an increasing need for details on the complex, technical aspects of the process.

  • Handbook of Physical Vapor Deposition (PVD) Processing

    • 2nd Edition
    • Donald M. Mattox
    • English
    This updated version of the popular handbook further explains all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the new edition remains on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications, with additional information to support the original material. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called "war stories", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.

  • Handbook of Silicon Based MEMS Materials and Technologies

    • 1st Edition
    • Markku Tilli + 6 more
    • English
    A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.

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