Thermoforming of Single and Multilayer Laminates explains the fundamentals of lamination and plastics thermoforming technologies along with current and new developments. It focuses on properties and thermoforming mechanics of plastic films and in particular single and multilayered laminates, including barrier films. For environmental and economic reasons, laminates are becoming increasingly important as a replacement for solid sheets and paint finishes in many industries, including transportation, packaging, and construction. Yet the processes of film formability during the extensive deformation and elevated temperatures experienced in conventional processing technologies, such as thermoforming, are poorly understood by most engineers. This book covers production processes, such as extrusion, calendaring, and casting, as well as mechanical and impact testing methods. It also describes how testing protocols developed for metals can be leveraged for plastic films and laminates, and includes a thorough discussion on methods for performing optical strain analysis. Applications in transportation vehicles and packaging, including packaging for food, medical and electronics applications, sports equipment, and household appliances, are discussed. Safety, recycling and environmental aspects of thermoforming and its products complete the book.
Surface Modification by Solid State Processing describes friction-based surfacing techniques for surface modification to improve resistance to corrosion and wear, also changing surface chemistry. Surface conditions are increasingly demanding in industrial applications and surface modification can reduce manufacturing and maintenance costs, leading to improved component performance, reliability and lifetime. Friction-based technologies are promising solid state processing technologies, particularly for light alloys, in the manufacturing of composite surface and functionally graded materials This title is divided into five chapters, and after an introduction the book covers friction surfacing; friction stir processing; surface reinforcements of light alloys; and characterization techniques based on eddy currents.
Aimed at engineers and materials scientists in a wide range of sectors, this book is a unique source of surface preparation principles and techniques for plastics, thermosets, elastomers, ceramics and metals bonding. With emphasis on the practical, it draws together the technical principles of surface science and surface treatments technologies to enable practitioners to improve existing surface preparation processes to improve adhesion and, as a result, enhance product life. This book describes and illustrates the surface preparations and operations that must be applied to a surface before acceptable adhesive bonding is achieved. It is meant to be an exhaustive overview, including more detailed explanation where necessary, in a continuous and logical progression. The book provides a necessary grounding in the science and practice of adhesion, without which adequate surface preparation is impossible. Surface characterization techniques are included, as is an up-to-date assessment of existing surface treatment technologies such as Atmospheric Plasma, Degreasing, Grit blasting, laser ablation and more. Fundamental material considerations are prioritised over specific applications, making this book relevant to all industries using adhesives, such as medical, automotive, aerospace, packaging and electronics. This second edition represents a full and detailed update, with all major developments in the field included and three chapters added to cover ceramic surface treatment, plasma treatment of non-metallic materials, and the effect of additives on surface properties of plastics.
In this series Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. The expert contributions in this volume cover important fundamental aspects of surface contamination that are key to understanding the behavior of specific types of contaminants. This understanding is essential to develop preventative and mitigation methods for contamination control. The coverage complements the treatment of surface contamination in vol.1, Fundamental and Applied Aspects. This volume covers: Sources and Generation of Particles; Manipulation Techniques for Particles on Surfaces; Particle Deposition and Rebound; Particle Behavior in Liquid Systems; Biological and Metallic Contamination; and includes a comprehensive list of current standards and resources.
In this series, Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or dealing with the consequences of surface contamination. This volume complements Volumes 3 and 4 of this series, which focused largely on particulate contaminants. The expert contributions in this volume cover methods for removal of non-particulate contaminants, such as metallic and non-metallic thin films, hydrocarbons, toxic and hazardous chemicals, and microbiological substances, as well as contamination monitoring in pharmaceutical manufacturing, and an innovative method for characterization at the nanoscale.
Surface Preparation Techniques for Adhesive Bonding is an essential guide for materials scientists, mechanical engineers, plastics engineers, scientists and researchers in manufacturing environments making use of adhesives technology. Wegman and van Twisk provide practical coverage of a topic that receives only cursory treatment in more general books on adhesives, making this book essential reading for adhesion specialists, plastics engineers, and a wide range of engineers and scientists working in sectors where adhesion is an important technology, e.g. automotive / aerospace, medical devices, electronics. Wegman and van Twisk provide a wealth of practical information on the processing of substrate surfaces prior to adhesive bonding. The processing of aluminum and its alloys, titanium and its alloys, steels, copper and its alloys, and magnesium are treated in the form of detailed specifications with comparative data. Other metals not requiring extensive treatment are also covered in detail, as are metal matrix and organic matrix composites, thermosets and thermoplastics. This new edition has been updated with coverage of the latest developments in the field including the sol-gel process for aluminum, titanium, and stainless steel, atmospheric plasma treatment for metals, plastics and rubbers and treatments for bronze and nickel alloys.
The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.
In this series Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. The expert contributions in this volume cover important fundamental aspects of surface contamination that are key to understanding the behavior of specific types of contaminants. This understanding is essential to develop preventative and mitigation methods for contamination control. The coverage complements the treatment of surface contamination in vol.1, Fundamental and Applied Aspects. This volume covers: Sources and Generation of Particles; Manipulation Techniques for Particles on Surfaces; Particle Deposition and Rebound; Particle Behavior in Liquid Systems; Biological and Metallic Contamination; and includes a comprehensive list of current standards and resources.
The contributions in this volume cover methods for removal of particle contaminants on surfaces. Several of these methods are well established and have been employed in industrial applications for a long time. However, the ever- higher demand for removal of smaller particles on newer substrate materials is driving continuous development of the established cleaning methods and alternative innovative methods for particle removal. This book provides information on the latest developments in this topic area.