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Elsevier

Books in Engineering and technology

The Engineering and Technology portfolio includes comprehensive overviews of all major research and practical developments in aerospace and automotive engineering, civil and environmental engineering, mechanical and industrial engineering, materials engineering, electrical engineering, communications engineering, and more. In-depth coverage, innovative state-of-the-art approaches, and real-world case studies provide valuable, actionable insights for researchers, applied engineers and students. The content in Elsevier's Engineering and Technology books program addresses core issues in industry and society, such as sustainability, the circular economy, AI, and automation.

  • The Theory and Practice of Worm Gear Drives

    • 1st Edition
    • Ilés Dudás
    • English
    Worm gears are special gears that resemble screws, and can be used to drive other gears. Worm gears, enable two non-touching shafts in a machine to mesh (join) together. This publication, unique in that it combines both theoretical and practical design aspects, including the latest results of research and development, provides detailed treatment of the theory and production of worm drives, as well as the overarching subject of production geometry of helicoidal surfaces.Included are mathematical models for a number of practical applications; a description of dressing equipment required; treatment of inspection and measurement; the use of intelligent systems; worm gearing for power transmission; selection criteria.

  • Underwater Repair Technology

    • 1st Edition
    • J Nixon
    • English
    This book provides an overview of the techniques available to the offshore industry for the joining and repair of offshore structures. The last few years have seen many developments in underwater engineering technology where a wide range of welding techniques, and the necessary associated equipment, are now available for underwater joining procedures in the offshore industry.The extraction of hydrocarbons from offshore reserves is now a worldwide industry, with activity on every continent. There are huge steel and concrete structures standing in 200 metres of water, with more innovative designs, such as tethered platforms capable of operating in deeper waters, and with 1000 metre reserves currently being considered. New materials – stainless steels, duplex stainless steels, aluminium, Monel, coated materials, and non-metallic materials such as reinforced plastics are beginning to be used in significant quantities. Joining and inspection techniques have been greatly developed, and new design concepts have been brought into use.Concentrating on repair technology the author presents a survey of the techniques available for the fabrication, repair and modification of structures underwater. His book is an important reference for those working in the international offshore engineering industry, and will also be of value to universities and training establishments offering courses on marine technology.

  • Advances in Imaging and Electron Physics

    • 1st Edition
    • Volume 113
    • Peter W. Hawkes
    • English
    Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics & Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

  • Microcontroller Projects in C for the 8051

    • 1st Edition
    • Dogan Ibrahim
    • English
    This book is a thoroughly practical way to explore the 8051 and discover C programming through project work. Through graded projects, Dogan Ibrahim introduces the reader to the fundamentals of microelectronics, the 8051 family, programming in C, and the use of a C compiler. The specific device used for examples is the AT89C2051 - a small, economical chip with re-writable memory, readily available from the major component suppliers. A working knowledge of microcontrollers, and how to program them, is essential for all students of electronics. In this rapidly expanding field many students and professionals at all levels need to get up to speed with practical microcontroller applications. Their rapid fall in price has made microcontrollers the most exciting and accessible new development in electronics for years - rendering them equally popular with engineers, electronics hobbyists and teachers looking for a fresh range of projects. Microcontroller Projects in C for the 8051 is an ideal resource for self-study as well as providing an interesting, enjoyable and easily mastered alternative to more theoretical textbooks.

  • Valve Radio and Audio Repair Handbook

    • 1st Edition
    • CHAS MILLER
    • English
    Valve Radio and Audio Repair Handbook is not only an essential read for every professional working with antique radio and gramophone equipment, but also dealers, collectors and valve technology enthusiasts the world over. The emphasis is firmly on the practicalities of repairing and restoring, so technical content is kept to a minimum, and always explained in a way that can be followed by readers with no background in electronics. Those who have a good grounding in electronics, but wish to learn more about the practical aspects, will benefit from the emphasis given to hands-on repair work, covering mechanical as well as electrical aspects of servicing. Repair techniques are also illustrated throughout. This book is an expanded and updated version of Chas Miller's classic Practical Handbook of Valve Radio Repair. Full coverage of valve amplifiers will add to its appeal to all audio enthusiasts who appreciate the sound quality of valve equipment.

  • Newnes Workshop Engineer's Pocket Book

    • 1st Edition
    • Roger Timings
    • English
    This Pocket Book is a unique compilation of all the tables, data, techniques, formulae and rules of thumb needed by mechanical engineers in the workshop, at work or at home. With content covering areas such as: workshop calculations and conversion tables; cutting tools; engineering materials; soldering fluxes, and O-rings, it will prove to be an essential tool for technicians, students, model engineers and DIY enthusiasts alike. British Standards are used and referenced throughout.Roger Timings has drawn on his unique practical experience as an engineer, lecturer, author and model engineer to select and bring together the information needed for practical workshop-based engineering. Most of the material in this book has been drawn from his definitive reference work Newnes Mechanical Engineer's Pocket Book, but it has been redrawn and redesigned for ease of reference in the workshop.With Newnes Workshop Engineer's Pocket Book, those undertaking workshop-based engineering projects now have all the key facts, figures, data and tables they need, together in one handy reference guide.

  • Encapsulation Technologies for Electronic Applications

    • 1st Edition
    • Haleh Ardebili + 1 more
    • English
    Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-s... (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packagin... (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechan... systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

  • Hot Embossing

    Theory and Technology of Microreplication
    • 1st Edition
    • Matthias Worgull
    • English
    This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to revolutionize a wide range of medical and industrial processes over the coming decade.The hot embossing process for replicating microstructures was developed by the Forschungszentrum Karlsruhe (Karlsruhe Institute of Technology) where the author is head of the Nanoreplication Group. Worgull fills a gap in existing information by fully detailing the technology and techniques of hot embossing. He also covers nanoimprinting, a process related to hot embossing, with examples of actual research topics and new applications in nanoreplication.

  • Rotational Molding Technology

    • 1st Edition
    • R.J. Crawford + 1 more
    • English
    This book clarifies and quantifies many of the technical interactions in the process. It distinguishes itself from other books on the subject by being a seamless story of the advanced aspects of the rotational molding process. There are seven chapters within the book. The US market for rotational molding products was one billion pounds in the year 2000. The growth of the rotational molding industry has grown at 10 to 15% per year. With this growth has come an increasing need for details on the complex, technical aspects of the process.

  • The Effect of Creep and Other Time Related Factors on Plastics and Elastomers

    • 2nd Edition
    • Laurence W. McKeen
    • English
    The second edition of the classic data book, The Effect of Creep and Other Time Related Factors on Plastics and Elastomers (originally published in 1991), has been extensively revised with the addition of an abundance of new data, the removal of all out-dated information, and the complete rebuilding of the product and company listings.This new edition also has been reorganized from a polymer chemistry point of view. Plastics of similar polymer types are grouped into chapters, each with an introduction that briefly explains the chemistry of the polymers used in the plastics. An extensive introductory chapter has also been added, which summarizes the chemistry of making polymers, the formulation of plastics, creep-testing, test methods, measurements, and charts, as well as theory and plastic selection.Each chapter is generally organized by product and concludes with comparisons of brand or generic products. The appendices include a list of trade names, plastics sold under those names, and manufacturer. A list of conversion factors for stress measures is also included.ABOUT THE AUTHORLaurence W. McKeen earned a B.S. in Chemistry from Rensselaer Polytechnic Institute in 1973 and a Ph.D. in 1978 from the University of Wisconsin. He began his career with DuPont in 1978 as a mass spectroscopist, but moved into product development in the Teflon® Finishes group in 1980. Dr. McKeen has accumulated over 28 years of experience in product development and applications, working with customers in a wide range of industries, which has led to the creation of dozens of commercial products.

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