Micromanufacturing Engineering and Technology, Third Edition covers the major themes in micromanufacturing and the latest developments from industry and academia. Theory and manufacturing processes are addressed, as well as a wide range of practical aspects of micro-manufacturing engineering and utilization, such as design, modeling, materials, tools and equipment issues, automation and manufacturing systems. This fully updated edition features new material on micro-machining, Focused-Ion-Beam machining, laser-machining, micro-forming, micro-EDM, micro-ECM, Deep X-Ray Lithography, hot-embossing, micro-injection moulding, micro-sintering, inkjet technology, 3D printing and additive micro-manufacturing, and much more.Edited by one of the few world-experts in this relatively new, but rapidly-expanding area and presenting chapters written by a 50-strong team of leading industry specialists, academics and researchers, this book is an invaluable source of information for engineers, R&D researchers and academics.
Microsupercapacitors systematically guides the reader through the key materials, characterization techniques, performance factors and potential applications and benefits to society of this emerging electrical energy storage solution. The book reviews the technical challenges in scaling down supercapacitors, covering materials, performance, design and applications perspectives. Sections provide a fundamental understanding of microsupercapacitors and compare them to existing energy storage technologies. Final discussions consider the factors that impact performance, potential tactics to improve performance, barriers to implementation, emerging solutions to those barriers, and a future outlook. This book will be of particular interest to materials scientists and engineers working in academia, research and development.
Switchmode RF and Microwave Power Amplifiers, Third Edition is an essential reference book on developing RF and microwave switchmode power amplifiers. The book combines theoretical discussions with practical examples, allowing readers to design high-efficiency RF and microwave power amplifiers on different types of bipolar and field-effect transistors, design any type of high-efficiency switchmode power amplifiers operating in Class D or E at lower frequencies and in Class E or F and their subclasses at microwave frequencies with specified output power, also providing techniques on how to design multiband and broadband Doherty amplifiers using different bandwidth extension techniques and implementation technologies. This book provides the necessary information to understand the theory and practical implementation of load-network design techniques based on lumped and transmission-line elements. It brings a unique focus on switchmode RF and microwave power amplifiers that are widely used in cellular/wireless, satellite and radar communication systems which offer major power consumption savings.
Embedded RTOS Design: Insights and Implementation combines explanations of RTOS concepts with detailed, practical implementation. It gives a detailed description of the implementation of a basic real-time kernel designed to be limited in scope and simple to understand, which could be used for a real design of modest complexity. The kernel features upward-compatibility to a commercial real-time operating system: Nucleus RTOS. Code is provided which can be used without restriction. Gain practical information on: Scheduling, preemption, and interrupts Information flow (queues, semaphores, etc.) and how they work Signaling between tasks (signals, events, etc.) Memory management (Where does each task get its stack from? What happens if the stack overflows?) The CPU context: storage and retrieval after a context switch With this book you will be able to: Utilize a basic real-time kernel to develop your own prototype Design RTOS features Understand the facilities of a commercial RTOS
ARM-based Microcontroller Projects Using mbed gives readers a good understanding of the basic architecture and programming of ARM-based microcontrollers using ARM’s mbed software. The book presents the technology through a project-based approach with clearly structured sections that enable readers to use or modify them for their application. Sections include: Project title, Description of the project, Aim of the project, Block diagram of the project, Circuit diagram of the project, Construction of the project, Program listing, and a Suggestions for expansion. This book will be a valuable resource for professional engineers, students and researchers in computer engineering, computer science, automatic control engineering and mechatronics.
The considerable growth of RFID is currently accompanied by the development of numerous identification technologies that complement those already available while seeking to answer new problems. Chipless RFID is one example.The goal is to both significantly reduce the price of the tag and increase the amount of information it contains, in order to compete with the barcode while retaining the benefits of a flexible reading approach based on radio communication.To solve the problem of the number of bits, this book describes the possibility of coding the information at the level of the overall shape of the RCS of the tag, which would facilitate reaching very large quantities. The design of the tags then returns to the resolution of the inverse problem of the electromagnetic signature. The proposed design methodology regularizes the problem by decomposing the signature on a basis of elementary patterns whose signature is chosen in advance.
Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent.Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography.This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization.
Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment.
Micromanufacturing Engineering and Technology, Second Edition, covers the major topics of micro-manufacturing. The book not only covers theory and manufacturing processes, but it uniquely focuses on a broader range of practical aspects of micro-manufacturing engineering and utilization by also covering materials, tools and equipment, manufacturing system issues, control aspects and case studies. By explaining material selection, design considerations and economic aspects, the book empowers engineers in choosing among competing technologies. With a focus on low-cost and high-volume micro-manufacturing processes, the updated title covers technologies such as micro-mechanical-cutting, laser-machining, micro-forming, micro-EDM, micro-ECM, hot-embossing, micro-injection molding, laser micro-sintering, thin film fabrication, inkjet technology, micro-joining, multiple processes machines, and more. Edited by one of the few world-experts in this relatively new, but rapidly-expanding area and presenting chapters written by a 40-strong team of leading industry specialists, this book is an invaluable source of information for engineers, R&D researchers and academics.
Silicon-On-Insulator (SOI) Technology: Manufacture and Applications covers SOI transistors and circuits, manufacture, and reliability. The book also looks at applications such as memory, power devices, and photonics. The book is divided into two parts; part one covers SOI materials and manufacture, while part two covers SOI devices and applications. The book begins with chapters that introduce techniques for manufacturing SOI wafer technology, the electrical properties of advanced SOI materials, and modeling short-channel SOI semiconductor transistors. Both partially depleted and fully depleted SOI technologies are considered. Chapters 6 and 7 concern junctionless and fin-on-oxide field effect transistors. The challenges of variability and electrostatic discharge in CMOS devices are also addressed. Part two covers recent and established technologies. These include SOI transistors for radio frequency applications, SOI CMOS circuits for ultralow-power applications, and improving device performance by using 3D integration of SOI integrated circuits. Finally, chapters 13 and 14 consider SOI technology for photonic integrated circuits and for micro-electromechanical systems and nano-electromechanical sensors. The extensive coverage provided by Silicon-On-Insulator (SOI) Technology makes the book a central resource for those working in the semiconductor industry, for circuit design engineers, and for academics. It is also important for electrical engineers in the automotive and consumer electronics sectors.