Formerly known as Materials Science and Engineering: C, with a 2022 IF of 7.9.Biomaterials Advances includes topics at the interface of the biomedical sciences and materials engineering. These topics include: Bioinspired and biomimetic materials for medical applicationsMaterials of biological origin for medical applicationsMaterials for "active" medical applicationsSelf-assembling and self-healing materials for medical applications"Smart" (i.e., stimulus-response) materials for medical applicationsCeramic, metallic, polymeric, and composite materials for medical applicationsMaterials for in vivo sensingMaterials for in vivo imagingMaterials for delivery of pharmacologic agents and vaccinesNovel approaches for characterizing and modeling materials for medical applicationsManuscripts on biological topics without a materials science component, or manuscripts on materials science without biological applications, will not be considered for publication in Biomaterials Advances. New submissions are first assessed for language, scope and originality (plagiarism check) and can be desk rejected before review if they need English language improvements, are out of scope or present excessive duplication with published sources.Biomaterials Advances sits within Elsevier's biomaterials science portfolio alongside Biomaterials, Materials Today Bio and Biomaterials and Biosystems. As part of the broader Materials Today family, Biomaterials Advances offers authors rigorous peer review, rapid decisions, and high visibility. We look forward to receiving your submissions!
As of 2007 no longer published by ElsevierIII-Vs Reviewis published 9 times a year and brings you all the inside views, news and analysis of the latest developments with up-to-the minute information on the markets and business.III-Vs Review covers all segments of the advanced semiconductor industry including: II-VI's, IV-IV's, electronic and optoelectronic applications.Our unrivalled network of contacts in all the key players in industry, ensures that III-V's Review has no equal in reporting the issues that will shape the future in the field.FREE to all subscribers - the Advanced Semiconductor's Buyers' Guide. Produced in conjunction with Semiconductor International, the buyers' guide is a fully comprehensive and fully referenced guide to companies supplying the advanced semiconductor industry.The Advanced Semiconductor's Buyers' Guide comes free as part of your subscription to III-Vs magazine.
Published by the ISAISA Transactions is a journal of advances and state-of-the-art in the science and engineering of measurement and automation, of value to leading-edge industrial practitioners and applied researchers.The topics of measurement include: sensors, perception systems, analyzers, signal processing, filtering, data compression, data rectification, fault detection, inferential measurement, soft sensors, hardware interfacing, etc.; and any of the techniques that support them such as artificial intelligence, fuzzy logic, communication systems, and process analysis. The topics of automation include: statistical and deterministic strategies for discrete event and continuous process control, modelling and simulation, event triggers, scheduling and sequencing, system reliability, quality, maintenance, management, loss prevention, etc.; and any equipment, techniques and best practices that support them such as optimization, learning systems, strategy development, security, and human interfacing and training.The intended audience is research and development personnel from academe and industry in the fields of control systems, process instrumentation, systems, and automation.The journal seeks to bridge the theory and practice gap. This balance of interests requires simplicity of technique, credible demonstration, fundamental grounding, and connectivity to the state of the art in both theory and practice.If you would like more information please visit the ISA Transactions society homepageBenefits to authors We also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our Support Center
The Science of Intelligent Machines An International JournalMission and ScopeA journal of IFAC, the International Federation of Automatic ControlWelcome to Mechatronics: The Science of Intelligent Machines. Mechatronics is a refereed journal that publishes articles that report advances in the state-of-the-art in Mechatronics and Robotics. We welcome original submissions that report creative or innovative methodology and solutions with a synergistic combination of mechanical engineering, electrical and electronic engineering, and control systems of intelligent machines or robotic systems. Submitted manuscripts are expected to report experimental results obtained from laboratory or full-scale mechatronic apparatus. Some of the topics addressed in the published articles include:Mechatronics: Modeling, identification and control of mechatronic systems; motion and vibration control; micro/nano systems and devices; automotive systems; biomedical mechatronic systems; and advanced manufacturing equipment and processes.Robotics: Modeling, control, learning and system issues related to: autonomous vehicles and robots, marine, underwater, and aerial robots, legged robots, soft robots, field robots, industrial robots, medical robots; human-robot interaction; teleoperation; haptics; and multi-robot systems.Types of papersRegular Articles: Articles that describe original research of high quality in Mechatronics or in Robotics.Review Articles: Contain a detailed survey of established or emerging topics of interest to the journal readership.Robotics and Mechatronics Letters: Short manuscripts, no longer than seven printed journal pages, that report important time sensitive results in Robotics or in Mechatronics. These articles will go through a rapid review process overseen by a dedicated Co-Editor-in- Chief.Book Reviews: A detailed review of published textbooks or research monographs of interest to Mechatronics' readership.
Nanotechnology and Processing — Electronics, photonics, MEMS and Life Sciences Affiliated with iMNEsMicroelectronic Engineering is the premier journal focused on the fabrication and characterization of micro/nano-electronic materials, devices and circuits (including novel electronic nanomaterials), as well as the understanding of their working mechanisms, performance, yield, variability, stability, and reliability. The journal also focuses on the techniques that make possible the fabrication and characterization of such devices and circuits, and on the materials involved in them. Occasionally, outstanding papers on simulation of materials properties, device figures-of-merit or compact modeling of circuits and systems may be accepted. The following topics are of special interest:DevicesPhotonic and optoelectronic devices (including, sensors, actuators, phototransistors)Transistors (including ultra-scaled, thin film, organic, ferroelectric)Resistive switching devices (memristors, RRAM, PCRAM, FeRAM, MRAM)Magnetic and spintronic devicesMEMS and NEMS (including power, RF, magnetic, organic)Flexible electronic devices (including wearable, printed, paper)Devices for energy harvesting (piezoelectric, flexoelectric, photovoltaic, solar cells)Bioelectronic devices (molecular detection, biomimetic, diagnosis)Device-level simulations (including variability and reliability)MaterialsWide bandgap semiconductorsDielectrics (low K and high K)Two-dimensional (2D) Materials and related transferring techniquesNanotubes, nanowires, and other nanomaterials and nanostrctures for device fabricationInterconnects, metallization and barrier materialsNew Resist MaterialsSilicon on insulatorsPolymers and flexible substrates, including biocompatible materialsAtomistic simulations of materials propertiesFabrication and characterization processesThin films deposition techniques (CVD, ALD, evaporation, sputtering, MBE, plasma)Lithography (including optical, EUV, electron beam, nanoimpring, particle-assisted, mask less, X-ray optical methods, emerging methods and limits, as well as resists)Pattern transfer (including ion, plasma and wet transfer, as well as transfer of 2D materials)Integration processes (including inkjet printing, 3D printing, 3D integration)Top-down and bottom-up self-assembly processesAnnealing and its effect in the materials (including crystallization, wrinkling, de-wetting)Nanometrology (TEM, SEM, EDX, EELS, STM, AFM and related setups)Circuits and applicationsSensing and actuation, including bio-compatible applicationsSignal souring and transferLogic operations and data processingElectronic memories and information storageArtificial neural networks and neuromorphic computingCompact modeling of electronic circuitsQuantum computingFive different types of articles are considered:Research articles that report regular original research that produces significant advancement.Accelerated Publications (Letters) that feature exciting research breakthroughs.Review Articles that inform readers of the latest research and advances in a topic within the broad field of microelectronic engineering. This includes roadmaps and guides proposing the recommended methods in a specific field.Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development workNews and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers microelectronics device, circuits and systems. This topic includes but is not limited to• Analog, digital, mixed, and RF integrated circuits and related design methodologies • Semiconductor memory, such as RRAM, MRAM, FLASH, PCRAM , etc • Microelectronic devices , modeling and device physics • Semiconductor optoelectronic devices and integrated technology • Wide band gap semiconductor materials, devices and circuits • TSV, TGV, 3D-ICs, SIP and related technology • Integrated circuit design automation technology ( EDA ) • SOC, NoC design, analysis and test • Artificial intelligence integrated circuits and design methodology • Testing, design for testability (DFT), built-in self-test for integrated circuits • Integrated circuit hardware security • Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, TFET, NC-FET ,etc.Benefits to authors We provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications, and much more. Please click here for more information on our author services.Please see our Guide for Authors for information on article submission. If you require any further information or assistance, see our support pages at https://service.elsevier.com
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. All contributions are subject to peer review by leading experts in the field. Special issues are devoted to significant international conferences, or to important developing topics.Microelectronics Reliability is an indispensable forum for the exchange of knowledge and experience between microelectronics reliability professionals from both academic and industrial environments, and all those associated in any way with a steadily growing microelectronics industry and its many fields of application.
Embedded Hardware Design Affiliated with EuromicroMicroprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC).Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.
Optics and Lasers in Engineering aims at providing an international forum for the interchange of information on the development of optical techniques and laser technology in engineering. Emphasis is placed on contributions targeted at the practical use of methods and devices, the development and enhancement of solutions and new theoretical concepts for experimental methods.Optics and Lasers in Engineering reflects the main areas in which optical methods are being used and developed for an engineering environment. Manuscripts should offer clear evidence of novelty and significance. Papers focusing on parameter optimization or computational issues are not suitable. Similarly, papers focussed on an application rather than the optical method fall outside the journal's scope. The scope of the journal is defined to include the following:Optical Metrology Optical Methods for 3D visualization and virtual engineering Optical Techniques for Microsystems Imaging, Microscopy and Adaptive Optics Computational Imaging Laser methods in manufacturing Integrated optical and photonic sensors Optics and Photonics in Life Science Hyperspectral and spectroscopic methods Infrared and Terahertz techniques
An international journal devoted to research and development of physical transducersSensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.• Thermal sensors, such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperature transducers, PTAT circuits, thermocouples, thermopiles, pyroelectric thermometers, quartz thermometers, power transistors and thick-film thermal print heads.• Magnetic sensors, such as: magnetoresistors, Corbino disks, magnetodiodes, Hall-effect devices, integrated Hall devices, silicon depletion-layer magnetometers, magneto-injection transistors, magnistors, lateral magnetotransistors, carrier-domain magnetometers, MOS magnetic-field sensors, solid-state read and write heads.• Micromechanics, such as: research papers on actuators, structures, integrated sensors-actuators, microsystems, and other devices or subdevices ranging in size from millimetres to sub-microns; micromechatronics; microelectromechanical systems; microoptomechanical systems; microchemomechanical systems; microrobots; silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics and materials related to micromechanics; microsystem-related problems like power supplies and signal transmission, microsystem-related simulation tools; other topics of interest to micromechanics.• Interface electronics: electronic circuits which are designed to interface directly with the above transducers and which are used for improving or complementing the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light-intensity compensation, current/frequency conversion and microcomputer interfacing.• Sensor Systems and Applications, such as: sensor buses, multiple-sensor systems, sensor networks, voting systems, telemetering, sensor arrays, and automotive, environmental, monitoring and control, consumer, medical, alarm and security, robotic, nautical, aeronautical and space measurement systems.