Microelectronic Engineering

ISSN: 0167-9317

Editor-In-Chief: Lanza

Next planned ship date: December 12, 2023

5 Year impact factor: 2.3
Impact factor: 2.3

Microelectronic Engineering is the premier journal focused on the fabrication and characterization of micro/nano-electronic materials, devices and circuits (including novel… Read more

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December 12, 2023

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Microelectronic Engineering is the premier journal focused on the fabrication and characterization of micro/nano-electronic materials, devices and circuits (including novel electronic nanomaterials), as well as the understanding of their working mechanisms, performance, yield, variability, stability, and reliability. The journal also focuses on the techniques that make possible the fabrication and characterization of such devices and circuits, and on the materials involved in them. Occasionally, outstanding papers on simulation of materials properties, device figures-of-merit or compact modeling of circuits and systems may be accepted. The following topics are of special interest: Devices

Photonic and optoelectronic devices (including, sensors, actuators, phototransistors)

Transistors (including ultra-scaled, thin film, organic, ferroelectric)

Resistive switching devices (memristors, RRAM, PCRAM, FeRAM, MRAM)

Magnetic and spintronic devices

MEMS and NEMS (including power, RF, magnetic, organic)

Flexible electronic devices (including wearable, printed, paper)

Devices for energy harvesting (piezoelectric, flexoelectric, photovoltaic, solar cells)

Bioelectronic devices (molecular detection, biomimetic, diagnosis)

Device-level simulations (including variability and reliability)

Materials

Wide bandgap semiconductors

Dielectrics (low K and high K)

Two-dimensional (2D) Materials and related transferring techniques

Nanotubes, nanowires, and other nanomaterials and nanostrctures for device fabrication

Interconnects, metallization and barrier materials

New Resist Materials

Silicon on insulators

Polymers and flexible substrates, including biocompatible materials

Atomistic simulations of materials properties

Fabrication and characterization processes

Thin films deposition techniques (CVD, ALD, evaporation, sputtering, MBE, plasma)

Lithography (including optical, EUV, electron beam, nanoimpring, particle-assisted, mask less, X-ray optical methods, emerging methods and limits, as well as resists)

Pattern transfer (including ion, plasma and wet transfer, as well as transfer of 2D materials)

Integration processes (including inkjet printing, 3D printing, 3D integration)

Top-down and bottom-up self-assembly processes

Annealing and its effect in the materials (including crystallization, wrinkling, de-wetting)

Nanometrology (TEM, SEM, EDX, EELS, STM, AFM and related setups)

Circuits and applications

Sensing and actuation, including bio-compatible applications

Signal souring and transfer

Logic operations and data processing

Electronic memories and information storage

Artificial neural networks and neuromorphic computing

Compact modeling of electronic circuits

Quantum computing

Five different types of articles are considered:

Research articles that report regular original research that produces significant advancement.

Accelerated Publications (Letters) that feature exciting research breakthroughs.

Review Articles that inform readers of the latest research and advances in a topic within the broad field of microelectronic engineering. This includes roadmaps and guides proposing the recommended methods in a specific field.

Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development work

News and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work