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Integrated Lasers on Silicon
- 1st Edition - July 11, 2016
- Authors: Charles Cornet, Yoan Léger, Cédric Robert
- Language: English
- Hardback ISBN:9 7 8 - 1 - 7 8 5 4 8 - 0 6 2 - 1
- eBook ISBN:9 7 8 - 0 - 0 8 - 1 0 1 0 7 6 - 1
Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for effic… Read more
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Request a sales quoteIntegrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment.
- Features a clear description of the advantages, drawbacks, and challenges of laser integration on silicon
- Serves as a staple reference in the general field of silicon photonics
- Focuses on the promising developments of hybrid and monolithic III-V lasers on silicon, previously unreviewed
- Discusses the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment
- Preface
- Introduction
- 1: Laser Integration Challenges
- Abstract:
- 1.1 Evolution of microprocessor technologies
- 1.2 Photonic integration schemes
- 1.3 Semiconductor lasers
- 2: Group IV Silicon Lasers
- Abstract:
- 2.1 Group IV silicon lasers: issues
- 2.2 Emission from bulk silicon
- 2.3 Using quantum confinement
- 2.4 Raman scattering for lasing
- 2.5 Rare-earth doping
- 2.6 Group IV SiGeSn alloys for lasing
- 3: III–V Lasers Bonded on Si
- Abstract:
- 3.1 Introduction
- 3.2 Historical flip-chip bonding technology: advantages and drawbacks
- 3.3 Die versus wafer bonding
- 3.4 Basic principles of wafer bonding
- 3.5 Basic principles of transfer printing
- 3.6 Device structures and performances of III–V lasers coupled to SOI waveguides
- 3.7 Conclusion
- 4: Monolithic III–V Lasers on Silicon
- Abstract:
- 4.1 The monolithic integration: issues and strategies
- 4.2 Monolithic devices
- 5: Laser Architectures for On-chip Information Technologies
- Abstract:
- 5.1 The role of integrated lasers in hybrid photonic–electronic chips
- 5.2 Laser designs for on-chip routing
- 5.3 Concluding remarks
- Conclusion
- Bibliography
- Index
- No. of pages: 178
- Language: English
- Edition: 1
- Published: July 11, 2016
- Imprint: ISTE Press - Elsevier
- Hardback ISBN: 9781785480621
- eBook ISBN: 9780081010761
CC
Charles Cornet
YL
Yoan Léger
Dr. Léger is the co-author of 60 publications, counting more than 1100 citations. He is a reviewer for Nature publishing group, the Optical Society and the American Physical Society.
CR