Books in Engineering and technology

The Engineering and Technology portfolio includes comprehensive overviews of all major research and practical developments in aerospace and automotive engineering, civil and environmental engineering, mechanical and industrial engineering, materials engineering, electrical engineering, communications engineering, and more. In-depth coverage, innovative state-of-the-art approaches, and real-world case studies provide valuable, actionable insights for researchers, applied engineers and students. The content in Elsevier's Engineering and Technology books program addresses core issues in industry and society, such as sustainability, the circular economy, AI, and automation.

Books Journals

Sputtering Materials for VLSI and Thin Film Devices

1st Edition
April 1, 2000
Jaydeep Sarkar
English
Hardback
9 7 8 0 8 1 5 5 1 5 9 3 7

An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. .

Handbook of Silicon Based MEMS Materials and Technologies

1st Edition
April 1, 2000
Markku Tilli + 6 more
English
eBook
9 7 8 0 8 1 5 5 1 9 8 8 1

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.

Principles of Modern Grinding Technology

1st Edition
April 1, 2000
W. Brian Rowe
English
eBook
9 7 8 0 8 1 5 5 2 0 1 9 1

The book is aimed at practitioners, engineers, researchers, students and teachers. The approach is direct, concise and authoritative. Progressing through each major element of the grinding system and then on to machine developments and process control, the reader becomes aware of all aspects of operation and design. Trends are described demonstrating key features. Coverage includes abrasives and super-abrasives, wheel design, dressing technology, machine accuracy and productivity, grinding machine design, high-speed grinding technology, cost optimization, ultra-precision grinding, process control developments, vibration control, coolants and fluid delivery.

Multilayer Flexible Packaging

1st Edition
April 1, 2000
John R. Wagner Jr.
John R. Wagner Jr.
English
eBook
9 7 8 0 8 1 5 5 2 0 2 2 1

A comprehensive and highly practical survey of the materials, hardware, processes and applications of flexible plastic films. Aimed at a wide audience of engineers, technicians, managers, purchasing agents and users, Multilayer Flexible Packaging provides a thorough introduction to the manufacturing and applications of flexible plastic films, covering: Materials Hardware and Processes Multilayer film designs and applications The materials coverage includes detailed sections on polyethylene, polypropylene and additives. The dies used to produce multilayer films are explored in the hardware section, and the process engineering of film manufacture explained, with a particular focus on meeting specifications and targets. The section includes unique coverage of the problematic area of bending technology, providing a unique explanation of the issues involved in the blending of viscoelastic non-Newtonian polymeric materials. About the author John R. Wagner, Jr. is President of Crescent Associates, Inc., a consulting firm that specializes in plastic films and flexible packaging. He graduated from the University of Notre Dame with a BS and MS in Chemical Engineering.

Plastics in Medical Devices

1st Edition
April 1, 2000
Vinny R. Sastri
English
eBook
9 7 8 0 8 1 5 5 2 0 2 8 3

No book has been published that gives a detailed description of all the types of plastic materials used in medical devices, the unique requirements that the materials need to comply with and the ways standard plastics can be modified to meet such needs. This book will start with an introduction to medical devices, their classification and some of the regulations (both US and global) that affect their design, production and sale. A couple of chapters will focus on all the requirements that plastics need to meet for medical device applications. The subsequent chapters describe the various types of plastic materials, their properties profiles, the advantages and disadvantages for medical device applications, the techniques by which their properties can be enhanced, and real-world examples of their use. Comparative tables will allow readers to find the right classes of materials suitable for their applications or new product development needs.

Handbook of Deposition Technologies for Films and Coatings

3rd Edition
April 1, 2000
Peter M. Martin
English
eBook
9 7 8 0 8 1 5 5 2 0 3 2 0

This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.

Handbook of Physical Vapor Deposition (PVD) Processing

2nd Edition
April 1, 2000
Donald M. Mattox
English
Hardback
9 7 8 0 8 1 5 5 2 0 3 7 5
eBook
9 7 8 0 8 1 5 5 2 0 3 8 2

This updated version of the popular handbook further explains all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the new edition remains on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications, with additional information to support the original material. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called "war stories", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.

Rotational Molding Technology

1st Edition
April 1, 2000
R.J. Crawford + 1 more
English
Hardback
9 7 8 1 8 8 4 2 0 7 8 5 3
eBook
9 7 8 0 8 1 5 5 1 8 9 3 8

This book clarifies and quantifies many of the technical interactions in the process. It distinguishes itself from other books on the subject by being a seamless story of the advanced aspects of the rotational molding process. There are seven chapters within the book. The US market for rotational molding products was one billion pounds in the year 2000. The growth of the rotational molding industry has grown at 10 to 15% per year. With this growth has come an increasing need for details on the complex, technical aspects of the process.

Non-Destructive Testing in Civil Engineering 2000

1st Edition
March 31, 2000
T. Uomoto
English
Hardback
9 7 8 0 0 8 0 4 3 7 1 7 0
eBook
9 7 8 0 0 8 0 5 4 5 3 5 6

The first international symposium on NDT-CE (Non-Destructive Testing in Civil Engineering) was held in Berlin, Germany in 1991. Successive symposia were held throughout Europe until 1997. This, the 5th symposium is organized as SEIKEN SYMPOSIUM No. 26, and is sponsored by the Institute of Industrial Science, at the University of Tokyo, Japan. Original objectives of the NDT-CE symposium have been to provide an opportunity for discussing current issues and future perspectives of NDT and for promoting mutual understanding among engineers and researchers. Asia is one of the key regions for further development in NDT and this symposium in Japan will be a good opportunity not only to exchange technical information on NDT, but to promote worldwide friendship between engineers in Asian countries and other nations of the world. This volume contains 70 papers providing the most recent research results and findings. The papers are grouped under the following areas: (1) keynote papers, (2) magnetic / electric, (3) steel structures, (4) integrated test, (5) moisture, (6) strength, (7) acoustic emission, (8) various tests, (9) ultrasonic, (10) impact echo, (11) radar, (12) quality and (13) corrosion / cover.

Bioimpedance and Bioelectricity Basics

1st Edition
March 30, 2000
Sverre Grimnes + 1 more
English
eBook
9 7 8 0 0 8 0 5 0 0 1 2 6

Bioimpedance and Bioelectricity Basics is unique in providing all the information needed to follow the interdisciplinary subjects of bioimpedance and bioelectricity without having to be a graduate student in the relevant fields. For the first time, one book offers the broadest possible introduction to all use and effects of electrical fields in tissue, dealing with the most basic chemical and physical functions of life. Very few books have covered the dielectric and electrochemical side of the subject, despite its importance; Bioimpedance and Bioelectricity Basics does. It also includes the electrical engineering concepts of network theory and the complex math needed. Up to now, there has been work done by physicists and engineers on one side, doctors and biologists on the other, this book fills the gap, providing the knowledge for both groups.

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