Books in General engineering

Developing and Managing Engineering Procedures

1st Edition
January 16, 2001
Phillip A. Cloud
English
Hardback
9 7 8 0 8 1 5 5 1 4 4 8 0
eBook
9 7 8 0 8 1 5 5 1 6 8 4 2

This book provides hands-on techniques for writing engineering procedures to achieve ISO 9000 compliance. It is designed for individuals responsible for writing these procedures in any industry. Readers will find actual examples of clearly written, compliant engineering procedures, ready to adapt to your own industry and your own particular needs and use immediately. It answers virtually all your procedure writing questions. Procedure writers will gain a general understanding of engineering documentation principles and how to apply them to their own situations. Simple diagrams and other graphics illustrate key ideas, giving a bird's-eye view of what is coming next. The intent of the book is to familiarize the reader with the essential elements and concepts of engineering procedure development and management and show how to apply these concepts to their own specific applications. The author emphasizes engineering principles and tools that are common to all engineering disciplines, with examples for their use.Step-by-step procedures shown for each document format enable readers to apply each format to their own engineering documentation programs quickly and easily. The book provides a fingertip reference that covers the entire engineering procedure process, using the latest technology for engineering documentation systems.

Micromanufacturing Engineering and Technology

1st Edition
April 1, 2000
Yi Qin
Yi Qin
English
eBook
9 7 8 0 8 1 5 5 1 9 8 0 5

Micromanufacturing Engineering and Technology presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering. It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with an analysis of future potential. The machining, forming, and joining of miniature / micro-products are all covered in depth, covering: grinding/milling, laser applications, and photo chemical etching; embossing (hot & UV), injection molding and forming (bulk, sheet, hydro, laser); mechanical assembly, laser joining, soldering, and packaging.

Encapsulation Technologies for Electronic Applications

1st Edition
April 1, 2000
Haleh Ardebili + 1 more
English
Hardback
9 7 8 0 8 1 5 5 1 5 7 6 0
eBook
9 7 8 0 8 1 5 5 1 9 7 0 6

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-s... (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packagin... (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechan... systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

Hot Embossing

1st Edition
April 1, 2000
Matthias Worgull
English
eBook
9 7 8 0 8 1 5 5 1 9 7 4 4

This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to revolutionize a wide range of medical and industrial processes over the coming decade.The hot embossing process for replicating microstructures was developed by the Forschungszentrum Karlsruhe (Karlsruhe Institute of Technology) where the author is head of the Nanoreplication Group. Worgull fills a gap in existing information by fully detailing the technology and techniques of hot embossing. He also covers nanoimprinting, a process related to hot embossing, with examples of actual research topics and new applications in nanoreplication.

Microfabrication for Industrial Applications

1st Edition
April 1, 2000
Regina Luttge
English
eBook
9 7 8 0 8 1 5 5 1 9 7 7 5

Microfabrication for Industrial Applications focuses on the industrial perspective for micro- and nanofabrication methods including large-scale manufacturing, transfer of concepts from lab to factory, process tolerance, yield, robustness, and cost. It gives a history of miniaturization, micro- and nanofabrication, and surveys industrial fields of application, illustrating fabrication processes of relevant micro and nano devices.Concerning sub-micron feature manufacture, the book explains: the philosophy of micro/ nanofabrication for integrated circuit industry; thin film deposition; (waveguide, plastic, semiconductor) material processing; packaging; interconnects; stress (e.g., thin film residual); economic; and environmental aspects.Micro/nanome... sensors and actuators are explained in depth with information on applications, materials (incl. functional polymers), methods, testing, fabrication, integration, reliability, magnetic microstructures, etc.

The Effect of Creep and Other Time Related Factors on Plastics and Elastomers

2nd Edition
April 1, 2000
Laurence W. McKeen
English
eBook
9 7 8 0 8 1 5 5 1 9 8 1 2

The second edition of the classic data book, The Effect of Creep and Other Time Related Factors on Plastics and Elastomers (originally published in 1991), has been extensively revised with the addition of an abundance of new data, the removal of all out-dated information, and the complete rebuilding of the product and company listings.This new edition also has been reorganized from a polymer chemistry point of view. Plastics of similar polymer types are grouped into chapters, each with an introduction that briefly explains the chemistry of the polymers used in the plastics. An extensive introductory chapter has also been added, which summarizes the chemistry of making polymers, the formulation of plastics, creep-testing, test methods, measurements, and charts, as well as theory and plastic selection.Each chapter is generally organized by product and concludes with comparisons of brand or generic products. The appendices include a list of trade names, plastics sold under those names, and manufacturer. A list of conversion factors for stress measures is also included.ABOUT THE AUTHORLaurence W. McKeen earned a B.S. in Chemistry from Rensselaer Polytechnic Institute in 1973 and a Ph.D. in 1978 from the University of Wisconsin. He began his career with DuPont in 1978 as a mass spectroscopist, but moved into product development in the Teflon® Finishes group in 1980. Dr. McKeen has accumulated over 28 years of experience in product development and applications, working with customers in a wide range of industries, which has led to the creation of dozens of commercial products.

Nanotechnology Environmental Health and Safety

1st Edition
April 1, 2000
Matthew Scott Hull + 1 more
Matthew Scott Hull + 1 more
English
eBook
9 7 8 0 8 1 5 5 1 9 8 2 9

This book tackles the debate over nanotechnology's environmental health and safety (EHS) by thoroughly explaining EHS issues, financial implications, foreseeable risks (i.e. exposure, dose, hazards of nanomaterials), and the implications of occupational hygiene precautions and consumer protections. Real-world case studies are included, e.g. the discussion of a leading chemical company's unusual pairing with the USA's largest environmental NGO, and an innovative program designed for small- to mid-sized businesses, which became a model approach for proactive nanotechnology EHS risk management.

Micromachining Using Electrochemical Discharge Phenomenon

1st Edition
April 1, 2000
Rolf Wuthrich + 1 more
English
eBook
9 7 8 0 8 1 5 5 1 9 8 3 6

This book explains the fundamentals of SACE, promotes the technology, and encourages researchers and engineers from industry to use it for their specific applications. Therefore, the book, after presenting in details the fundaments of SACE (in particular the Electrochemical Discharges), deals mainly with practical aspects of implementing the machining technology. The book is written so that researchers from fields other than micro-technology (e.g., from life science) will be able to build a simple machining set-up, together with his mechanical work-shop, for individual needs.

Microwave/RF Applicators and Probes for Material Heating, Sensing, and Plasma Generation

1st Edition
April 1, 2000
Mehrdad Mehdizadeh
English
eBook
9 7 8 0 8 1 5 5 1 9 8 6 7

Interactions of electromagnetic fields with materials at high frequencies have given rise to a vast array of practical applications in industry, science, medicine, and consumer markets. Applicators or probes, which are the front end of these systems, provide the field that interacts with the material. This book takes an integrated approach to the area of high frequency applicators and probes for material interactions, providing a toolkit for those who design these devices. Particular attention is given to real-world applications and the latest developments in the area. Mathematical methods are provided as design tools, and are often simplified via curve-fitting techniques that are particularly usable by handheld calculators. Useful equations and numerically solved examples, using situations encountered in practice, are supplied. Above all, this volume is a comprehensive and useful reference where the reader can find design rules and principles of high frequency applicators and probes for material processing and sensing applications. Electronic and electrical R&D engineers, physicists, university professors and students will all find this book a valuable reference. Mehrdad Mehdizadeh is with the DuPont Company, Engineering Research & Technology Division in Wilmington, Delaware. His areas of expertise include high frequency hardware and electromagnetic methods of processing, sensing, and characterization of materials. His work and innovation in industrial, scientific, and medical applications of radio frequency and microwaves has resulted in 19 US patents and a number of publications. He earned his Ph.D. and M.S. from Marquette University (1983, 1980), and a B.S. from Sharif University of Technology (1977), all in electrical engineering. Dr. Mehdizadeh is a Senior Member of the Institute of Electrical and Electronic Engineers (IEEE ), Sigma Xi (Scientific Research Society), the International Microwave Power Institute (IMPI ), and a voting member of IEEE Standard Association.

Sputtering Materials for VLSI and Thin Film Devices

1st Edition
April 1, 2000
Jaydeep Sarkar
English
Hardback
9 7 8 0 8 1 5 5 1 5 9 3 7

An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. .

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