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Elsevier

Books in Design manufacturing and testing

  • High Speed Digital Design

    Design of High Speed Interconnects and Signaling
    • 1st Edition
    • Hanqiao Zhang + 2 more
    • English
    High Speed Digital Design discusses the major factors to consider in designing a high speed digital system and how design concepts affect the functionality of the system as a whole. It will help you understand why signals act so differently on a high speed digital system, identify the various problems that may occur in the design, and research solutions to minimize their impact and address their root causes. The authors offer a strong foundation that will help you get high speed digital system designs right the first time. Taking a systems design approach, High Speed Digital Design offers a progression from fundamental to advanced concepts, starting with transmission line theory, covering core concepts as well as recent developments. It then covers the challenges of signal and power integrity, offers guidelines for channel modeling, and optimizing link circuits. Tying together concepts presented throughout the book, the authors present Intel processors and chipsets as real-world design examples.

  • Power Electronics Applied to Industrial Systems and Transports, Volume 2

    Power Converters and their Control
    • 1st Edition
    • Nicolas Patin
    • English
    This book provides a comprehensive overview of power electronic converters (DC / DC, DC / AC, AC / DC and AC / AC) conventionally used in industrial and transportation applications, specifically for the supply of electric machines with variable speed drop off window. From the perspective of design and sizing, this book presents the different functions encountered in a modular way for power electronics.Power Converters and Their Control details less traditional topics such as matrix converters and multilevel converters. This book also features a case study design of an industrial controller, which is a synthesis (except the AC / AC direct conversion) of the study subjects, including sizing associated passive components.

  • Plasma Etching Processes for Interconnect Realization in VLSI

    • 1st Edition
    • Nicolas Posseme
    • English
    This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies).

  • Reliability Prediction from Burn-In Data Fit to Reliability Models

    • 1st Edition
    • Joseph Bernstein
    • English
    This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design.

  • Linux for Embedded and Real-time Applications

    • 3rd Edition
    • Doug Abbott
    • English
    This new edition of Linux for Embedded and Real-Time Applications provides a practical introduction to the basics and the latest developments in this rapidly evolving technology. Ideal for those new to using Linux in an embedded environment, it takes a hands-on approach and covers key concepts plus specific applications. Key features include: Substantially updated to focus on a specific ARM-based single board computer (SBC) as a target for embedded application programming Includes an introduction to Android programming With this book you will learn: The basics of Open Source, Linux and the embedded space How to set up a simple system and tool chain How to use simulation for initial application testing Network, graphics and Android programming How to use some of the many Linux components and tools How to configure and build the Linux kernel, BusyBox and U-Boot bootloader

  • Analog Design and Simulation using OrCAD Capture and PSpice

    • 1st Edition
    • Dennis Fitzpatrick
    • English
    Analog Design and Simulation using OrCAD Capture and PSpice provides step-by-step instructions on how to use the Cadence/OrCAD family of Electronic Design Automation software for analog design and simulation. Organized into 22 chapters, each with exercises at the end, it explains how to start Capture and set up the project type and libraries for PSpice simulation. It also covers the use of AC analysis to calculate the frequency and phase response of a circuit and DC analysis to calculate the circuits bias point over a range of values. The book describes a parametric sweep, which involves sweeping a parameter through a range of values, along with the use of Stimulus Editor to define transient analog and digital sources. It also examines the failure of simulations due to circuit errors and missing or incorrect parameters, and discusses the use of Monte Carlo analysis to estimate the response of a circuit when device model parameters are randomly varied between specified tolerance limits according to a specified statistical distribution. Other chapters focus on the use of worst-case analysis to identify the most critical components that will affect circuit performance, how to add and create PSpice models, and how the frequency-related signal and dispersion losses of transmission lines affect the signal integrity of high-speed signals via the transmission lines. Practitioners, researchers, and those interested in using the Cadence/OrCAD professional simulation software to design and analyze electronic circuits will find the information, methods, compounds, and experiments described in this book extremely useful.

  • Digital Design (Verilog)

    An Embedded Systems Approach Using Verilog
    • 1st Edition
    • Peter J. Ashenden
    • English
    Digital Design: An Embedded Systems Approach Using Verilog provides a foundation in digital design for students in computer engineering, electrical engineering and computer science courses. It takes an up-to-date and modern approach of presenting digital logic design as an activity in a larger systems design context. Rather than focus on aspects of digital design that have little relevance in a realistic design context, this book concentrates on modern and evolving knowledge and design skills. Hardware description language (HDL)-based design and verification is emphasized--Verilog examples are used extensively throughout. By treating digital logic as part of embedded systems design, this book provides an understanding of the hardware needed in the analysis and design of systems comprising both hardware and software components. Includes a Web site with links to vendor tools, labs and tutorials.

  • Sketching User Experiences: Getting the Design Right and the Right Design

    • 1st Edition
    • Bill Buxton
    • English
    Sketching User Experiences approaches design and design thinking as something distinct that needs to be better understood—by both designers and the people with whom they need to work— in order to achieve success with new products and systems. So while the focus is on design, the approach is holistic. Hence, the book speaks to designers, usability specialists, the HCI community, product managers, and business executives. There is an emphasis on balancing the back-end concern with usability and engineering excellence (getting the design right) with an up-front investment in sketching and ideation (getting the right design). Overall, the objective is to build the notion of informed design: molding emerging technology into a form that serves our society and reflects its values. Grounded in both practice and scientific research, Bill Buxton’s engaging work aims to spark the imagination while encouraging the use of new techniques, breathing new life into user experience design.

  • Accelerated Testing and Validation

    • 1st Edition
    • Alex Porter
    • English
    Accelerated Testing and Validation Methods is a cross-disciplinary guide that describes testing and validation tools and techniques throughout the product development process. Alex Porter not only focuses on what information is needed but also on what tools can produce the information in a timely manner. From the information provided, engineers and managers can determine what data is needed from a test and validation program and then how to select the best, most effective methods for obtaining the data.This book integrates testing and validation methods with a business perspective so readers can understand when, where, and how such methods can be economically justified. Testing and validation is about generating key information at the correct time so that sound business and engineering decisions can be made. Rather than simply describing various testing and validation techniques, the author offers readers guidance on how to select the best tools for a particular need, explains the appropriateness of different techniques to various situations and shows how to deploy them to ensure the desired information is accurately gathered.

  • Practical Industrial Data Networks

    Design, Installation and Troubleshooting
    • 1st Edition
    • Steve Mackay + 3 more
    • English
    There are many data communications titles covering design, installation, etc, but almost none that specifically focus on industrial networks, which are an essential part of the day-to-day work of industrial control systems engineers, and the main focus of an increasingly large group of network specialists.The focus of this book makes it uniquely relevant to control engineers and network designers working in this area. The industrial application of networking is explored in terms of design, installation and troubleshooting, building the skills required to identify, prevent and fix common industrial data communications problems - both at the design stage and in the maintenance phase.The focus of this book is 'outside the box'. The emphasis goes beyond typical communications issues and theory to provide the necessary toolkit of knowledge to solve industrial communications problems covering RS-232, RS-485, Modbus, Fieldbus, DeviceNet, Ethernet and TCP/IP. The idea of the book is that in reading it you should be able to walk onto your plant, or facility, and troubleshoot and fix communications problems as quickly as possible. This book is the only title that addresses the nuts-and-bolts issues involved in design, installation and troubleshooting that are the day-to-day concern of engineers and network specialists working in industry.

  • Demystifying Mixed Signal Test Methods

    • 1st Edition
    • Mark Baker
    • English
    Mixed Signal Test Methods Demystified is a less theoretical, less mathematical, and more applications-oriente... approach than other books available on the topic. In effect, this book will give readers a "just in time" understanding of the essentials of mixed signal testing techniques. Emphasis will be on commonly used devices and systems (such as PLLs and DSP) that engineers encounter in their daily tasks. Sampling theory is covered in detail, as this is the foundation for understanding all mixed signal testing technique, and readers will have a strong intuitive grasp of this topic after finishing this book.Baker aims to develop an intuitive understanding of mixed signal testing that minimizes the mathematics required and is germane to the sort of testing requirements found in typical engineering situations.

  • Reflow Soldering Processes

    • 1st Edition
    • Ning-Cheng Lee
    • English
    Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

  • Oscilloscopes

    • 5th Edition
    • Ian Hickman
    • English
    Oscilloscopes are essential tools for checking circuit operation and diagnosing faults, and an enormous range of models are available. But which is the right one for a particular application? Which features are essential and which not so important? Ian Hickman has the answers. This handy guide to oscilloscopes is essential reading for anyone who has to use a 'scope for their work or hobby: electronics designers, technicians, anyone in industry involved in test and measurement, electronics enthusiasts... Ian Hickman's review of all the latest types of 'scope currently available will prove especially useful for anyone planning to buy - or even build - an oscilloscope. The science and electronics of how oscilloscopes work is explained in order to enhance the reader's appreciation of how to use their 'scope. The practical use of oscilloscope is explained with clarity and supported with examples, encouraging the reader to think about the application of their oscilloscope and improve their use of this complex instrument. The advance of digital technology makes this timely revision of Ian Hickman's well known book an essential update for electronics professionals and enthusiasts alike.

  • Skew-Tolerant Circuit Design

    • 1st Edition
    • David Harris
    • English
    As advances in technology and circuit design boost operating frequencies of microprocessors, DSPs and other fast chips, new design challenges continue to emerge. One of the major performance limitations in today's chip designs is clock skew, the uncertainty in arrival times between a pair of clocks. Increasing clock frequencies are forcing many engineers to rethink their timing budgets and to use skew-tolerant circuit techniques for both domino and static circuits. While senior designers have long developed their own techniques for reducing the sequencing overhead of domino circuits, this knowledge has routinely been protected as trade secret and has rarely been shared. Skew-Tolerant Circuit Design presents a systematic way of achieving the same goal and puts it in the hands of all designers.This book clearly presents skew-tolerant techniques and shows how they address the challenges of clocking, latching, and clock skew. It provides the practicing circuit designer with a clearly detailed tutorial and an insightful summary of the most recent literature on these critical clock skew issues.

  • Encapsulation Technologies for Electronic Applications

    • 1st Edition
    • Haleh Ardebili + 1 more
    • English
    Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-s... (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packagin... (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechan... systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

  • Practical Radio Frequency Test and Measurement

    A Technician's Handbook
    • 1st Edition
    • Joseph Carr
    • English
    Practical Radio Frequency Test and Measurement will teach readers the basics of performing the tests and measurements used in radio-frequency systems installation, proof of performance, maintenance, and troubleshooting. Practical Radio Frequency Test and Measurement teaches readers the basics of performing the tests and measurements used in radio-frequency systems installation, proof of performance, maintenance, and troubleshooting. Anyone interested in gaining more practical proficiency with RF, whether engineer, technician, amateur radio buff, or hobbyist, needs a copy of this book. Joseph J. Carr, himself an accomplished practitioner in this field, examines the instruments used in the various types of measurement before moving on to specific measurement methods. Carr includes information on basic theories of RF measurement, as well as test equipment, test set-ups, test and measurement procedures, and interpretation of results.

  • Make It! The Engineering Manufacturing Solution

    Engineering the Manufacturing Solution
    • 1st Edition
    • John Garside
    • English
    Manufacturing operations are the real wealth creators within a business, accounting for the majority of management and financial assets needed to sustain the company. Make it! encapsulates the author's many years of experience gained designing manufacturing systems and supply-chains in factories across the world. It provides a proven, logical sequence of events needed to design effective modular factories capable of competing with the world's best. In their 1999 'Best-Managed' Companies Awards, 'Aviation Week and Space Technology' (Vol. 150, No. 22) quoted the author's former company, Lucas Aerospace, as achieving 'Most improved major aerospace company 1994 - 1998' status, ranking it second in Competitiveness, assessed by an amalgamation of asset utilisation, productivity and financial stability. This book has been written for managers charged with the responsibility for improving business profitability and for engineers facing the challenge of introducing more cost effective manufacturing processes. Many manufacturing businesses have failed to invest adequate resources in designing factory operations, mainly due to the lack of expertise and detailed knowledge needed to undertake this demanding task. John Garside is a Principal Fellow at Warwick International Manufacturing Group, The University of Warwick. This follows an extensive industrial career in highly competitive first tier system and component manufacturing businesses, who supplied many of the world's leading aerospace, automotive and industrial equipment makers.

  • Soldering in Electronics Assembly

    • 2nd Edition
    • MIKE JUDD + 1 more
    • English
    Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

  • SMT Soldering Handbook

    • 2nd Edition
    • RUDOLF STRAUSS
    • English
    Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment.

  • Quality and Standards in Electronics

    • 1st Edition
    • Ray Tricker
    • English
    A manufacturer or supplier of electronic equipment or components needs to know the precise requirements for component certification and quality conformance to meet the demands of the customer. This book ensures that the professional is aware of all the UK, European and International necessities, knows the current status of these regulations and standards, and where to obtain them.

  • Digital Storage Oscilloscopes

    • 1st Edition
    • Ian Hickman
    • English
    Digital storage oscilloscopes have long since completely supplanted analog storage oscilloscopes and have reached a degree of sophistication and performance which enable them to rival the most advanced real time oscilloscopes. In this comprehensive handbook, which provides a practical vade mecum for the engineer, Ian Hickman describes how they work and how to use them to best advantage.A wide range of models is available. This book includes a guide to all makes and models and will be best kept beside the instrument for instant reference. It will also be a most helpful guide to the subject for students and trainees. Ian Hickman is an experienced designer and author of best-selling titles including 'Oscilloscopes: How to Use Them, How They Work', Newnes Practical Radio Frequency Handbook', 'Analog Electronics' and 'Analog Circuits Cookbook'.

  • Measuring Circuits

    • 1st Edition
    • Rudolf F. Graf
    • English
    This series of circuits provides designers with a quick source for measuring circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.

  • Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI/ ULSI Applications

    • 1st Edition
    • John E.J. Schmitz
    • English
    This monograph condenses the relevant and pertinent literature on blanket and selective CVD of tungsten (W) into a single manageable volume. The book supplies the reader with the necessary background to bring up, fine tune, and successfully maintain a CVD-W process in a production set-up. Materials deposition chemistry, equipment, process technology, developments, and applications are described.

  • Handbook of VLSI Microlithography

    Principles, Technology and Applications
    • 1st Edition
    • William B. Glendinning + 1 more
    • English
    This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-mi... (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

  • Hardening Semiconductor Components Against Radiation and Temperature

    • 1st Edition
    • William R. Dawes
    • English
    This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.

  • High-temperature Solid Oxide Fuel Cells: Fundamentals, Design and Applications

    • 1st Edition
    • S.C. Singhal + 1 more
    • English
    High Temperature Solid Oxide Fuel Cells: Fundamentals, Design and Applications provides a comprehensive discussion of solid oxide fuel cells (SOFCs). SOFCs are the most efficient devices for the electrochemical conversion of chemical energy of hydrocarbon fuels into electricity, and have been gaining increasing attention for clean and efficient distributed power generation. The book explains the operating principle, cell component materials, cell and stack designs and fabrication processes, cell and stack performance, and applications of SOFCs. Individual chapters are written by internationally renowned authors in their respective fields, and the text is supplemented by a large number of references for further information. The book is primarily intended for use by researchers, engineers, and other technical people working in the field of SOFCs. Even though the technology is advancing at a very rapid pace, the information contained in most of the chapters is fundamental enough for the book to be useful even as a text for SOFC technology at the graduate level.