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Books in Materials science

The Materials Science portfolio includes titles covering core knowledge and new research and applications across the field: nanotechnology and nanomaterials; polymers and plastics; textiles; composites and ceramics; electronic, magnetic, and optical materials; metals and alloys; biomaterials; surface and film science and coating technologies; materials chemistry, and more. In-depth coverage, innovative state-of-the-art approaches, and real-world application examples provide valuable, actionable insights for researchers, students, and the corporate sector. Elsevier's Materials Science portfolio places special attention on areas of current and emerging interest such as additive manufacturing / 3D printing, graphene and 2D materials, smart materials, biomimetics... The content in Elsevier's Materials Science titles program addresses core challenges facing science and society: sustainable energy technologies, the circular economy, health and human welfare.

  • Handbook of Nanostructured Materials and Nanotechnology, Five-Volume Set

    • 1st Edition
    • Hari Singh Nalwa
    • English
    Nanostructured materials is one of the hottest and fastest growing areas in today's materials science field, along with the related field of solid state physics. Nanostructured materials and their based technologies have opened up exciting new possibilites for future applications in a number of areas including aerospace, automotive, x-ray technology, batteries, sensors, color imaging, printing, computer chips, medical implants, pharmacy, and cosmetics. The ability to change properties on the atomic level promises a revolution in many realms of science and technology. Thus, this book details the high level of activity and significant findings are available for those involved in research and development in the field. It also covers industrial findings and corporate support. This five-volume set summarizes fundamentals of nano-science in a comprehensive way. The contributors enlisted by the editor are at elite institutions worldwide.

  • Chemical Mechanical Polishing in Silicon Processing

    • 1st Edition
    • Volume 63
    • English
    Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded.Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.

  • Experimental Methods in Polymer Science

    Modern Methods in Polymer Research and Technology
    • 1st Edition
    • Toyoichi Tanaka
    • English
    Successful characterization of polymer systems is one of the most important objectives of today's experimental research of polymers. Considering the tremendous scientific, technological, and economic importance of polymeric materials, not only for today's applications but for the industry of the 21st century, it is impossible to overestimate the usefulness of experimental techniques in this field. Since the chemical, pharmaceutical, medical, and agricultural industries, as well as many others, depend on this progress to an enormous degree, it is critical to be as efficient, precise, and cost-effective in our empirical understanding of the performance of polymer systems as possible. This presupposes our proficiency with, and understanding of, the most widely used experimental methods and techniques.This book is designed to fulfill the requirements of scientists and engineers who wish to be able to carry out experimental research in polymers using modern methods. Each chapter describes the principle of the respective method, as well as the detailed procedures of experiments with examples of actual applications. Thus, readers will be able to apply the concepts as described in the book to their own experiments.

  • Ionized Physical Vapor Deposition

    • 1st Edition
    • Volume 27
    • English
    This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips. For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verif... numerical models that provide in-depth insight into the design and operation I-PVD tools. Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference.Key Features:The first comprehensive volume on ionized physical vapor depositionCombines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVDEmphasizes practical applications in the area of IC fabrication and interconnect technologyServes as a guide to select the most appropriate technology for any deposition application

  • Joints in Aluminium – INALCO ’98

    Seventh International Conference
    • 1st Edition
    • M H Ogle + 2 more
    • English
    The proceedings of the 7th INALCO conference which was held at TWI, Cambridge in April 1998.

  • Thermophysical Properties of Materials

    • 1st Edition
    • G. Grimvall
    • English
    This is a thoroughly revised version of the original book published in 1986. About half of the contents of the previous version remain essentially unchanged, and one quarter has been rewritten and updated. The rest consists of completely new and extended material. Recent research has focussed on new materials made through "molecular engineering", and computational materials science through ab initio electron structure calculations. Another trend is the ever growing interdisciplinary aspect of both basic and applied materials science. There is an obvious need for reviews that link well established results to the modern approaches. One purpose of this book is to provide such an overview in a specific field of materials science, namely thermophysical phenomena that are intimately connected with the lattice vibrations of solids. This includes, e.g., elastic properties and electrical and thermal transport. Furthermore, this book attempts to present the results in such a form that the reader can clearly see their domain of applicability, for instance if and how they depend on crystal structure, defects, applied pressure, crystal anisotropy etc. The level and presentation is such that the results can be immediately used in research. Graduate students in condensed matter physics, metallurgy, inorganic chemistry or geophysical materials will benefit from this book as will theoretical physicists and scientists in industrial research laboratories.

  • Foseco Non-Ferrous Foundryman's Handbook

    • 1st Edition
    • John Brown
    • English
    The Non-Ferrous Foundryman's Handbook provides a practical reference book for all those concerned with dealing with aluminium, copper and magnesium casting alloys.International SI units are used throughout, but in almost all cases conversions to the more familiar Metric and Imperial units are given. Wherever possible, Casting Alloy Specifications include equivalent specifications for several countries as well as international specifications. Individual chapters cover the casting of all types of non-ferrous metals. For each group of alloys, specifications, and typical applications are described, together with details of melting practice, metal treatment and casting practice. Sand moulding materials, including green sand and chemically bonded sands are also included. Recently there have been many major technical developments including new sand binders, the adoption of metal filtration of castings and widespread use of computers for the optimisation of feeder design.

  • Spectroscopy of Polymers

    • 2nd Edition
    • J.L. Koenig
    • English
    This revised and updated Second Edition of the best-selling reference/text is essential reading for students and scientists who seek a thorough and practical introduction to the field of polymer spectroscopy. Eleven chapters cover the fundamental aspects and experimental applications of the primary spectroscopic methods. The advantages and disadvantages of the various techniques for particular polymer systems are also discussed. The goal of the author is not to make the reader an expert in the field, but rather to provide enough information about the different spectroscopic methods that the reader can determine how the available techniques can be used to solve a particular polymer problem. This Second Edition contains new and updated information on techniques in IR and NMR, as well as an all-new chapter on Mass Spectrometry.

  • Carbon-Based Materials for Micoelectronics

    • 1st Edition
    • Volume 86
    • J. Robertson + 2 more
    • English
    There have been great advances in our understanding and use of inorganic carbon in recent years, following the development of the vapour synthesis of diamond, the discovery of C60 molecule and the discovery of carbon nanotubes.This issue contains the papers from the Symposium K Carbon-based Materials for Microelectronics of the European Materials Research Society meeting which was held on 16-19 June 1998, Strasbourg, France. The symposium covered fullerenes, nanotubes, diamond and amorphous carbon. It was able to show the similarities between the sp2 and sp3 forms of carbon, and between the crystalline, nano-structured and amorphous forms. Carbon is unique in having such a range of covalently bonded forms. The symposium consisted of 34 oral papers, of which 10 were invited, and 35 poster papers. The papers in this proceedings cover many of the recent developments in carbon, for example the effect of doping on the electronic structure of nanotubes, the discovery of phosphorus doping of diamond, the surface structure and electronic structure of diamond, and the field emission properties of diamond and diamond-like carbon. The applications of carbon lag some way behind those of other materials, but the symposium highlighted the uses or potential of carbon in xerography, in field emission displays and in photoconductivity-ba... sensors and radiation detectors.

  • Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modelling and Equipment

    • 1st Edition
    • Volume 81
    • H. Richter + 2 more
    • English
    The activities of the semiconductor industry to introduce a new, large wafer diameter were triggered by expected potential overall savings - cost and resource - and an anticipated increasing demand for Silicon wafers. In the beginning, around 1994, agreement on the diameter of the next wafer generation had to be achieved and finally 300 mm was globally accepted to be the next wafer diameter, a decision obtained at international summits in 1994/1995, based on the work of a SEMI task force. Several workshops on 300 mm wafers have been held by SEMI, JSNM and other organizations during the past few years. However, the present E-MRS conference on Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modeling and Equipment was the first international scientific conference about this subject. The papers - invited as well as submitted - cover a wide range of subjects, financial issues, fab concepts, crystal growth, wafer process development, material and defect issues, wafer characterization and provide an excellent review of the present status of 300 mm technology.

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