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Tribology of Abrasive Machining Processes

1st Edition - May 26, 2004

Authors: Ioan D. Marinescu, W. Brian Rowe, Boris Dimitrov, Ichiro Inaski

Language: English
eBook ISBN:
9 7 8 - 0 - 8 1 5 5 - 1 9 3 8 - 6

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further… Read more

Tribology of Abrasive Machining Processes

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Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.