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Books in Materials science

The Materials Science portfolio includes titles covering core knowledge and new research and applications across the field: nanotechnology and nanomaterials; polymers and plastics; textiles; composites and ceramics; electronic, magnetic, and optical materials; metals and alloys; biomaterials; surface and film science and coating technologies; materials chemistry, and more. In-depth coverage, innovative state-of-the-art approaches, and real-world application examples provide valuable, actionable insights for researchers, students, and the corporate sector. Elsevier's Materials Science portfolio places special attention on areas of current and emerging interest such as additive manufacturing / 3D printing, graphene and 2D materials, smart materials, biomimetics... The content in Elsevier's Materials Science titles program addresses core challenges facing science and society: sustainable energy technologies, the circular economy, health and human welfare.

  • High Brightness Light Emitting Diodes

    • 1st Edition
    • Volume 48
    • English
    Volume 48in the Semiconductors and Semimetals series discusses the physics and chemistry of electronic materials, a subject of growing practical importance in the semiconductor devices industry. The contributors discuss the current state of knowledge and provide insight into future developments of this important field.

  • Fire Retardancy of Polymers

    The Use of Intumescence
    • 1st Edition
    • M Le Bras + 3 more
    • English
    Covers the following topics: Strategies; Intumescence: Mechanism studies; New intumescent polymetric materials; Flame retarded intumescent textiles; Intumescence - an environmentally friendly process?

  • Handbook of Plastics Joining

    A Practical Guide
    • 1st Edition
    • PDL PDL Staff
    • English
    A hands-on guide to choosing and using old and new technologies for joining plastics and elastomers. Includes detailed discussions of over 25 techniques used to join plastics to themselves and to other materials. Advantages and disadvantages of each technique along with detailed discussions of applications are presented. A second section is organized by material and provides details of using different processes with over 50 generic families of plastics and how different techniques and operating parameters affect weld strength and other criteria. This book is an excellent reference and an invaluable resource for novice and expert alike in determining the best joining technique for their application and providing guidance in how to design and prepare for production.

  • Advanced Materials for Interconnections

    • 1st Edition
    • Volume 66
    • Th. Gessner
    • English
    The conference "Advanced Materials for Interconnections" took place in Strasbourg on 4-7 June 1996 hosted by the EMRS Society. Based on the recent trends in microelectronics the main topics of the conference were new materials for interconnects like special aluminum alloys, tungsten and copper as well as low k dielectric materials.64 Papers were presented at the conference and 51 of these are contained as full length papers within this volume of Microelectronic Engineering.The proceedings are divided into 5 chapters. Chapter 1 related to Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology, electroless and electro-plating, copper metallization copper interconnects and patterning of aluminum. Chapter 2, Process Integration, discusses multilevel interconnect, study on thin-film SOI devices, wet cleanings, influence of material characteristics and deposition processes, copper contamination and metallization, plasma behaviour, CMP processes, sub-micron inverse metallisation, interconnect formation and mechanical polishing investigations. Chapter 3 covers Barriers, and chapter 4 studies, evaluates and monitors Dielectrics. The final chapter looks at modelling comparisons.

  • Group IV Heterostructures, Physics and Devices (Si, Ge, C, Sn)

    • 1st Edition
    • Volume 61
    • J.-M. Lourtioz + 2 more
    • English
    These proceedings contain the majority of papers presented atSymposium D, "Group IV heterostructures, physics and devices(Si,Ge,C,&... of the Spring Meeting of the EuropeanMaterials Research Society, held at the Congress Centre,Strasbourg, France, 4-7 June 1996. This Symposium was attendedby about 150 scientists from throughout the world, among whom 18were invited speakers.The aim of the Symposium was to discussthe most recent results in all fields of Group IVheterostructures and devices from fundamental physics toindustrial applications. Regular and invited contributions werethen welcomed which addressed the different aspects of growth,the effects of strain relaxation, particularly in SiGeC alloys,the basic optical and electrical properties of heterostructuresand low-dimensional structures, the microelectronic andoptoelectronics, such as rare-earth doping techniques, was alsoselected. Except for minor changes, the order of papers presentedin this special issue of Thin Solid Films closely follows theorder of topics listed above as well as the order of sessions atthe Symposium.

  • Magnetic Ultra Thin Films, Multilayers and Surfaces

    • 1st Edition
    • Volume 62
    • F. Petroff + 1 more
    • English
    The Symposium on Magnetic Ultrathin Films, Multilayers andSurfaces, hosted by the European Materials Research Society, washeld at the Palais de la Musique et des Congré inStrasbourg, France on June 4-7, 1996. Its central theme was therelationship of magnetic properties and device performance tostructure at the nano and micrometer length scale. Research onthe magnetism of surfaces, ultrathin films and multilayers hasincreased dramatically during recent years. This development wastriggered by the discovery of coupling between ferromagneticlayers across nonmagnetic spacer layers and of the giantmagnetoresistan... effect in systems of reduced dimension usingvarious micro and nanofabrication techniques has become a subjectof special interest. It is certainly the promising applicationpotential of these effects in new magnetic recording devicegeometries which causes this intensive research, which is doneboth by companies and at universities and researchinstitutes.A selection of invited and contributed paperspresented at the Symposium and accepted for publication iscontained in this volume. The contents of these proceedings areorganized into seven sections.A. Nanowires, Nanoparticles,Nanost... Ultrathin Films and Surfaces,Characteriz... Giant MagnetoresistanceD. Coupling,TunnelingE. Growth, Structure, MagnetismF. Growth,Structure, MagnetoresistanceG. Coupling, Magnetic processes,Magneto-op... first four sections contain invited andoral contributed papers in the listed research domains, while thelast three sections contain the contributions presented duringthree large poster sessions.

  • Metal and Ceramic Based Composites

    • 1st Edition
    • Volume 12
    • S.T. Mileiko
    • English
    Modern scientific and technological fields are frequently of an interdisciplinary nature, and the field of fibrous composites is no exception. Unlike fibre-reinforced plastics, the family of metal- and ceramic-based composites is still quite a new group of materials with a large variety of mechanical and physical properties. Up until now it has been difficult to produce these materials as the necessary technical information has not been well documented.The main purpose of this book is to link together fabrication, structure and properties chains, so as to clarify which structure provides the necessary properties, and how one can attain the correct composite structure. To this end, the book not only contains topics of a purely technical nature, but also a description of the failure mechanics of metal- and ceramic-matrix composites, as this is the key to understanding the structure-properties segment of the chain mentioned.The book is divided into three parts. Part I presents a general view of composites with the accent on metal- and ceramic-matrix composites. It also contains a brief description of modern fibres and composites and can be considered, at least for beginners, as a starting point for further study. Part II looks at the composite microstructures considered to be either optimal or reasonable in resisting a particular loading. Finally Part II describes a variety of mechanical, physical, and chemical potential for organizing these microstructures. Experimental data on technologies, material structures, and material properties are used throughout the book to support theoretical conclusions or to obtain important physical parameters.

  • Handbook of Optical Constants of Solids, Five-Volume Set

    Handbook of Thermo-Optic Coefficients of Optical Materials with Applications
    • 1st Edition
    • Edward D. Palik
    • English
    This set of five volumes, four volumes edited by Edward D. Palik and a volume by Gorachand Ghosh, is a unique resource for any science and technology library. It provides materials researchers and optical device designers with reference facts in a context not available anywhere else. The singular functionality of the set derives from the unique format for the three core volumes that comprise the Handbook of Optical Constants of Solids. The Handbook satisfies several essential needs: first, it affords the most comprehensive database of the refractive index and extinction (or loss) coefficient of technically important and scientifically interesting dielectrics. This data has been critically selected and evaluated by authorities on each material. Second, the dielectric constant database is supplemented by tutorial chapters covering the basics of dielectric theory and reviews of experimental techniques for each wavelength region and material characteristic. As an additional resource, two of the tutorial chapters summarize the relevant characteristics of each of the materials in the database.The data in the core volumes have been collected and analyzed over a period of twelve years, with the most recent completed in 1997. The volumes systematically define the dielectric properties of 143 of the most engaging materials, including metals, semiconductors, and insulators. Together, the three Palik books contain nearly 3,000 pages, with about 2/3 devoted to the dielectric constant data. The tutorial chapters in the remaining 1/3 of the pages contain a wealth of information, including some dielectric data. Hence, the separate volume, Index to Handbook of Optical Constants of Solids, which is included as part of the set, substantially enhances the utility of the Handbook and in essence, joins all the Palik volumes into one unit. It isthen of great importance to users of the set. A final volume rounds out the set. The Handbook of Thermo-Optic Coefficients of Optical Materials with Applications collects refractive index measurements and their temperature dependence for a large number of crystals and glasses. Mathematical models represent these data, and in turn are used in the design of nonlinear optical devices.

  • Uncooled Infrared Imaging Arrays and Systems

    • 1st Edition
    • Volume 47
    • English
    This is the first book to describe an emerging but already growing technology of thermal imaging based on uncooled infrared imaging arrays and systems, which are the most exciting new developments in infrared technology today. This technology is of great importance to developers and users of thermal images for military and commercial applications. The chapters, prepared by world leaders in the technology, describe not only the mainstream efforts, but also exciting new approaches and fundamental limits applicable to all.

  • Partial Cumulative Index

    Cumulative Index
    • 1st Edition
    • Volume 100
    • Peter W. Hawkes
    • English
    Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.Volume 100 is a cumulative index for all in-print volumes of Advances in Electronics and Electron Physics (Volumes 63–89), Advances in Imaging & Electron Physics (Volumes 90–99), and Advances in Optical & Electron Microscopy(Volumes 1–14).

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