Handbook of Thin Film Deposition

Foreword: Gordon MooreRecent Changes in the Semiconductor IndustryKrishna Seshan 1.0 Cost of Device Fabrication 2.0 Technology Trends, Chip Size, Performance, and Moore's Law1. Deposition Technologies and Applications: Introduction and OverviewWerner Kern and Klaus K. Schuegraf 1.0 Objective and Scope of this Book 2.0 Importance of Deposition Technology in Modern Fabrication Processes 3.0 Classification of Deposition Technologies 4.0 Overview of Various Thin Film Deposition Technologies 5.0 Criteria for the Selection of a Deposition Technology for Specific Applications 6.0 Summary and Perspective for the Future2. Silicon Epitaxy by Chemical Vapor DepositionMartin L. Hammond 1.o Introduction 2.0 Theory of Silicon Epitaxy by CVD 3.0 Silicon Epitaxy Process Chemistry 4.0 Commercial Reactor Geometries 5.0 Theory of Chemical Vapor Deposition 6.0 Process Adjustments 7.0 Equipment Considerations for Silicon Epitaxy 8.0 Other Equipment Considerations 9.0 Defects in Epitaxy Layers 10.0 Safety 11.0 Key Technical Issues 12.0 New Materials Technology for Silicon Epitaxy 13.0 Low Temperature Epitaxy3. Chemical Vapor Deposition of Silicon Dioxide FilmsJohn Foggiato 1.0 Introduction 2.0 Overview of Atmospheric Pressure CVD 3.0 Plasma Enhanced CVD 4.0 Properties of Dielectric Films 5.0 New Deposition Technologies 6.0 Future Directions for CVD of Dielectric Films4. Metal Organic Chemical Vapor DepositionJohn L. Zitko 1.0 Introduction 2.0 Applications of MOCVD 3.0 Physical and Chemical Properties of Sources Used in MOCVD 4.0 Growth Mechanisms, Conditions, and Chemistry 5.0 System Design and Construction 6.0 Future Developments5. Feature Scale ModelingVivek Singh 1.0 Introduction 2.0 Components of Etch and Deposition Modeling 3.0 Etch Modeling 4.0 Etch Examples 5.0 Deposition Modeling 6.0 Deposition Examples 7.0 Real Life6. The Role of Metrology and Inspection to Semiconductor ProcessingMark Keefer, Rebecca Pinto, Cheri Dennison, James Turlo 1.0 Overview 2.0 Introduction to Metrology and Inspection 3.0 Metrology and Inspection Trends 4.0 Theory of Operation, Equipment Design Principles, Main Applications, and Strengths and Limitations of Metrology and Inspection Principles7. Contamination Control, Defect Detection and Yield Enhancement in Gigabit ManufacturingSuresh Bhat and Krishna Seshan 1.0 Introduction 2.0 Contamination and Defect Goals for ULSI Devices 3.0 Sources of Particles 4.0 Contamination and Defect Detection: Tools of the Trade 5.0 Advanced Techniques for Trace Contamination Monitoring 6.0 Substrate Surface Preparation Techniques 7.0 Challenges to ULSI (Gigabit) Contamination Control 8.0 Process Evolution 9.0 Evolution of Circuit Based Electrical Defect Detection8. Sputtering and Sputter DepositionStephen Rossnagel 1.0 Introduction 2.0 Physical Sputtering Theory 3.0 Plasmas and Sputtering Systems 4.0 Deposition Rates and Efficiencies 5.0 Reactive Sputter Deposition 6.0 Sputtering Systems9. Laser and Electron Beam Assisted ProcessingCameron A. Moore, Zeng-qi Yu, Lance R. Thompson, George J. Collins 1.0 Introduction 2.0 Beam Assisted CVD of Thin Films 3.0 Submicron Pattern Delineation with Large Area Glow Discharge Pulsed Electron Beams 4.0 Beam Induced Thermal Processes10. Molecular Beam Epitaxy: Equipment and PracticeWalter S. Knodle and Robert Chow 1.0 The Basic MBE Process 2.0 Competing Deposition Technologies 3.0 MBE Grown Devices 4.0 MBE Deposition Equipment 5.0 Principles of Operation 6.0 Recent Advances 7.0 Future Developments11. Ion Beam DepositionJohn R. McNeil, James J. McNally, Paul D. Reader 1.0 Introduction 2.0 Overview of Ion Beam Applications 3.0 Ion Beam Probing 4.0 Substrate Cleaning with Ion Beams 5.0 Applications12. Chemical Mechanical PolishingKenneth C. Cadien 1.0 Introduction 2.0 Processing 3.0 Polish Equipment 4.0 History 5.0 Innovations 6.0 Automation 7.0 Wafer/Pad Relative Motion 8.0 Future Challenges13. Organic Dielectrics in Multilevel Metallization of Integrated CircuitsKrishna Seshan, Dominic J. schepis, Laura B. Rothman 1.0 General Introduction 2.0 Historical Perspective 3.0 Fundamental Chemistry of Organic Dielectrics 4.0 Processing of Polymer Films 5.0 Process Integration with Organic Dielectrics 6.0 Reliability 7.0 Performance Advantages of Organic Dielectrics14. Performance, Processing, and Lithography TrendsKrishna Seshan 1.0 Introduction 2.0 Scaling the Transistor 3.0 Low Resistance: Change to Copper-Based Metallurgy 4.0 Trend to Low K Materials 5.0 Lithography and Planarization 6.0 Challenges to Contamination and Cleaning 7.0 SummaryIndex