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Handbook of Thin Film Deposition
- 4th Edition - February 23, 2018
- Editors: Krishna Seshan, Dominic Schepis
- Language: English
- Paperback ISBN:9 7 8 - 0 - 1 2 - 8 1 2 3 1 1 - 9
- eBook ISBN:9 7 8 - 0 - 1 2 - 8 1 2 3 1 2 - 6
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the close… Read more
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Request a sales quoteHandbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability.
- Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes
- Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries
- Features a new chapter discussing Gates Dielectrics
Students and researchers from semiconductor physics and microelectronic technologies, partly from the field of optical thin films
- No. of pages: 470
- Language: English
- Edition: 4
- Published: February 23, 2018
- Imprint: William Andrew
- Paperback ISBN: 9780128123119
- eBook ISBN: 9780128123126
KS
Krishna Seshan
Krishna Seshan was an Assistant Professor in Materials Science at the University of Arizona with extensive professional experience as a technologist at both IBM and Intel Corporations. Dr. Seshan passed away in 2017.
Affiliations and expertise
Former Assistant Professor, Materials Science, University of ArizonaDS
Dominic Schepis
Dominic Schepis has over 35 years of experience in the semiconductor industry supporting logic and memory technologies. As a Principal Member of the Technical Staff at GlobalFoundries, Dominic worked on process development and integration for various advanced node CMOS technologies. His early work on SOI CMOS integration was instrumental to bringing this technology for use in IBM servers. He also was appointed Master Inventor at both IBM and GlobalFoundries and served on their patent evaluation boards. A graduate from Rensselaer Polytechnic Institute, he joined IBM’s Semiconductor Research and Development Center (SRDC) and has worked on a variety of advanced research and development projects and supported process sectors including reactive ion etching, epitaxial film growth, process integration, and other unit processes. During his tenure there, he coauthored over 29 technical journal papers and has over 100 issued US patents.
Affiliations and expertise
Formally GlobalfoundriesRead Handbook of Thin Film Deposition on ScienceDirect