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This book is the first to explain FinFET modeling for IC simulation and the industry standard – BSIM-CMG - describing the rush in demand for advancing the technology from planar to… Read more
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This book is the first to explain FinFET modeling for IC simulation and the industry standard – BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture, as now enabled by the approved industry standard.
The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, providing a step-by-step approach for the efficient extraction of model parameters.
With this book you will learn:
Why you should use FinFET
The physics and operation of FinFET
Details of the FinFET standard model (BSIM-CMG)
Parameter extraction in BSIM-CMG
FinFET circuit design and simulation
1. FinFET- from Device Concept to Standard Compact Model2. Analog/RF behavior of FinFET3. Core Model for FinFETs4. Channel Current and Real Device Effects5. Leakage Current Models6. Charge, Capacitance and Nonquasi-Static Effect7. Parasitic Resistances and Capacitances8. Noise9. Junction Diode Current and Capacitance10. Benchmark tests for Compact Models11. BSIM-CMG Model Parameter Extraction12. Temperature Effects
YC
Yogesh Singh Chauhan is a Professor at the Indian Institute of Technology in Kanpur, India. He is the developer of several industry standard SPICE models, including the ASM-HEMT model and the BSIMBULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4, and BSIM-SOI models. His research interests encompass the characterization, modeling, and simulation of semiconductor devices and RF circuit design. He is a Fellow of IEEE and the Indian National Academy of Engineering. He is the Editor of IEEE Transactions on Electron Devices and Distinguished Lecturer of the IEEE Electron Devices Society. He is the chairperson of the IEEE-EDS Compact Modeling Committee and IEEE Uttar Pradesh section. He has published more than 400 papers in international journals and conference proceedings.
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