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Wide Bandgap Power Semiconductor Packaging

Materials, Components, and Reliability

1st Edition - May 28, 2018

Editor: Katsuaki Suganuma

Language: English
Paperback ISBN:
9 7 8 - 0 - 0 8 - 1 0 2 0 9 4 - 4
eBook ISBN:
9 7 8 - 0 - 0 8 - 1 0 2 0 9 5 - 1

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including… Read more

Wide Bandgap Power Semiconductor Packaging

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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.

As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.