Skip to main content

Three-Dimensional Integrated Circuit Design

  • 2nd Edition - July 3, 2017
  • Authors: Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman
  • Language: English
  • Paperback ISBN:
    9 7 8 - 0 - 1 2 - 4 1 0 5 0 1 - 0
  • eBook ISBN:
    9 7 8 - 0 - 1 2 - 4 1 0 4 8 4 - 6

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, t… Read more

Three-Dimensional Integrated Circuit Design

Purchase options

Limited Offer

Save 50% on book bundles

Immediately download your ebook while waiting for your print delivery. No promo code is needed.

Book bundle cover eBook and print

Institutional subscription on ScienceDirect

Request a sales quote

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits.

Expanded with new chapters and updates throughout based on the latest research in 3-D integration:

Manufacturing techniques for 3-D ICs with TSVs

Electrical modeling and closed-form expressions of through silicon vias

Substrate noise coupling in heterogeneous 3-D ICs

Design of 3-D ICs with inductive links

Synchronization in 3-D ICs

Variation effects on 3-D ICs

Correlation of WID variations for intra-tier buffers and wires