Thin Film Processes II
- 1st Edition - April 28, 1991
- Latest edition
- Author: Werner Kern
- Editor: John L. Vossen
- Language: English
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately… Read more
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Description
Description
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques.
Key features
Key features
- Provides an all-new sequel to the 1978 classic, Thin Film Processes
- Introduces new topics, and several key topics presented in the original volume are updated
- Emphasizes practical applications of major thin film deposition and etching processes
- Helps readers find the appropriate technology for a particular application
Readership
Readership
Engineers, technicians, and beginning graduate students in electrical engineering and materials science
Table of contents
Table of contents
J.L. Vossen and W. Kern, Introduction. S.M. Rossnagel, Glow Discharge Plasma and Sources for Etching and Deposition. C.V. Deshpandey and R.F. Bunshah, Evaporation Processes. P.P. Chow, Molecular Beam Epitaxy. R. Parsons, Sputter Deposition Processes. P.C. Johnson, The Cathodic Arc Plasma Deposition of Thin Films. K.F. Jensen and W. Kern, Thermal Chemical Vapor Deposition. K.F. Jensen and T. Kuech, Metal-Organic Chemical Vapor Deposition. J.G. Eden, Photochemical Vapor Deposition. L.C. Klein, Sol-Gel Coatings. R. Reif and W. Kern, Plasma-Enhanced Chemical Vapor Deposition. G. Lucovsky, D.V. Tsu, R.A. Rudder, and R.J. Markunas, Formation of Inorganic Films by Remote Plasma-Enhanced Chemical-Vapor Deposition. T.M. Mayer and S.D. Allen, Selected Area Processing. H.W. Lehman, Plasma-Assisted Etching. P.R. Puckett, S.L. Michel, and W.E. Hughes, Ion Beam Etching. C.I.H. Ashby, Laser-Driven Etching.
Product details
Product details
- Edition: 1
- Latest edition
- Published: December 2, 2012
- Language: English
About the editor
About the editor
JV
John L. Vossen
Affiliations and expertise
RCA Laboratories, Princeton, New JerseyAbout the author
About the author
WK
Werner Kern
Affiliations and expertise
Lam Research, San Diego, CA, USAView book on ScienceDirect
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