Thermal Management in Microelectronics with Carbon-Based Composites
- 1st Edition - February 1, 2027
- Latest edition
- Editors: Lin Qiu, Yichuan He, Yanghui Feng
- Language: English
Thermal Management in Microelectronics with Carbon-Based Composites provides a comprehensive exploration of the design, mechanisms, and applications of carbon-based materi… Read more
Description
Description
Thermal Management in Microelectronics with Carbon-Based Composites provides a comprehensive exploration of the design, mechanisms, and applications of carbon-based materials—such as graphene and carbon nanotubes—for advanced thermal management in microelectronic devices. The book’s objective is to address the mounting challenges posed by miniaturization and increasing power densities in microelectronics, especially the critical barrier of efficient heat dissipation. The book aims to bridge the gap between fundamental scientific theory and practical engineering solutions, focusing on enhancing the thermal conductivity and interfacial heat transfer of carbon nanomaterial assemblies. The book encompasses measurement methods, theoretical insights, interfacial heat transfer mechanisms, applications in devices, wearables and energy storage systems.
The book will be a valuable reference resource for materials scientists and engineers, thermal scientists, as well as microelectronics/photonics researchers and postgraduate students working in above-related fields. The book uniquely offers a systematic, in-depth, and application-oriented resource, providing authoritative guidance for both research and industrial applications.
The book will be a valuable reference resource for materials scientists and engineers, thermal scientists, as well as microelectronics/photonics researchers and postgraduate students working in above-related fields. The book uniquely offers a systematic, in-depth, and application-oriented resource, providing authoritative guidance for both research and industrial applications.
Key features
Key features
- Systematic and in-depth analysis of interfacial properties and heat transfer mechanisms in carbon nanotube/graphene assemblies
- Comprehensive treatment from fundamental theory to practical application including life cycle analysis and future outlooks
- Strong integration of recent advances, future opportunities, and cutting-edge developments
- Multidisciplinary approach spanning material synthesis, device integration, and performance analysis
- Covers the use of artificial intelligence in material design and analysis
- Includes details on molecular dynamics simulation related to heat transfer mechanisms and interface strengthening
Readership
Readership
Materials scientists and engineers, thermal scientists and engineers, microelectronics and photonics researchers and other professionals working with carbon-based materials for thermal management in microelectronics
Table of contents
Table of contents
1. Introduction
2. Thermal conductivity measurement methods and molecular dynamics simulations of carbon nanotubes
2.1 Thermal conductivity measurement methods for low-dimensional carbon materials
2.2 Molecular dynamics simulation for carbon nanotubes
2.3 Thermal transport theory for carbon nanotubes
3. Thermal transport mechanism between carbon nanotubes
3.1 Interface transport between carbon nanotubes with added halogen molecules
3.2 Interface thermal transport between carbon nanotubes with added metal nanoclusters
3.3 Thermal transport law between carbon nanotubes with internal loaded carbene chains
4. Thermal transport mechanism of carbon nanomaterial composite interface
4.1 Thermal transport at the interface between carbon nanotubes and polymer tubes
4.2 Interface thermal transport between carbon nanotubes and polyurethane molecular chains
4.3 Carbon nanotube-oriented regulation of polyethylene molecular chain interface thermal transport
4.4 Carbon nanotube array device interface thermal transport
5. Interface thermal transport mechanism of graphene composite materials
5.1 Graphene diamond interface thermal transport
5.2 Thermal transport at the interface of diamond/graphene heterostructure
6. Conductivity mechanism and chip integration of carbon nanotube microelectronic devices
6.1 Nano-scale conduction mechanism and interface optimization
6.2 Breakthroughs in high-density integrated circuit applications
7. Mechanic-electrical coupling mechanisms and applications of flexible electronic devices
7.1 Self-assembled flexible structural mechanism
7.2 Wearable and transparent electronic applications
8. Charge transport mechanism and system integration of energy storage devices
8.1 Multiscale charge transport mechanism
8.2 High energy density energy storage systems
9. Catalytic mechanism and system design of energy conversion Devices
10. Summary & Outlook
2. Thermal conductivity measurement methods and molecular dynamics simulations of carbon nanotubes
2.1 Thermal conductivity measurement methods for low-dimensional carbon materials
2.2 Molecular dynamics simulation for carbon nanotubes
2.3 Thermal transport theory for carbon nanotubes
3. Thermal transport mechanism between carbon nanotubes
3.1 Interface transport between carbon nanotubes with added halogen molecules
3.2 Interface thermal transport between carbon nanotubes with added metal nanoclusters
3.3 Thermal transport law between carbon nanotubes with internal loaded carbene chains
4. Thermal transport mechanism of carbon nanomaterial composite interface
4.1 Thermal transport at the interface between carbon nanotubes and polymer tubes
4.2 Interface thermal transport between carbon nanotubes and polyurethane molecular chains
4.3 Carbon nanotube-oriented regulation of polyethylene molecular chain interface thermal transport
4.4 Carbon nanotube array device interface thermal transport
5. Interface thermal transport mechanism of graphene composite materials
5.1 Graphene diamond interface thermal transport
5.2 Thermal transport at the interface of diamond/graphene heterostructure
6. Conductivity mechanism and chip integration of carbon nanotube microelectronic devices
6.1 Nano-scale conduction mechanism and interface optimization
6.2 Breakthroughs in high-density integrated circuit applications
7. Mechanic-electrical coupling mechanisms and applications of flexible electronic devices
7.1 Self-assembled flexible structural mechanism
7.2 Wearable and transparent electronic applications
8. Charge transport mechanism and system integration of energy storage devices
8.1 Multiscale charge transport mechanism
8.2 High energy density energy storage systems
9. Catalytic mechanism and system design of energy conversion Devices
10. Summary & Outlook
Product details
Product details
- Edition: 1
- Latest edition
- Published: February 1, 2027
- Language: English
About the editors
About the editors
LQ
Lin Qiu
Qiu Lin is Ph.D. of Institute of Engineering Thermophysics, Chinese Academy of Sciences (CAS), China, Postdoc of University of Virginia, USA, and Associate Professor of University of Science and Technology Beijing (USTB), China. She had conducted academic visits at Nanyang Technological University in Singapore and Leeds University in UK. The main research fields are Micro/Nanoscale Thermal Properties Measurement and Heat Transport Mechanism, and Recovery and Utilization of Waste Heat in Steel industry. She also has been invited to become the editorial board of Scientific Reports Member, and presided over the youth program and general program of NSFC, and the sub-projects of National Key R&D Plan, and participated in the key program of NSFC, the Chinese 973 Project, and the major instrument project of the Ministry of Science and Technology.
Affiliations and expertise
Doctor of Engineering Thermophysics, Chinese Academy of Sciences, Postdoctoral Fellow of the University of Virginia, USA, Associate Professor of University of Science and Technology Beijing, ChinaYH
Yichuan He
Yichuan He is an Associate Professor at the University of Science and Technology Beijing, China. He previously worked as an assistant researcher at the School of Energy and Power, Dalian University of Technology. Dr. He’s research expertise covers micro-scale phase change heat transfer, thermal management in chips and power batteries, the integration of machine learning with flow heat transfer, and flow and thermal processes in industrial equipment such as those used in aerospace, nuclear energy, and biomedical devices. His work emphasizes experimental and computational approaches for enhancing heat transfer and improving energy efficiency in advanced engineering systems.
Affiliations and expertise
, University of Science and Technology BeijingYF
Yanghui Feng
Yanhui Feng is Professor, doctoral supervisor, and Vice President of the School of Energy and Environmental Engineering at the University of Science and Technology Beijing, China. He holds leadership positions in several national and regional academic societies and educational steering committees, being an executive director or member of engineering thermophysics, energy, and thermal storage professional bodies. Prof. Feng has been recognized in national talent and teaching excellence programs, including the National Major Talent Project and as a renowned educator in Beijing. His research focuses on engineering thermophysics, energy storage, and power engineering, with a strong commitment to academic leadership and professional training in the energy sector.
Affiliations and expertise
Professor Department of Thermal Science and Energy Engineering China