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Smart and Connected Wearable Electronics
Nanomanufacturing, Soft Packaging, and Healthcare Devices
- 1st Edition - November 13, 2023
- Editors: Woon-Hong Yeo, Yun Soung Kim
- Language: English
- Paperback ISBN:9 7 8 - 0 - 3 2 3 - 9 9 1 4 7 - 6
- eBook ISBN:9 7 8 - 0 - 3 2 3 - 9 9 3 6 8 - 5
Smart and Connected Wearable Electronics: Nanomanufacturing, Soft Packaging, and Healthcare Devices is an introduction to the latest advances in nanomaterial printing technolog… Read more
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Request a sales quoteSmart and Connected Wearable Electronics: Nanomanufacturing, Soft Packaging, and Healthcare Devices is an introduction to the latest advances in nanomaterial printing technologies and soft material packaging of wearable electronics for healthcare applications. Sections introduce the whole range of nanomanufacturing technologies, both conventional and emerging being employed to produce soft healthcare devices, describe the strategies to package and assemble individual components with various form factors and properties toward fully functional soft wearable systems, and introduce a number of healthcare applications based on recent advances in soft wearable systems.
This book addresses critical advances in research to help enable the translation to functional commercial products. For example, the book introduces the methods with which different components are packaged to reveal mechanical compliance and robustness. It will be a welcomed addition as a go-to reference for conducting research in academia or working in the commercial sector.
- Provides up-to-date information on various printing technologies used for wearable systems
- Includes dedicated sections for the use of soft materials for packaging of emerging wearable systems
- Presents comprehensive coverage of materials, design, manufacturing and applications, with good balance between theories and examples
- Cover image
- Title page
- Table of Contents
- Copyright
- Contributors
- Part One: Printing-enabled nanomanufacturing of sensors and electronics
- 1 Screen printing-enabled nanomanufacturing of sensors and electronics
- Abstract
- 1.1 Introduction
- 1.2 Fundamentals of screen printing
- 1.3 Nanomaterials for screen printing
- 1.4 Applications
- 1.5 Conclusions
- References
- 2 Inkjet printing for flexible and stretchable electronics
- Abstract
- 2.1 Introduction to inkjet printing technology
- 2.2 Principles of inkjet printing
- 2.3 Sintering
- 2.4 Functional inks for inkjet printing
- 2.5 Applications
- 2.6 Summary
- References
- 3 Aerosol jet printing toward advanced electronics: Versatile, facile, additive processes for 2D/3D structuring
- Abstract
- 3.1 Introduction
- 3.2 Fundamentals of aerosol jet printing
- 3.3 AJP applications
- 3.4 3D structuring by AJP
- 3.5 Conclusions and future outlook
- References
- 4 Roll-to-roll printing
- Abstract
- 4.1 Overview of roll-to-roll processing
- 4.2 Roll-to-roll printing technologies
- 4.3 Technical requirement and challenges
- 4.4 Recent advances
- References
- Part Two: Soft material packaging for hybrid flexible bioelectronics
- 5 Incorporation of soft materials for flexible electronics
- Abstract
- 5.1 Introduction
- 5.2 Soft organic substrates for flexible electronics
- 5.3 Soft interconnection for flexible electronics
- 5.4 Soft encapsulation for flexible electronics
- 5.5 Soft adhesive for flexible electronics
- References
- 6 Material and structural approaches for human-machine interfaces
- Abstract
- 6.1 Introduction
- 6.2 Material strategies for human-machine interfaces
- 6.3 Structural strategies for human-machine interfaces
- 6.4 Applications and prospects
- 6.5 Conclusions
- References
- 7 Strategies for IC integration
- Abstract
- Acknowledgment
- 7.1 Introduction
- 7.2 Direct die technique in IC integration
- 7.3 System-on-chip integration in IC systems
- 7.4 Anisotropic conductive film (ACF) bonding in IC integration
- 7.5 Flip-chip bonding in IC integration
- 7.6 Wire bonding in IC integration
- 7.7 Die bonding and bumping in IC integration
- 7.8 Tape-automated bonding in IC integration
- 7.9 Future applications for IC integration methods in flexible electronics
- 7.10 Conclusions
- References
- Part Three: Applications
- 8 Soft, wearable devices to monitor electrophysiological signals and gaseous biomarkers
- Abstract
- 8.1 Introduction
- 8.2 Biopotential monitoring
- 8.3 Wearable sensors for gas and breath analysis
- 8.4 Conclusions
- References
- 9 Implantable soft electronics and sensors
- Abstract
- 9.1 Introduction
- 9.2 Definition and scope
- 9.3 Design attributes of soft implantable bioelectronics
- 9.4 Fabrication approaches
- 9.5 Locations and applications
- 9.6 Conclusions and future outlook
- References
- 10 Electrochemical analysis of biological fluids
- Abstract
- Acknowledgments
- 10.1 Introduction
- 10.2 Fundamentals of electrochemistry
- 10.3 Sensor criteria
- 10.4 Continuous monitoring with diagnostic approach in various biofluids
- 10.5 Applications and commercialized devices
- 10.6 Conclusions
- References
- 11 Advanced technologies for powering wearable devices
- Abstract
- 11.1 Introduction
- 11.2 Requirements of power sources’ technologies for wearable devices
- 11.3 Battery-based technology
- 11.4 Energy-harvesting technology
- 11.5 Hybrid energy technologies
- 11.6 Conclusions
- References
- 12 Trends and emerging opportunities for smart wearables
- Abstract
- 12.1 Introduction
- 12.2 Current trends and emerging opportunities in smart wearable sensors
- 12.3 Current trends and emerging opportunities in smart haptic/display wearables
- 12.4 Conclusion and future perspective
- References
- Index
- No. of pages: 650
- Language: English
- Edition: 1
- Published: November 13, 2023
- Imprint: Woodhead Publishing
- Paperback ISBN: 9780323991476
- eBook ISBN: 9780323993685
WY
Woon-Hong Yeo
YK