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Recrystallization and Related Annealing Phenomena, Third Edition, fulfills the information needs of materials scientists in both industry and academia. The subjects treated i… Read more
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Immediately download your ebook while waiting for your print delivery. No promo code needed.
Recrystallization and Related Annealing Phenomena, Third Edition, fulfills the information needs of materials scientists in both industry and academia. The subjects treated in the book are all active research areas, forming a major part of at least four regular international conference series. This new third edition ensures the reader has access to the latest findings, and is essential reading to those working in the forefront of research in universities and laboratories.
For those in industry, the book highlights applications of the research and technology, exploring, in particular, the significant progress made recently in key areas such as deformed state, including deformation to very large strains, the characterization of microstructures by electron backscatter diffraction, the modeling and simulation of annealing, and continuous recrystallization.
Graduate through active materials scientists and materials engineers in industry involved in the characterization, modelling and thermal treatment of metals
1. Introduction
2. The deformed state
3. Deformation textures
4. The structure and energy of grain boundaries
5. Mobility and migration of boundaries
6. Recovery after deformation
7. Recrystallization of single-phase alloys
8. Recrystallization of ordered materials
9. Recrystallization of Two-Phase Alloys
10.The growth and stability of cellular microstructures
11. Grain growth following recrystallization
12. Recrystallization textures
13. Hot deformation and dynamic restoration
14. Continuous recrystallization during and after large strain deformation
15. Control of recrystallization
18. Computer modeling and simulation of annealing
Appendix: Texture (NEW)
Appendix: The measurement of Recrystallization (NEW)
AR
He was the Chair of the International Conference on Texture (ICOTOM-15), which was held on campus at CMU June, 2008 and is a member of its International Scientific Committee. From 2001-2013 he was the Chair of the International Committee of the conference on Grain Growth and Recrystallization that is held every three years; the next meeting will be in Pittsburgh in 2016. He was a co-Chair of the 13th International Conference on Aluminum and its Applications, which was held on campus at CMU in June 2012. He is a co-author of the texture analysis package popLA, and the polycrystal plasticity code, LApp; he is also a contributor to the Dream.3D software package and the well-known textbook Texture & Anisotropy edited by Kocks, Tomé and Wenk.
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