Plasma Processing for Semiconductor Materials and Thin-Film Devices
- 1st Edition - October 28, 2026
- Latest edition
- Editors: Kuan Yew Cheong, Behnam Akhavan, Shih-Nan Hsiao, Sheng-Chi Chen, Phuoc Huu Le
- Language: English
Plasma Processing for Semiconductor Materials and Thin-Film Devices covers the state-of-the-art in plasma processing of thin films. The book focuses on fundamental plasma theory… Read more
Description
Description
Plasma Processing for Semiconductor Materials and Thin-Film Devices covers the state-of-the-art in plasma processing of thin films. The book focuses on fundamental plasma theory, plasma for advanced applications, advanced characterization techniques, plasma and performance in semiconductor devices, and plasma processing. Sections consider the fundamental physics of plasma then move to advanced applications in the processing of semiconductor materials and their relation to the performance of semiconductor thin film devices. Subsequently, the book investigates the adoption of plasma for advanced (including thin film) characterization methods, finally addressing emerging plasma technologies such as liquid plasma, cold atmospheric plasma, and advanced plasma techniques.
This book will be of interest to students, researchers, and practitioners in any field that utilizes plasma processing, since its chapters have been written by leading authorities from both academia and industry.
This book will be of interest to students, researchers, and practitioners in any field that utilizes plasma processing, since its chapters have been written by leading authorities from both academia and industry.
Key features
Key features
- Brings together in one volume the fundamental knowledge of thin-film growth at the atomic scale, the macroscopic concepts of thin-film growth, and the basic knowledge of plasma physics and chemistry
- Covers state-of-the-art plasma technology for processing and characterizing advanced and emerging semiconductor materials and thin-film devices
- Explores a wide range of plasma technologies for advanced engineering applications
Readership
Readership
Senior students, post-docs, researchers, and professionals in basic and applied areas of plasma processing (eg, semiconductor development and fabrication, microelectronics)
Table of contents
Table of contents
Section I Plasma diagnostics
1. Spectroscopic methods of particle density characterization in plasma
Section II Plasma-based thin film deposition
2. Plasma-enhanced ALD for next-generation thin films
3. Advances in plasma-assisted thermal evaporation for thin films and their applications
Section III Surface modification and processing-induced damage
4. Plasma functionalization of advanced polymers
5. Surface functionalization of Si, Ge, and wide-bandgap semiconductors: Techniques and applications
6. Plasma etching induced damages and defects related to SiC-based device performance
Section IV Atomic-layer and advanced plasma etching
7. Plasma and thermal atomic layer etching for processing of nanodevice structures
8. Thermal-cyclic atomic layer etching
9. Fundamental cornerstones and emerging milestones of etching technology using low-temperature plasma
10. Cryogenic plasma etching for next-generation semiconductor processing
11. Etching of β-Ga 2 O 3 : From plasma processes to plasma-free pathways
Section V Energy and environmental applications of plasma-and laser-enabled processing
12. Semiconductor nanomaterials via liquid plasma processing for energy and environmental applications
13. Future directions in plasma processing of semiconductor carbon-based materials for sustainable energy solutions
1. Spectroscopic methods of particle density characterization in plasma
Section II Plasma-based thin film deposition
2. Plasma-enhanced ALD for next-generation thin films
3. Advances in plasma-assisted thermal evaporation for thin films and their applications
Section III Surface modification and processing-induced damage
4. Plasma functionalization of advanced polymers
5. Surface functionalization of Si, Ge, and wide-bandgap semiconductors: Techniques and applications
6. Plasma etching induced damages and defects related to SiC-based device performance
Section IV Atomic-layer and advanced plasma etching
7. Plasma and thermal atomic layer etching for processing of nanodevice structures
8. Thermal-cyclic atomic layer etching
9. Fundamental cornerstones and emerging milestones of etching technology using low-temperature plasma
10. Cryogenic plasma etching for next-generation semiconductor processing
11. Etching of β-Ga 2 O 3 : From plasma processes to plasma-free pathways
Section V Energy and environmental applications of plasma-and laser-enabled processing
12. Semiconductor nanomaterials via liquid plasma processing for energy and environmental applications
13. Future directions in plasma processing of semiconductor carbon-based materials for sustainable energy solutions
Product details
Product details
- Edition: 1
- Latest edition
- Published: October 28, 2026
- Language: English
About the editors
About the editors
Kuan Yew Cheong
Editor
Kuan Yew Cheong is a Professor in the School of Materials and Mineral Resources Engineering at Universiti Sains Malaysia (USM). He specializes in semiconductor materials, electronic packaging, nanomaterials, and surface engineering, recognized as a top 2% researcher in applied physics/materials (2023). He has contributed to research on bio-organic-based memory to address e-waste.
Affiliations and expertise
Professor, School of Materials and Mineral Resources Engineering, Universiti Sains MalaysiaBehnam Akhavan
Editor
Behnam Akhavan is an Associate Professor of Biomedical Engineering at the University of Newcastle, Australia, where he heads the Plasma Bio-engineering Research Group. His Lab develops new plasma science and surface engineering solutions for a range of modern applications, including plasma surface engineering of bone implants, cardiovascular devices, and artificial nerves; plasma polymer nanoparticles for drug delivery; electrochromic coatings for wearable electronics; and micro/nano particles for toxin removal and water purification.
Affiliations and expertise
Associate Professor, School of Biomedical Engineering, University of Newcastle, AustraliaShih-Nan Hsiao
Editor
Shih-Nan Hsiao is a Designated Professor at the Center for Low-temperature Plasma Sciences, Nagoya University, Japan. His research interests include cryogenic plasma etching, atomic layer etching, plasma diagnostics, and simulations for semiconductor processes.
Affiliations and expertise
Designated Professor, Center for Low-temperature Plasma Sciences, Nagoya University, JapanSheng-Chi Chen
Editor
Sheng-Chi Chen is a Professor in the Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on nanotechnology applications, particularly in the fields of information storage, transparent conductive oxide and nitride films, as well as magnetic films. He specializes in plasma and thin-film processes and analyses of nanomaterial thin films deposited via sputtering, evaporation, and atomic layer deposition (ALD) processes.
Affiliations and expertise
Professor, Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, TaiwanPhuoc Huu Le
Editor
Phuoc Huu Le is an Associate Professor at the Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on the development and characterization of thin films, including thermoelectric materials, topological insulators, transparent conducting oxides, metal oxides, and half-Heusler compounds. He is also deeply engaged in the fabrication of nanomaterials through plasma-based and physical-chemical methods, with applications spanning photochemical water splitting, electrochemical sensors, and nanophotocatalysts for the degradation of emerging pollutants and contaminants.
Affiliations and expertise
Associate Professor, Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan