Nano-plating (III)
Database on the Microstructure of Plated Films
- 1st Edition - November 12, 2022
- Imprint: Elsevier
- Author: Tohru Watanabe
- Language: English
- Hardback ISBN:9 7 8 - 0 - 3 2 3 - 9 9 8 9 4 - 9
- eBook ISBN:9 7 8 - 0 - 3 2 3 - 9 9 9 5 1 - 9
Nano-plating (III): Database of Plated Film Microstructures completes the trilogy of nanoplating books written by Tohru Watanabe. Nanoplating (I) covers microstructure format… Read more
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Request a sales quoteNano-plating (III): Database of Plated Film Microstructures completes the trilogy of nanoplating books written by Tohru Watanabe. Nanoplating (I) covers microstructure formation theory of plated films, with Nanoplating (II) covering a metallurgical approach to electrochemical theory and its applications to technology. This third installment shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating and provides a database of plated film microstructures. The book presents readers with an efficient reference work that helps optimize their syntheses in order to obtain specific deposit types.
- Provides a database of plated film microstructures
- Shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating
- Written by a real expert in the field who has over five decades of experience in metal electrodeposition and structural investigation
Researchers in University and Government Institutions and chemical engineers involved in electrochemical technology; Professionals in R&D and quality departments of electroplating companies
- Cover image
- Title page
- Table of Contents
- Copyright
- Nano-Plating (III)
- Preface
- Nano-Plating
- Table of contents volume I
- Nano-Plating (II)
- Preface to Nano-Plating (II)
- Table of contents volume II
- Acknowledgments
- Section I: Criteria for creating a database of plated film structures
- 1.1: Introduction
- 1.2: Plating method
- 1: Plating conditions
- 2: Substrate material
- 1.3: Indication of plated film crystallographic orientation
- Abstract
- 1.4: Phase diagram
- Section II: Database of the microstructure of plated films
- 2.1: Electrodeposited pure metal
- 1.1: Electrodeposited Ag
- 1.2: Electrodeposited Au
- 1.3: Electrodeposited Bi
- 1.4: Electrodeposited Cd
- 1.5: Electrodeposited Co
- 1.6: Electrodeposited Cr
- 1.7: Electrodeposited Cu
- 1.8: Electrodeposited Fe
- 1.9: Electrodeposited In
- 1.10: Electrodeposited Ni
- 1.11: Electrodeposited Pd
- 1.12: Electrodeposited Pt
- 1.13: Electrodeposited Ru
- 1.14: Electrodeposited Sn
- 1.15: Electrodeposited Zn
- 2.2: Electrodeposited alloy
- 2.1: Electrodeposited Ag-Cd alloy
- 2.2: Electrodeposited Ag-Co alloy
- 2.3: Electrodeposited Ag-Cu alloy [1–3]
- 2.4: Electrodeposited Ag-Fe alloy
- 2.5: Electrodeposited Ag-Ni alloy
- 2.6: Electrodeposited Ag-Pd alloy
- 2.7: Electrodeposited Ag-Sn alloy [1–10]
- 2.8: Electrodeposited Ag-Zn alloy
- 2.9: Electrodeposited Au-Co alloy
- 2.10: Electrodeposited Au-Cu alloy
- 2.11: Electrodeposited Au-Ni alloy [1,2]
- 2.12: Electrodeposited Au-Pd alloy
- 2.13: Electrodeposited Au-Sn alloy [1–5]
- 2.14: Electrodeposited Cd-Sn alloy
- 2.15: Electrodeposited Cd-Zn alloy
- 2.16: Electrodeposited Co-Cu alloy
- 2.17: Electrodeposited Co-Fe alloy [1]
- 2.18: Electrodeposited Co-Gd alloy
- 2.19: Electrodeposited Co-Mo alloy
- 2.20: Electrodeposited Co-Ni alloy [1]
- 2.21: Electrodeposited Co-Pd alloy
- 2.22: Electrodeposited Co-Pt alloy
- 2.23: Electrodeposited Co-Sm alloy
- 2.24: Electrodeposited Co-Sn alloy
- 2.25: Electrodeposited Co-W alloy
- 2.26: Electrodeposited Cr-Fe alloy
- 2.27: Electrodeposited Cr-H alloy
- 2.28: Electrodeposited Cu-Ni alloy [1–7]
- 2.29: Electrodeposited Cu-Pb alloy [1]
- 2.30: Electrodeposited Cu-Sb alloy
- 2.31: Electrodeposited Cu-Sn alloy [1]
- 2.32: Electrodeposited Cu-Zn alloy
- 2.33: Electrodeposited Fe-Mo alloy
- 2.34: Electrodeposited Fe-Ni alloy [1–11]
- 2.35: Electrodeposited Fe-P alloy
- 2.36: Electrodeposited Fe-Pd alloy
- 2.37: Electrodeposited Fe-Pt alloy
- 2.38: Electrodeposited Fe-W alloy
- 2.39: Electrodeposited Fe-Zn alloy [1]
- 2.40: Electrodeposited Ge-Pd alloy
- 2.41: Electrodeposited In-Sn alloy [1]
- 2.42: Electrodeposited In-Zn alloy
- 2.43: Electrodeposited Ni-B alloy
- 2.44: Electrodeposited Ni-Mo alloy
- 2.45: Electrodeposited Ni-P alloy
- 2.46: Electrodeposited Ni-S alloy [1]
- 2.47: Electrodeposited Ni-Sn alloy
- 2.48: Electrodeposited Ni-W alloy
- 2.49: Electrodeposited Sn-Zn alloy
- 2.3: Electroless deposited pure metal
- 3.1: Electroless plated silver
- 3.2: Electroless plated gold
- 3.3: Electroless plated cobalt
- 3.4: Electroless plated copper
- 3.5: Electroless-plated nickel (Ni) films
- 2.4: Electroless deposited alloy
- Abstract
- 4.1: Electroless plated Co-Ni alloy
- 4.2: Electroless plated Ni-B alloy
- 4.3: Electroless plated Ni-P alloy
- 2.5: Displacement pure metal
- 5.0: New mechanism of displacement plated film formation and film thickness growth
- 5.1: Displacement plated silver
- 5.2: Displacement plated gold
- 5.3: Displacement plated cadmium
- 5.4: Displacement plated copper
- 5.5: Displacement plated copper on silicon substrate
- 5.6: Displacement plated palladium on copper substrate
- 5.7: Displacement plated palladium on silicon substrate
- 5.8: Displacement plated zinc
- Index
- Edition: 1
- Published: November 12, 2022
- No. of pages (Hardback): 804
- No. of pages (eBook): 804
- Imprint: Elsevier
- Language: English
- Hardback ISBN: 9780323998949
- eBook ISBN: 9780323999519
TW
Tohru Watanabe
For many years, Tohru Watanabe worked in the Department of Applied Chemistry at Tokyo Metropolitan University. He is currently engaged in electrochemical engineering and technical consulting at the Watanabe Nano-Plating Laboratory. He organized the Nano plating Study Group and held 134 study sessions in 33 years and continues to do so. He is the author of Nano-Plating, published by Elsevier in 2004, and published many articles and several conference papers in international scientific journals, as well as several Japanese books.
Tohru Watanabe graduated from Shibaura Institute of Technology. After researching on mechanical materials in the Department of Mechanical Engineering at Tokyo Metropolitan University, he moved to the Department of Industrial Chemistry and started research on plating from there. In 1976 be obtained a doctoral degree in Engineering from Tokyo Metropolitan University. Then he was a visiting researcher at University of Sussex in the UK, a visiting professor at Beijing Institute of Technology, a lecturer at Shibaura Institute of Technology, and Chuo University, and a researcher at the Tokyo Metropolitan Industrial Research Center.
Affiliations and expertise
Watanabe Nano-Plating Laboratory, Atsugi, Kanagawa, JapanRead Nano-plating (III) on ScienceDirect