Nano-plating (III)

1. Preface

2. Criteria for creating a plating film structural database

2.1 Introduction

2.2 Plating method

2.2.1 Plating conditions

2.2.2 Substrate material

1) Rolled pure Cu polycrystalline plate

2) Electrolytic Cu foil

3) Single crystal Cu ({100}, {110}, {111} plane)

4) Stainless steel (SUS-304) plate

5) Electrodeposited Ni-P (about 25at% P) amorphous alloy plating film

6) Liquid quenched amorphous alloy foil (Nippon Amorphous Metal Co. Fe-Si-B or Fe-Co-Si-B alloy)

2.3 Indication of plated film crystallographic orientation

2.4 Phase diagram

3. Database on the structure of plated films (alphabetical order)

3.1 Electrodeposited pure metal

1-1) Electrodeposited Ag

1-2) Electrodeposited Au

1-3) Electrodeposited Bi

1-4) Electrodeposited Cd

1-5) Electrodeposited Co

1-6) Electrodeposited Cr

1-7) Electrodeposited Cu

1-8) Electrodeposited Fe

1-9) Electrodeposited In

1-10) Electrodeposited Ni

1-11) Electrodeposited Pd

1-12) Electrodeposited Pt

1-13) Electrodeposited Ru

1-14) Electrodeposited Sn

1-15) Electrodeposited Zn

1-15-2) Effect of addition of anions and cations on Electrodeposited Zn

3.2 Electrodeposited alloy

2-1) Electrodeposited Ag-Cd

2-1) Electrodeposited Ag-Co

2-3) Electrodeposited Ag-Cu

2-4) Electrodeposited Ag-Fe

2-5) Electrodeposited Ag-Ni

2-6) Electrodeposited Ag-Ni

2-7) Electrodeposited Ag-Sn

2-8) Electrodeposited Ag-Zn

2-9) Electrodeposited Al-Mn

2-10) Electrodeposited Au-Co

2-11) Electrodeposited Au-Cu

2-12) Electrodeposited Au-Ni

2-13) Electrodeposited Au-Pd

2-14) Electrodeposited Au-Sn

2-15) Electrodeposited Cd-Sn

2-16) Electrodeposited Cd-Zn

2-17) Electrodeposited Co-Cu

2-18) Electrodeposited Co-Fe

2-19) Electrodeposited Co-Gd-O

2-10) Electrodeposited Co-Mo

2-21) Electrodeposited Co-Ni

2-22) Electrodeposited Co-Pd

2-23) Electrodeposited Co-Pt

2-24) Electrodeposited Co-Sm-O

2-25) Electrodeposited Co-Sn

2-26) Electrodeposited Co-W

2-27) Electrodeposited Cr-Fe

2-28) Electrodeposited Cr-H

2-29) Electrodeposited Cu-Ni

2-30) Electrodeposited Cu-Pb

2-31) Electrodeposited Cu-Sb

2-32) Electrodeposited Cu-Zn

2-34) Electrodeposited Fe-Mo

2-35) Electrodeposited Fe-Ni

2-36) Electrodeposited Fe-P

2-37) Electrodeposited Fe-Pd

2-38) Electrodeposited Fe-Pt

2-39) Electrodeposited Fe-W

2-40) Electrodeposited Fe-Zn

2-41) Electrodeposited Ge-Pd

2-42) Electrodeposited In-Sn

2-43) Electrodeposited In-Zn

2-44) Electrodeposited Ni-B

2-45) Electrodeposited Ni-Mo

2-46) Electrodeposited Ni-P

2-47) Electrodeposited Ni-S

2-48) Electrodeposited Ni-Sn

2-49) Electrodeposited Ni-W

2-50) Electrodeposited Ni-Zn

2-51) Electrodeposited Sn-Zn

3.3 Electroless deposited pure metal

3-1) Electroless deposited Ag

3-2) Electroless deposited Au

3-3) Electroless deposited Co

3-4) Electroless deposited Cu

3-5) Electroless deposited Ni

3.4 Electroless deposited alloy

4.1) Electroless deposited Co-Ni

4.2) Electroless deposited Ni-B

4.3) Electroless deposited Ni-P

3.5 Displacement pure metal

5-0) Formation mechanism of displacement plated film

5-1) Displacement Ag

5-2) Displacement Ag

5-3) Displacement Cd

5-4) Displacement Cu

5-5) Displacement Cu on Si substrate

5-6) Displacement Pd

5-7) Displacement Pd on Si substrate

5-8) Displacement Zn