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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

  • 1st Edition - November 14, 2019
  • Authors: Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao
  • Language: English
  • Paperback ISBN:
    9 7 8 - 0 - 0 8 - 1 0 2 5 3 2 - 1
  • eBook ISBN:
    9 7 8 - 0 - 0 8 - 1 0 2 5 3 3 - 8

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testi… Read more

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.