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Metallurgical Coatings 1988
Proceedings of the 15th International Conference on Metallurgical Coatings, San Diego, CA, U.S.A., April 11–15, 1988
- 1st Edition - November 14, 2012
- Editor: R Krutenat
- Language: English
- Paperback ISBN:9 7 8 - 0 - 0 8 - 0 9 7 8 8 3 - 3
- eBook ISBN:9 7 8 - 0 - 0 8 - 0 9 8 4 8 5 - 8
Metallurgical coatings 1988 is a compilation of the proceedings of the 15th International Conference on Metallurgical Coatings. This volume is divided into four parts, which deal… Read more
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Request a sales quoteMetallurgical coatings 1988 is a compilation of the proceedings of the 15th International Conference on Metallurgical Coatings. This volume is divided into four parts, which deal with synthesis and properties of coatings used in microelectronic applications; methods of characterizing coatings and modified surfaces; protective coatings for magnetic and optical thin film media; and thick and thin film censors. The first part of this volume is further subdivided into five sections focusing on thin film barrier layers, metallization for VLSI circuits, thin films used in packaging technology, new materials and emerging technologies and synthesis and microstructure of high Tc superconductors. The second part is also subdivided into four sections, each presenting different methods, such as the surface and thin film analysis techniques, microstructural characterization techniques, mechanical properties of films and coatings, and non-destructive characterization techniques. Part three discusses the preparation and characterization of reactively sputtered silicon nitride thin films, the bond structures and properties of chemically vapor-deposited amorphous SiC, and the wear of Co-Ni thin film magnetic recording tape against metallic and ceramic surfaces. Finally, this volume explores the insert-mounted thin film sensors for real-time.
Synthesis and Properties of Coatings Used in Microelectronic Applications
Thin film barrier layers
Reaction kinetics in tungsten/barrier metal/silicon systems
Reactively sputtered indium oxide diffusion barrier
Al3Ti formation by diffusion of aluminum through titanium
Chemical stability of vanadium boride with aluminum
Metallization for VLSI circuits
The deposition mechanisms and microstructures of tungsten films produced by silicon reduction of WF6
A comparison of the step coverage of aluminum coatings produced by two sputter magnetron systems and a dual-beam ion system
Reactive-ion-etch-compatible metallization for partially covered contact applications
Effect of encapsulation on the reaction between palladium and GaAs thin films
Thin films used in packaging technology
Process technology for packing applications
Coatings for strain compliance in plastic packages: opportunities and realities
Interface interactions relevant to packaging technology
The reliability of integrated circuits protected with Ti-W/Au bumps
Focused electron and ion beam repair strategies for wafer-scale interconnections in thin film packaging
New materials and emerging technologies
Characterization of HfBx films deposited by r.f. diode and r.f. magnetron sputtering
Ceramic beams and thin film growth
Nitrides of titanium, niobium, tantalum and molybdenum grown as thin films by the atomic layer epitaxy method
In0.30Al0.70As /In0.30Ga0.70As quasi-insulating gate strained-layer field effect transistors grown by molecular beam epitaxy
Synthesis and microstructure of high Tc superconductors
Thermally sprayed coatings of YBa2Cu306 + x
Growth and properties of YBa2Cu307 - x superconducting thin films
Effects of deposition conditions on the superconducting properties of r.f. and d.c. magnetron sputter-deposited YBa2Cu307 - x films
Methods of Characterizing Coatings and Modified Surfaces
Surface and thin film analysis techniques
Analysis of TiN by charged particle beams: nuclear reaction analysis, nuclear reaction broadening and Rutherford backscattering
An evaluation of four computer modelling programs for Rutherford backscattering spectrometry analysis of oxidized surfaces
Resonant low energy electrons and their impact on non-destructive depth profiling of thin film samples
Chemical characterization of the deactivation and protection of FeTi thin films using complementary non-destructive techniques
Microstructural characterization techniques
Structural changes induced by heating in electroless nickel-phosphorus alloys
Plasma spraying o f WO3: structural characterization of the coatings
Electrical insulating properties of r.f.-sputtered magnesia coatings
X-ray microfluorescence analyzer for multilayer metal films
A transmission electron microscopy study on the crystallization of amorphous Ni-P electroless deposited coatings
Structure and properties of ion sulphocarbonitrided coatings on several structural steels
Mechanical properties of films and coatings
Mechanical behavior of aluminum and Al-Cu(2%) thin films
Microhardness and microstructure of ion-beam-sputtered, nitrogen-doped NiFe films
Effects of neutral gas incorporation in molybdenum coatings produced by magnetron sputtering
Non-destructive characterization techniques
Variable angle spectroscopic ellipsometry: a non-destructive characterization technique for ultrathin and multilayer materials
Simultaneous determination of dispersion relation and depth profile of thorium fluoride thin film by spectroscopic ellipsometry
Microscopic bubble formation and collapse at liquid-solid interfaces during electrical powering of thin film structures
Optical second harmonic generation as a probe of interface composition and structure
Slow positron annihilation spectroscopy of heterojunctions and homo-junction s of GaAs-based semiconductor thin films
Protective Coatings for Magnetic and Optical Thin Film Media
Preparation and characterization of reactively sputtered silicon nitride thin films
The bond structures and properties of chemically vapour deposited amorphous SiC
Wear of Co-Ni thin film magnetic recording tape against metallic and ceramic surfaces
Thick and Thin Film Censors
Insert-mounted thin film sensors for real-time monitoring of tool conditions
Author Index
Subject Index
- No. of pages: 412
- Language: English
- Edition: 1
- Published: November 14, 2012
- Imprint: Elsevier
- Paperback ISBN: 9780080978833
- eBook ISBN: 9780080984858
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