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Materials Science of Thin Films
Depositon and Structure
- 2nd Edition - October 15, 2001
- Author: Milton Ohring
- Language: English
- Paperback ISBN:9 7 8 - 1 - 4 9 3 3 - 0 1 7 2 - 0
- Hardback ISBN:9 7 8 - 0 - 1 2 - 5 2 4 9 7 5 - 1
- eBook ISBN:9 7 8 - 0 - 0 8 - 0 4 9 1 7 8 - 3
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded re… Read more
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Request a sales quoteThis is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.
Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
Advanced undergraduate and first-year graduate students in materials science and electrical engineering; researchers in industrial in-house courses, or short courses offered by professional societies
Chapter 1 A Review of Materials Science 1.1. Introduction1.2. Structure1.3. Defects in Solids 1.4. Bonds and Bands in Materials 1.5. Thermodynamics of Materials 1.6. Kinetics1.7. Nucleation 1.8. An Introduction to Mechanical Behavior1.9. ConclusionExercisesReferencesChapter 2 Vacuum Science and Technology 2.1. Introduction2.2. Kinetic Theory of Gases 2.3. Gas Transport and Pumping 2.4. Vacuum Pumps2.5. Vacuum Systems 2.6. ConclusionExercisesReferencesChapter 3 Thin-Film Evaporation Processes3.1. Introduction3.2. The Physics and Chemistry of Evaporation 3.3. Film Thickness Uniformity and Purity3.4. Evaporation Hardware3.5. Evaporation Processes and Applications 3.6. ConclusionExercisesReferencesChapter 4 Discharges, Plasmas, and Ion-Surface Interactions4.1. Introduction 4.2. Plasmas, Discharges, and Arcs 4.3. Fundamentals of Plasma Physics 4.4. Reactions in Plasmas4.5. Physics of Sputtering 4.6. Ion Bombardment Modification of Growing Films4.7. ConclusionExercisesReferencesChapter 5 Plasma and Ion Beam Processing of Thin Films5.1. Introduction 5.2. DC, AC, and Reactive Sputtering Processes5.3. Magnetron Sputtering5.4. Plasma Etching5.5. Hybrid and Modified PVD Processes 5.6. ConclusionExercisesReferencesChapter 6 Chemical Vapor Deposition6.1. Introduction6.2. Reaction Types 6.3. Thermodynamics of CVD 6.4. Gas Transport6.5. Film Growth Kinetics 6.6. Thermal CVD Processes 6.7. Plasma-Enhanced CVD Processes 6.8. Some CVD Materials Issues 6.9. Safety6.10. Conclusion ExercisesReferencesChapter 7 Substrate Surfaces and Thin-Film Nucleation 7.1. Introduction 7.2. An Atomic View of Substrate Surfaces 7.3. Thermodynamic Aspects of Nucleation7.4. Kinetic Processes in Nucleation and Growth 7.5. Experimental Studies of Nucleation and Growth7.6. Conclusion ExercisesReferencesChapter 8 Epitaxy8.1. Introduction8.2. Manifestations of Epitaxy8.3. Lattice Misfit and Defects in Epitaxial Films8.4. Epitaxy of Compound Semiconductors8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films8.7. Mechanisms and Characterization of Epitaxial Film Growth8.8. ConclusionExercisesReferences Chapter 9 Film Structure9.1. Introduction9.2. Structural Morphology of Deposited Films and Coatings9.3. Computational Simulations of Film Structure9.4. Grain Growth, Texture, and Microstructure Control in Thin Films9.5. Constrained Film Structures9.6. Amorphous Thin Films 9.7. ConclusionExercisesReferencesChapter 10 Characterization of Thin Films and Surfaces10.1. Introduction10.2. Film Thickness10.3. Structural Characterization of Films and Surfaces10.4. Chemical Characterization of Surfaces and Films10.5. ConclusionExercisesReferencesChapter 11 Interdiffusion, Reactions, and Transformations in Thin Films11.1. Introduction 11.2. Fundamentals of Diffusion11.3. Interdiffusion in Thin Metal Films11.4. Compound Formation and Phase Transformations in Thin Films11.5. Metal-Semiconductor Reactions11.6. Mass Transport in Thin Films under Large Driving Forces11.7. ConclusionExercisesReferencesChapter 12 Mechanical Properties of Thin Films 12.1. Introduction12.2. Mechanical Testing and Strength of Thin Films 12.3. Analysis of Internal Stress12.4. Techniques for Measuring Internal Stress in Films12.5. Internal Stresses in Thin Films and Their Causes12.6. Mechanical Relaxation Effects in Stressed Films12.7. Adhesion12.8. ConclusionExercisesReferences
- No. of pages: 816
- Language: English
- Edition: 2
- Published: October 15, 2001
- Imprint: Academic Press
- Paperback ISBN: 9781493301720
- Hardback ISBN: 9780125249751
- eBook ISBN: 9780080491783
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Milton Ohring
Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.
Affiliations and expertise
Stevens Institute of Technology, Hoboken, NJ, USA (Retired)Read Materials Science of Thin Films on ScienceDirect