Introduction to Microelectronics

Preface to Second Edition

Preface to First Edition


1. Basic Theory


1.1. Introduction


1.2. Energy Bands in Solids


1.3. The Fermi Energy Level


1.4. Extrinsic Semiconductors


1.5. The p—n Junction


1.5.1. The Bipolar Junction Transistor


1.6. The Metal—Semiconductor Junction


1.7. The Metal—Insulator—Semiconductor (MIS) Junction


1.7.1. The Metal—Insulator—Semiconductor Transistor


1.8. Effective Mass of a Carrier


1.9. Carrier Mobilities


1.10. Crystalline Structure


2. Processing of Silicon Devices and Circuits


2.1. Introduction


2.2. Preparation of Artwork


2.3. Photo-sensitive Resists


2.4. Masking and Diffusion


2.4.1. Gold Diffusion


2.5. Metallization


2.6. Epitaxial Growth


2.7. Alloyed Junctions


2.8. Summary


3. Silicon Planar Devices and Integrated Circuits


3.1. Introduction


3.2. The Bipolar Planar Transistor


3.3. The Planar Diode


3.4. The Silicon Integrated Circuit


4. Bipolar Logic Circuits


4.1. Introduction


4.2. Basic Logic Functions


4.3. Performance Specifications


4.4. Logic Circuits


4.5. Comparison of Logic Gates


4.6. Schottky TTL


4.7. Merged Transistor Logic


5. Differential Amplifiers


5.1. Introduction


5.2. The Differential Amplifier


5.3. The Integrated Operational Amplifier


6. Metal—Insulator—Semiconductor Devices


6.1. Introduction


6.2. The Basic MOST Mechanism


6.3. MOST Symbols. Substrate Bias


6.4. Threshold Voltage


6.5. The Polysilicon Gate


6.6. N-Channel Devices


6.7. Complementary Metal—Oxide—Semiconductor (CMOS) Devices


6.8. Silicon on Sapphire (SOS)


6.9. Other Developments


6.10. Equations for the MOST


6.11. The MOST as a Resistor


6.12. Input Impedance of a MOST


6.13. Charge Coupled Devices (CCDs)


7. MOS Circuits


7.1. In troduction


7.2. The Basic Inverter (or Negate) Circuit


7.3. The Basic NOR Gate


7.4. The Basic NAND Gate


7.5. Comparison of Areas Required for the Basic NAND and NOR Gates


7.6. NAND—NOR Gate


7.7. Small-signal Analog Amplifier


7.8. Large-signal Analog Amplifier


7.9. MOSTs as Frequency Doublers


7.10. CCD Applications


7.11. The CMOS Inverter


8. Thin-film Circuits


8.1. Introduction


8.2. Thin-film Deposition Methods


8.3. Masking and Pattern-making Methods


8.4. Thin-film Resistors


8.5. Thin-film Capacitors


8.6. The Thin-film Transistor


9. Thick-film Circuits


9.1. Introduction


9.2. The Silk-screen Process


9.3. Resistors


9.4. Capacitors


9.5. Conductor Patterns and Substrates


10. Hybrid Circuits


10.1. Introduction


10.2. Hybrid Assembly on a Chip


10.3. Hybrid Bonding Methods and Circuits


11. Microwave Applications of Microelectronics


11.1 Introduction


11.2. Passive Components and Microstrip Transmission Lines


11.3. Microwave Solid-state Power Sources


11.4. High Frequency Transistors


11.5. Metal—Semiconductor Junction Devices


11.5.1. The Schottky Barrier Diode


11.5.2. Gallium Arsenide Field Effect Transistors


12. Semiconductor Memories


12.1. Introduction


12.2. Some Commonly Used Terms


12.3. Read Only Memories (ROMs)


12.4. Random Access Memories (RAMs)


12.5. Non-volatile Semiconductor Memories (NVSMs)


12.6. Shift Registers

Appendix. Commonly Used Abbreviations

Index