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Industry Standard FDSOI Compact Model BSIM-IMG for IC Design helps readers develop an understanding of a FDSOI device and its simulation model. It covers the physics and operation… Read more
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Industry Standard FDSOI Compact Model BSIM-IMG for IC Design helps readers develop an understanding of a FDSOI device and its simulation model. It covers the physics and operation of the FDSOI device, explaining not only how FDSOI enables further scaling, but also how it offers unique possibilities in circuits. Following chapters cover the industry standard compact model BSIM-IMG for FDSOI devices. The book addresses core surface-potential calculations and the plethora of real devices and potential effects. Written by the original developers of the industrial standard model, this book is an excellent reference for the new BSIM-IMG compact model for emerging FDSOI technology.
The authors include chapters on step-by-step parameters extraction procedure for BSIM-IMG model and rigorous industry grade tests that the BSIM-IMG model has undergone. There is also a chapter on analog and RF circuit design in FDSOI technology using the BSIM-IMG model.
Semiconductor engineers, Materials Scientists, Circuit Designers, Researchers in electronic devices and circuits
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Yogesh Singh Chauhan is a Professor at the Indian Institute of Technology in Kanpur, India. He is the developer of several industry standard SPICE models, including the ASM-HEMT model and the BSIMBULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4, and BSIM-SOI models. His research interests encompass the characterization, modeling, and simulation of semiconductor devices and RF circuit design. He is a Fellow of IEEE and the Indian National Academy of Engineering. He is the Editor of IEEE Transactions on Electron Devices and Distinguished Lecturer of the IEEE Electron Devices Society. He is the chairperson of the IEEE-EDS Compact Modeling Committee and IEEE Uttar Pradesh section. He has published more than 400 papers in international journals and conference proceedings.
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