Handbook of Deposition Technologies for Films and Coatings

Science, Applications and Technology

2nd Edition - December 31, 1994
Author: Rointan F. Bunshah
Editor: Rointan F. Bunshah
Language: English
eBook ISBN:
9 7 8 - 0 - 0 8 - 0 9 4 5 8 8 - 0
eBook ISBN:
9 7 8 - 0 - 8 1 5 5 - 1 7 4 6 - 7

This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications.… Read more

Handbook of Deposition Technologies for Films and Coatings

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This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. Considerably more material was added in Plasma Assisted Vapor Deposition processes, as well as Metallurgical Coating Applications.

1. Deposition Technologies: An Overview 1.0 The Market 2.0 Introduction 3.0 Aim and Scope 4.0 Definitions and Concepts 5.0 Physical Vapor Deposition (PVD) Process Terminology 6.0 Classification of Coating Processes 7.0 Gas Jet Deposition with Nano-Particles 8.0 Microstructure and Properties 9.0 Unique Features of Deposited Materials and Gaps In Understanding 10.0 Current Applications 11.0 ""Frontier Areas"" for the Application of the Products of Deposition Technology 12.0 Selection Criteria 13.0 Summary Appendix 1: Deposition Process Definitions References2. Plasmas in Deposition Processes 1.0 Introduction 2.0 Particle Motion 3.0 Collective Phenomena 4.0 Plasma Discharges 5.0 Plasma Volume Reactions 6.0 Surface Reactions References3. Surface Preparation for Film and Coating Deposition Processes 1.0 Introduction 2.0 Contamination 3.0 Environment Control 4.0 Cleaning Processes 5.0 Drying and Outgassing 6.0 Monitoring of Cleaning 7.0 In Situ Cleaning 8.0 Plasmas 9.0 Storage and Handling 10.0 Activation and Sensitization 11.0 Surface Modification 12.0 Passivation and Preservation 13.0 Safety References4. Evaporation: Processes, Bulk Microstructures and Mechanical Properties 1.0 General Introduction 2.0 Scope 3.0 PVD Processes 4.0 Theory and Mechanisms 5.0 Evaporation Process and Apparatus 6.0 Evaporation Sources 7.0 Laser Induced Evaporation/Laser Ablation/Pulsed Laser Deposition (PLD) 8.0 Deposition Rate Monitors and Process Control 9.0 Deposition of Various Materials 10.0 Microstructure of PVD Condensates 11.0 Physical Properties of Thin Films 12.0 Mechanical and Related Properties 13.0 Purification of Metals by Evaporation Appendix References5. Sputter Deposition Processes 1.0 Introduction 2.0 Sputtering Mechanisms 3.0 Sputter Deposition Techniques 4.0 Sputter Deposition Modes References6. Ion Plating 1.0 Introduction 2.0 Processing Plasma 3.0 Generation of Plasmas 4.0 Plasma Chemistry 5.0 Bombardment Effects on Surfaces 6.0 Sources of Depositing Atoms 7.0 Reactive Ion Plating 8.0 Bombardment Effects on Film Properties 9.0 Ion Plating System Requirements 10.0 Process Monitoring and Control 11.0 Problem Areas 12.0 Applications 13.0 Summary References7. Chemical Vapor Deposition 1.0 Introduction 2.0 Important Reaction Zones in CVD 3.0 Design of CVD Experiments 4.0 Gas Flow Dynamics 5.0 Rate-Limiting Steps During CVD 6.0 Reaction Mechanisms 7.0 Nucleation 8.0 Surface Morphology and Microstructure of CVD Materials 9.0 Selective Deposition 10.0 Some Applications of the CVD Technique 11.0 Outlook References8. Plasma-Enhanced Chemical Vapor Deposition 1.0 Introduction 2.0 Reactor Influence on Plasma Behavior 3.0 Films Deposited by CVD References9. Plasma-Assisted Vapor Deposition Processes: Overview 1.0 Introduction 2.0 Plasma-Assisted Deposition Processes 3.0 Model of a Deposition Process 4.0 Materials Deposited by Reactive Vapor Deposition Processes 5.0 Key Issues in Plasma-Assisted Reactive Vapor Deposition Processes 6.0 Plasma-Assisted Deposition Techniques in Current Usage 7.0 Limitations of Current Plasma-Assisted Techniques 8.0 Hybrid Processes 9.0 Conclusions References10. Deposition from Aqueous Solutions: An Overview 1.0 Introduction 2.0 General Principles 3.0 Electrodeposition 4.0 Processing Techniques 5.0 Selection of Deposit 6.0 Selected Special Processes 7.0 Structures and Properties of Deposits 8.0 Summary Appendix A: Preparation of Substrates for Electroplating Appendix B: Representative Electroless Plating Solution Formulation Appendix C: Comparison of Aluminum Anodizing Processes (Types I, II and III) References11. Advanced Thermal Spray Deposition Techniques 1.0 Introduction 2.0 Equipment and Processes 3.0 Total Coating Process 4.0 Coating Structure and Properties 5.0 Summary References12. Non-Elemental Characterization of Films and Coatings 1.0 Introduction 2.0 Characterization 3.0 Film Formation 4.0 Elemental And Structural Analysis 5.0 Some Property Measurements 6.0 Summary References13. Nucleation, Film Growth, and Microstructural Evolution 1.0 Introduction 2.0 Nucleation and the Early Stages of Film Growth 3.0 Computer Simulations of Microstructure Evolution 4.0 Microstructure Evolution and Structure-Zone 5.0 Effects of Low-Energy Ion Irradiation During Film Growth References14. Metallurgical Applications 1.0 Introduction 2.0 Corrosion 3.0 Galvanic Corrosion 4.0 EMF and Galvanic Series 5.0 Coatings for Galvanic Corrosion 6.0 Methods of Deposition of Metallic Coatings 7.0 Examples of Corrosion-Resistant Coatings 8.0 High Temperature Oxidation/Corrosion 9.0 Friction and Wear 10.0 Coatings to Reduce Friction and Wear References15. Characterization of Thin Films and Coatings 1.0 Introduction 2.0 Surface Analysis Techniques 3.0 Imaging Analysis Techniques 4.0 Optical Analysis Techniques References16. Jet Vapor Deposition 1.0 Introduction 2.0 Principles and Apparatus of JVD 3.0 Discussion 4.0 Examples of JVD Films and Applications 5.0 Summary ReferencesIndex

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