
Electronics Reliability and Measurement Technology
Nondestructive Evaluation
- 1st Edition - August 8, 2011
- Latest edition
- Author: Joseph S. Heyman
- Editor: Joseph S. Heyman
- Language: English
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details… Read more

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Quality assurance managers and reliability engineers in the electronics industry.
Measurement Science and Manufacturing Science Research  The Members Dollar  SRC Structure  An Industry View of the Future Direction of Manufacturing Science (Through 1955) Generated by the TAB Manufacturing Sciences Committee  Future Directions of the Manufacturing Sciences Program  Major Trends-Semiconductors  Equipment Implications  Semiconductor Equipment Business  Semiconductor Capital Investment Plans  Worldwide Sales Forecast  1985 Semiconductor Equipment Sales  Major Trends-Semiconductor Equipment  Programs  Manufacturing Sciences Principal Thrusts  The SRC/University of Michigan Program in Automated Semiconductor Manufacturing  Manufacturing Sciences Significant AccomplishmentsNondestructive SEM for Surface and Subsurface Wafer Imaging  Introduction  Image Processing Storage and Retrieval  Time Resolved Capacitive Coupling Voltage Contrast  Nondestructive Subsurface Imaging of Semiconductors  ReferencesSurface Inspection-Research and Development  Introduction  Trends in Surface Analysis  New Front End Detection Techniques  Tool Development  Research Topics  Sensors Developed for In-Process Thermal Sensing and Imaging  ReferencesWafer Level Reliability for High-Performance VLSI Design  Introduction  Wafer Level Tests  Wafer Level Electromigration Tests  Mobile Ion Contamination  Schottky Diode Structures  Wafer Level Device Reliability  Future Wafer Level Testing  Conclusions  ReferencesWafer Level Reliability Testing: an Idea Whose Time Has Come  Planting Seeds  Initial Results  With or Without Wafer Level Reliability Testing  CAR  1986 WorkshopMicro-Focus X-Ray Imaging  Introduction  The Need for Solder Quality Inspection  Stress and Electrical Testing  Visual Inspection  Structural Inspection  Developing a Solder Quality Inspection machine  Results Achieved with the First Machine  The Importance of Accept/Reject Thresholds  The ""Structural"" Solder Quality Standards Problem  ConclusionsMeasurement of Opaque Film Thickness  Introduction  Description of Thermal Waves and Experimental Technique  Thermal Diffusivity of an Isotropic Solid  Theoretical Framework for Thin Film Calculations  Numerical Calculations and Experimental Results: Cu Film on Glass  Summary and Conclusions  ReferencesIntelligent Laser Soldering Inspection and Process Control  Introduction  Novel Approach: Thermal Flow  The Laser/Inspect System  Statistical Data  Inspecting Tab Assemblies  Intelligent Laser SoldererRupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits  Introduction  Type of Interconnecting Material  The Control of Microcracking in Type E Copper  Hot Rupture Testing  Setting Quality Control Standards-Dynamic Rupture  Quality Control by Creep-Rupture Testing  Summary and Conclusions  ReferencesHeterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement  Holographic Interferometry  Applications in Electronics (Documented)  Other Applications  Homodyne Construction  Homodyne Display  Heterodyne Recording  Contouring Using HHI  Quasi-Heterodyne Readout  Wear Contours  Heterodyne Readout  Wear Contours  Surface Acoustic Wavefront  Advantages  Limitations""Whole Wafer"" Scanning Electron Microscopy  Historical Perspective  Step Coverage Parameters  Today's Response by Industry  Choices/Status  Courses of Action  Whole Wafer Scanning Exposes the Wafer  Back Matter
- Edition: 1
- Latest edition
- Published: August 8, 2011
- Language: English
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