Compatibility and Testing of Electronic Components
- 1st Edition - August 10, 2016
- Imprint: Butterworth-Heinemann
- Author: C. E. Jowett
- Language: English
- Paperback ISBN:9 7 8 - 1 - 4 8 3 1 - 0 9 6 9 - 5
- eBook ISBN:9 7 8 - 1 - 4 8 3 1 - 0 3 3 5 - 8
Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such… Read more
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Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such thresholds; their identification; and the various tests used in their detection. The book covers topics such as the interconnection of miniature passive components; the integrated circuit compatibility and its components; the semiconductor joining techniques; and the thin film hybrid approach in integrated circuits. Also covered are topics such as thick film resistors, conductors, and insulators; thin inlays for electronic applications; and humidity corrosion of metallic resistors. The text is recommended for electrical engineers who would like to know more about electrical components, especially those who are interested in the fields of thin films and integrated circuitry.
Contents1 Introduction 2 Integrated Circuit Compatibility 3 Survey of Semiconductor Joining Techniques 4 Commercial Application of Thick Film Hybrids 5 Thin Film Hybrid Approach to Integrated Circuits 6 Factors Affecting Thick Film Devices 7 Adhesion of Platinum-Gold Glaze Conductors 8 Thin Inlays for Electronic Applications 9 Humidity Corrosion of MetalUc Resistors 10 The Interface Between Glaze Resistors 11 Confusion in Multilayer Systems 12 Dielectric Formulations for Screened Ceramic Microcircuit Substrates 13 Failure Modes in Thin Film Circuits14 Specifying Resistance Temperature Stability 15 Poly-Para-Xylylene in Thin Film Applications 16 Thin Film A1-A12O3-A1 Capacitors 17 Compatible Fabrication of Tantalum Thin Film Integrated Circuits 18 Silicon Oxide Micromodule Capacitors 19 Chip Capacitors in Hybrid Microelectronics 20 Design Construction and Testing of Miniature Relays 21 Compatibility of Flexible Film Wiring 22 The Purpose of Testing 23 Reliability Screening Using Infrared Radiation 24 Environmental and Life Testing of Magnetic Components 25 Searching for Incompatibility in Integrated Circuits 26 Encapsulated Component Stress Testing Index
- Edition: 1
- Published: August 10, 2016
- Imprint: Butterworth-Heinemann
- Language: English
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