Books in Design manufacturing and testing

11-20 of 24 results in All results

Demystifying Mixed Signal Test Methods

• 1st Edition
• May 9, 2003
• Mark Baker
• English
• eBook 978-0-08-049106-6

  9 7 8 - 0 - 0 8 - 0 4 9 1 0 6 - 6

Mixed Signal Test Methods Demystified is a less theoretical, less mathematical, and more applications-oriented approach than other books available on the topic. In effect, this book will give readers a "just in time" understanding of the essentials of mixed signal testing techniques. Emphasis will be on commonly used devices and systems (such as PLLs and DSP) that engineers encounter in their daily tasks. Sampling theory is covered in detail, as this is the foundation for understanding all mixed signal testing technique, and readers will have a strong intuitive grasp of this topic after finishing this book.Baker aims to develop an intuitive understanding of mixed signal testing that minimizes the mathematics required and is germane to the sort of testing requirements found in typical engineering situations.

Reflow Soldering Processes

• 1st Edition
• January 24, 2002
• Ning-Cheng Lee
• English
• eBook 978-0-08-049224-7

  9 7 8 - 0 - 0 8 - 0 4 9 2 2 4 - 7

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

Oscilloscopes

• 5th Edition
• November 17, 2000
• Ian Hickman
• English
• Paperback 978-0-7506-4757-1

  9 7 8 - 0 - 7 5 0 6 - 4 7 5 7 - 1
• eBook 978-0-08-051342-3

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Oscilloscopes are essential tools for checking circuit operation and diagnosing faults, and an enormous range of models are available. But which is the right one for a particular application? Which features are essential and which not so important? Ian Hickman has the answers. This handy guide to oscilloscopes is essential reading for anyone who has to use a 'scope for their work or hobby: electronics designers, technicians, anyone in industry involved in test and measurement, electronics enthusiasts... Ian Hickman's review of all the latest types of 'scope currently available will prove especially useful for anyone planning to buy - or even build - an oscilloscope. The science and electronics of how oscilloscopes work is explained in order to enhance the reader's appreciation of how to use their 'scope. The practical use of oscilloscope is explained with clarity and supported with examples, encouraging the reader to think about the application of their oscilloscope and improve their use of this complex instrument. The advance of digital technology makes this timely revision of Ian Hickman's well known book an essential update for electronics professionals and enthusiasts alike.

Skew-Tolerant Circuit Design

• 1st Edition
• May 22, 2000
• David Harris
• English
• eBook 978-0-08-054126-6

  9 7 8 - 0 - 0 8 - 0 5 4 1 2 6 - 6

As advances in technology and circuit design boost operating frequencies of microprocessors, DSPs and other fast chips, new design challenges continue to emerge. One of the major performance limitations in today's chip designs is clock skew, the uncertainty in arrival times between a pair of clocks. Increasing clock frequencies are forcing many engineers to rethink their timing budgets and to use skew-tolerant circuit techniques for both domino and static circuits. While senior designers have long developed their own techniques for reducing the sequencing overhead of domino circuits, this knowledge has routinely been protected as trade secret and has rarely been shared. Skew-Tolerant Circuit Design presents a systematic way of achieving the same goal and puts it in the hands of all designers.This book clearly presents skew-tolerant techniques and shows how they address the challenges of clocking, latching, and clock skew. It provides the practicing circuit designer with a clearly detailed tutorial and an insightful summary of the most recent literature on these critical clock skew issues.

Encapsulation Technologies for Electronic Applications

• 1st Edition
• April 1, 2000
• Haleh Ardebili + 1 more
• English
• Hardback 978-0-8155-1576-0

  9 7 8 - 0 - 8 1 5 5 - 1 5 7 6 - 0
• eBook 978-0-8155-1970-6

  9 7 8 - 0 - 8 1 5 5 - 1 9 7 0 - 6

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

Practical Radio Frequency Test and Measurement

• 1st Edition
• September 17, 1999
• Joseph Carr
• English
• eBook 978-0-08-051434-5

  9 7 8 - 0 - 0 8 - 0 5 1 4 3 4 - 5

Practical Radio Frequency Test and Measurement will teach readers the basics of performing the tests and measurements used in radio-frequency systems installation, proof of performance, maintenance, and troubleshooting. Practical Radio Frequency Test and Measurement teaches readers the basics of performing the tests and measurements used in radio-frequency systems installation, proof of performance, maintenance, and troubleshooting. Anyone interested in gaining more practical proficiency with RF, whether engineer, technician, amateur radio buff, or hobbyist, needs a copy of this book. Joseph J. Carr, himself an accomplished practitioner in this field, examines the instruments used in the various types of measurement before moving on to specific measurement methods. Carr includes information on basic theories of RF measurement, as well as test equipment, test set-ups, test and measurement procedures, and interpretation of results.

Make It! The Engineering Manufacturing Solution

• 1st Edition
• August 17, 1999
• John Garside
• English
• Hardback 978-0-7506-4569-0

  9 7 8 - 0 - 7 5 0 6 - 4 5 6 9 - 0
• eBook 978-0-08-051067-5

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Manufacturing operations are the real wealth creators within a business, accounting for the majority of management and financial assets needed to sustain the company. Make it! encapsulates the author's many years of experience gained designing manufacturing systems and supply-chains in factories across the world. It provides a proven, logical sequence of events needed to design effective modular factories capable of competing with the world's best. In their 1999 'Best-Managed' Companies Awards, 'Aviation Week and Space Technology' (Vol. 150, No. 22) quoted the author's former company, Lucas Aerospace, as achieving 'Most improved major aerospace company 1994 - 1998' status, ranking it second in Competitiveness, assessed by an amalgamation of asset utilisation, productivity and financial stability. This book has been written for managers charged with the responsibility for improving business profitability and for engineers facing the challenge of introducing more cost effective manufacturing processes. Many manufacturing businesses have failed to invest adequate resources in designing factory operations, mainly due to the lack of expertise and detailed knowledge needed to undertake this demanding task. John Garside is a Principal Fellow at Warwick International Manufacturing Group, The University of Warwick. This follows an extensive industrial career in highly competitive first tier system and component manufacturing businesses, who supplied many of the world's leading aerospace, automotive and industrial equipment makers.

Soldering in Electronics Assembly

• 2nd Edition
• March 26, 1999
• MIKE JUDD + 1 more
• English
• Hardback 978-0-7506-3545-5

  9 7 8 - 0 - 7 5 0 6 - 3 5 4 5 - 5
• eBook 978-0-08-051734-6

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Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

SMT Soldering Handbook

• 2nd Edition
• February 24, 1998
• RUDOLF STRAUSS
• English
• eBook 978-0-08-048097-8

  9 7 8 - 0 - 0 8 - 0 4 8 0 9 7 - 8

Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment.

Quality and Standards in Electronics

• 1st Edition
• June 5, 1997
• Ray Tricker
• English
• eBook 978-0-08-093843-1

  9 7 8 - 0 - 0 8 - 0 9 3 8 4 3 - 1

A manufacturer or supplier of electronic equipment or components needs to know the precise requirements for component certification and quality conformance to meet the demands of the customer. This book ensures that the professional is aware of all the UK, European and International necessities, knows the current status of these regulations and standards, and where to obtain them.