ROBOTICS & AUTOMATION
Empowering Progress
Up to 25% off Essentials Robotics and Automation titles
Understanding Fabless IC Technology
- 1st Edition - August 14, 2007
- Authors: Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
- Language: English
- Paperback ISBN:9 7 8 - 0 - 7 5 0 6 - 7 9 4 4 - 2
- eBook ISBN:9 7 8 - 0 - 0 8 - 0 5 5 1 1 9 - 7
Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will… Read more
Purchase options
Institutional subscription on ScienceDirect
Request a sales quoteFabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. “Fabless” ICs are those designed and marketed by one company but actually manufactured by another.
*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members*Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations*Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control
IC engineers, design engineers (analog and digital), engineering management.
PART 1 – Manufacturing Strategies: Understanding Fabless IC TechnologyChapter 1: More than a Decade of Transition in the Semiconductor Industry1.1 FSA is Established1.2 Early Success1.3 Early Success Trend Continues1.4 Semiconductor Business Models1.5 Outsourcing Will Accelerate1.6 IDMs are Going Fabless1.7 A Case Study: Cypress Semiconductor1.8 More IDMs are Outsourcing1.9 Geographic Manufacturing CentersChapter 2: Fabless Semiconductor Manufacturing2.1 Foundry Revenue Growth2.2 Semiconductor Back-End Services2.3 Semiconductor Equipment Chapter 3: Qualities of Successful Fabless Companies3.1 Defining Events for the Fabless Market3.2 Thriving in the Fabless Model3.3 Key Qualities for Success3.4 The Future of Fabless PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business ModelChapter 4: Semiconductor Manufacturing Basics4.1 Semiconductor Processes4.2 Semiconductor Manufacturing Steps4.3 Wafer Size4.4 Manufacturing Costs4.5 ConclusionChapter 5: Fabless ASICs2.1 Introduction5.2 Origins of the ASIC Industry5.3 Emergence of the Fabless ASIC Business Model5.4 The Fabless ASIC Model: How It Works5.5 The Services and Capabilities of a Fabless ASIC Supplier5.6 ConclusionChapter 6: Electronic Design Automation6.1 Fabless EDA Overview6.2 Fabless EDA Selection Process6.3 Physical Design EDAChapter 7: Intellectual Property7.1 SIP Industry Overview7.2 SIP Business Environment7.3 Sourcing Industry Overview7.4 Baseline Terminology7.5 Finding SIP and Related Products7.6 Evaluating SIP Business Models7.7 SIP Product Enablers7.8 Examples by SIP Product Type7.9 Licensing SIP Products7.10 Provider and Buyer Perspectives7.11 The Evolution of the IP Industry7.12 Intellectual Property Considerations7.13 IP Outsourcing7.14 Making IP Work in the Fabless Semiconductor Community7.15 IP Acquisition Considerations for Fabless IC CompaniesChapter 8: e- Commerce8.1 The Virtual Fab Challenge8.2 Semiconductor & Fabless Manufacturing: What is Different?8.3 “Build to Forecast” for Outsourced Manufacturing8.4 ERP System Solutions8.5 The Information Ecosystem: Where Communication is KeyChapter 9: Quality and Reliability9.1 General9.2 Front- End9.3 Back-End9.4 Environment, Health and SafetyChapter 10: Test Development10.1 Simplifying Outsourced Test Development10.2 Preparations10.3 Evaluation10.4 ConclusionPART 3 – Becoming a Best-in-Class Fabless CompanyChapter 11: Best Practices for Fabless Companies11.1 Achieving Best-in-Class Operations Practices11.2 A Foundry Manager’s Role in a Fabless Company11.3 Closing the Loop: Understanding the Manufacturing Flow11.4 Managing a Virtual Manufacturing ChainChapter 12: Building the Right Partnerships12.1 Suppliers are (Almost) Just as Important as Customers12.2 Operations in a Fabless Start-Up12.3 Legal Issues for Fabless Semiconductor Companies12.4 Semiconductor Back-End Subcontracting: No Longer a Zero-Sum GameChapter 13: Building the Right Relationships with the board and VCs13.1 Creating Successful Corporate Boards in Fabless Companies13.2 Finding the Right VCPART 4- The Fabless Business Model: A Look into the FutureChapter 14: Perspectives in the Future of Fabless14.1 Keeping Up with the Pace of Change in a Fabless World14.2 Foundry Roadmaps: Partnering, Leading and Innovating14.3 Semiconductor Manufacturing in the 21st Century14.4 The Emerging Dominance of China in the Technology and End Markets
- No. of pages: 296
- Language: English
- Edition: 1
- Published: August 14, 2007
- Imprint: Newnes
- Paperback ISBN: 9780750679442
- eBook ISBN: 9780080551197
LT
Lisa M. Tafoya
Affiliations and expertise
Fabless Semiconductor AssociationRead Understanding Fabless IC Technology on ScienceDirect