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TSV 3D RF Integration
High Resistivity Si Interposer Technology
1st Edition - April 27, 2022
Authors: Shenglin Ma, Yufeng Jin
Paperback ISBN:9780323996020
9 7 8 - 0 - 3 2 3 - 9 9 6 0 2 - 0
eBook ISBN:9780323996037
9 7 8 - 0 - 3 2 3 - 9 9 6 0 3 - 7
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon… Read more
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TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.
A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.
Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology
Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods
Offers a systematic and comparative literature review of HR-Si interposer technology by topic
Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems
Gives a systematic and accessible accounting on this leading technology
Engineers in microelectronics such as advanced package technology for 5G RF modules; graduate students working on microelectronics
Cover image
Title page
Table of Contents
Copyright
About the authors
Preface by Yufeng Jin
Preface by Shenglin Ma
Acknowledgments
Chapter 1: Introduction to HR-Si interposer technology
Abstract
1.1: Background
1.2: 3D RF heterogeneous integration scheme
1.3: HR-Si interposer technology
1.4: TGV interposer technology
1.5: Summary
1.6: Main work of this book
References
Chapter 2: Design, process, and electrical verification of HR-Si interposer for 3D heterogeneous RF integration
Abstract
2.1: Introduction
2.2: Design and fabrication process of HR-Si TSV interposer
2.3: Design and analysis of RF transmission structure built on HR-Si TSV interposer
2.4: Research on HR-Si TSV interposer fabrication process
2.5: Electrical characteristics analysis of transmission structure on HR-Si TSV interposer
2.6: Conclusion
References
Chapter 3: Design, verification, and optimization of novel 3D RF TSV based on HR-Si interposer
8.6: 2.5D heterogeneous integrated L-band receiver based on TGV interposer
8.7: Conclusions
References
Chapter 9: Conclusion and outlook
Abstract
Appendix 1: Abbreviations
Appendix 2: Nomenclature
Appendix 3: Conversion factors
Index
No. of pages: 292
Language: English
Published: April 27, 2022
Imprint: Elsevier
Paperback ISBN: 9780323996020
eBook ISBN: 9780323996037
SM
Shenglin Ma
Shenglin Ma is Associate Professor in the Department of Mechanical and Electrical Engineering at Xiamen University, China. He received his PhD from Peking University and has also been a guest researcher with the National Key Laboratory of Science and Technology in Micro/Nano Fabrication at Peking University. He has over 50 publications and 20 patents to his name, and his research focuses on TSV based 3D integration technology, MEMS and its applications.
Affiliations and expertise
Associate Professor, Department of Mechanical and Electrical Engineering, Xiamen University, China
YJ
Yufeng Jin
YuFeng Jin is a Professor at Peking University, China. He also directed the National Key Laboratory of Science and Technology on Micro/Nano Fabrication for a number of years. He received his PhD from Southeast University, China. He has written three books on advanced packing technologies, and his research focus includes MEMS sensors and TSV related 3D integration of microsystems.