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TSV 3D RF Integration

High Resistivity Si Interposer Technology

  • 1st Edition - April 27, 2022
  • Authors: Shenglin Ma, Yufeng Jin
  • Language: English
  • Paperback ISBN:
    9 7 8 - 0 - 3 2 3 - 9 9 6 0 2 - 0
  • eBook ISBN:
    9 7 8 - 0 - 3 2 3 - 9 9 6 0 3 - 7

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resi… Read more

TSV 3D RF Integration

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TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.