The Circuit Designer’s Companion
- 1st Edition - April 15, 1991
- Imprint: Butterworth-Heinemann
- Author: Tim Williams
- Language: English
- Paperback ISBN:9 7 8 - 1 - 4 8 3 1 - 0 8 8 4 - 1
- eBook ISBN:9 7 8 - 1 - 4 8 3 1 - 0 2 5 0 - 4
The Circuit Designer’s Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that… Read more
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Request a sales quoteThe Circuit Designer’s Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function. This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are followed by discussions of the principles of other design components, including linear integrated circuits, digital circuits, and power supplies. The remaining chapters consider the vital role of electromagnetic compatibility in circuit design. These chapters also look into safety, design of production, testability, reliability, and thermal management of the designed circuit. This book is of great value to electrical and design engineers.
IntroductionChapter 1 Grounding and Wiring Grounding Grounding Within One Unit Chassis Ground The Conductivity of Aluminum Ground Loops Power Supply Returns Input Signal Ground Output Signal Ground Inter-Board Interface Signals Star-Point Grounding Ground Connections Between Units Shielding The Safety Earth Wiring and Cables Wire Types Cable Types Power Cables Data and Multicore Cables RF Cables Twisted Pair Crosstalk Transmission Lines Characteristic Impedance Time Domain Frequency DomainChapter 2 Printed Circuits Board Types Materials Type of Construction Choice of Type Choice of Size Design Rules Track Width and Spacing Hole and Pad Diameter Track Routing Ground and Power Distribution Package Placement Component Identification Solder Resist Terminations and Connections Surface Protection Guarding Conformal Coating Surface Mount Surface Mount Design Rules Sourcing Boards and Artwork Artwork BoardsChapter 3 Passive Components Resistors Resistor Types Tolerancing Temperature Coefficient Power Inductance Pulse Handling Resistor Networks Potentiometers Trimmer Types Panel Types Pot Applications Capacitors Metallized Film & Paper Multi-Layer Ceramics Single Layer Ceramics Electrolytics Solid Tantalum Capacitor Applications Series Capacitors and dc Leakage Dielectric Absorption Self Resonance Inductors Permeability Self-Capacitance Inductor Applications The Danger of Inductive Transients Crystals Resonance Oscillator Circuits TemperatureChapter 4 Active Components Diodes Forward Bias Reverse Bias Leakage High-Frequency Performance Switching Times Schottky Diodes Zener Diodes The Zener as a Clamp Thyristors and Triacs Thyristor Versus Triac Triggering Characteristics False Triggering Conduction Switching Snubbing Bipolar Transistors Leakage Saturation The Darlington Safe Operating Area Gain Switching and High Frequency Performance Grading Junction Field Effect Transistors Pinch-Off Applications High Impedance Circuits MOSFETs Low-Power MOSFETs VMOS Power FETs Gate Drive Impedance Switching Speed On-State ResistanceChapter 5 Linear Integrated Circuits The Ideal Op-Amp The Practical Op-Amp Offset Voltage Bias and Offset Currents Common Mode Effects Input Voltage Range Output Parameters AC Parameters Slew Rate and Large Signal Bandwidth Small-Signal Bandwidth Settling Time Uncompensated Op-Amps The Oscillating Amplifier Open-Loop Gain Noise Supply Current Temperature Ratings Cost and Availability Comparators Output Parameters AC Parameters Op-Amps as Comparators (and Vice Versa) Hysteresis and Oscillations Input Voltage Limits Comparator Sourcing Voltage References Zener References Band-Gap References Reference SpecificationsChapter 6 Digital Circuits Logic ICs Noise Immunity and Thresholds Fan-Out and Loading Induced Switching Noise Decoupling Unused Gate Inputs Interfacing Mixing Analogue and Digital Generating Digital Levels from Analogue Inputs Protection Against Externally-Applied Overvoltages Isolation Data Interface Standards Microprocessor Watchdogs and Supervision The Threat of Corruption Watchdog Design Supervisor Design Software Techniques Input Data Validation and Averaging Data and Memory Protection Re-InitializationChapter 7 Power Supplies General The Linear Supply The Switch-Mode Supply Specifications Off the Shelf Versus Roll Your Own Input and Output Parameters Voltage Current Fuses Switch-On Surge Waveform Distortion Frequency Efficiency Deriving the Input Voltage from the Output Low-Load Condition Rectifier and Capacitor Selection Load and Line Regulation Ripple and Noise Transient Response Abnormal Conditions Output Overload Input Transients Transient Suppressors Overvoltage Protection Turn-On and Turn-Off Mechanical Requirements Case Size and Construction Heatsinking Safety Approvals Batteries Initial Considerations Primary Cells Secondary Cells ChargingChapter 8 Electromagnetic Compatibility The Need for EMC Immunity Emissions EMC Legislation and Standards The EMC Directive Existing Standards Interference Coupling Mechanisms Conducted Radiated Circuit Design and Layout Choice of Logic Analogue Circuits Software Shielding Apertures Seams Filtering The Low-Pass Filter Mains Filter I/O Filters Feedthrough and 3-Terminal Capacitors Cables and Connectors EMC Design ChecklistChapter 9 General Product Design Safety Safety Classes Design Considerations for Safety Protection Fire Hazard Design for Production Checklist The Dangers of ESD Testability In-Circuit Testing Functional Testing Design Techniques Reliability Definitions The Cost of Reliability Design for Reliability The Value of MTBF Figures Design Faults Thermal Management Calculating Thermal Resistance Heatsinks Power Semiconductor Mounting Placement and LayoutAppendix Standards British Standards IEC StandardsBibliographyIndex
- Edition: 1
- Published: April 15, 1991
- Imprint: Butterworth-Heinemann
- No. of pages: 310
- Language: English
- Paperback ISBN: 9781483108841
- eBook ISBN: 9781483102504
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Tim Williams
Tim Williams worked for a variety of companies as an electronic design engineer, before startinghis own consultancy specializing in EMC design and test advice and training. He has monitored the progress of the EMC Directive and its associated standards since it was first made public, over the last 25 years.
Affiliations and expertise
Elmac Services, Wareham, UKRead The Circuit Designer’s Companion on ScienceDirect