Reliability and Failure Analysis of High-Power LED Packaging

1st Edition - September 24, 2022
Imprint: Woodhead Publishing
Authors: Cher Ming Tan, Preetpal Singh
Language: English
Paperback ISBN:
9 7 8 - 0 - 1 2 - 8 2 2 4 0 8 - 3
eBook ISBN:
9 7 8 - 0 - 1 2 - 8 2 2 4 0 7 - 6

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging… Read more

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Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs.

The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.

Cover image
Title page
Table of Contents
Copyright
Authors' biographies
Preface
Chapter 1. Introduction
1.1. Scope of the book
1.2. Operation environments of packaged LED
1.3. LED packaging challenges
1.4. Commonly used packaging materials and their evolution
1.5. Reliability requirements of packaged LED
1.6. Overview of LED failures
1.7. Statistics used in failure analysis
1.8. Summary
Chapter 2. General failure analysis techniques for packaged LED
2.1. Introduction
2.2. Functional and parameters examination
2.3. Microscopic inspection
2.4. Spectrometric examination
2.5. Radiography examination (X-ray CT)
2.6. Thermography examination
2.7. Scanning electron microscope analysis techniques
2.8. Scanning acoustic microscopy examination (SAM)
2.9. Internal inspection via decapsulation
2.10. Summary
Chapter 3. Effect of environment on white packaged LED reliability
3.1. Introduction
3.2. Thermal stress in LED chips
3.3. Thermal stress in die attachment
3.4. Thermal stress in LED packaging
3.5. Temperature cycling effect on LEDs
3.6. Electrical effect on LEDs
3.7. Temperature-humidity effect on LEDs and three stages in LED lifetime
3.8. Combined moisture–electrical–thermal effect on LEDs
3.9. Summary
Chapter 4. Initial rapid lumen degradation for high-power white packaged LEDs
4.1. Introduction
4.2. Physical analysis on the degraded samples
4.3. Thermal gravimetric analysis (TGA) analysis
4.4. Energy dispersive system (EDS) analysis
4.5. Modeling analysis
4.6. Degradation mechanism
4.7. Summary
Chapter 5. Lumen recovery in high-power LEDs under prolonged outdoor operation
5.1. Introduction
5.2. Statistical analysis on the test results
5.3. Analysis on the test samples
5.4. Degradation mechanism
5.5. Implication to temperature–humidity test for LEDs
5.6. Summary
Chapter 6. Permanent degradation mechanisms of high-power packaged white LEDs
6.1. Introduction
6.2. Statistical analysis on the test results
6.3. Physical analysis on the test samples
6.4. Degradation mechanism
6.5. Summary
Chapter 7. Comparison of blue and white packaged LED degradation
7.1. Introduction
7.2. Experimentation
7.3. Statistical analysis on the test results
7.4. Physical analysis on the test samples
7.5. Finite element analysis
7.6. Uniqueness of degradation mechanisms for blue and white LEDs
7.7. Summary
Chapter 8. Packaged LEDs degradation under UV radiation effect
8.1. Introduction
8.2. Experimentation
8.3. Experimental results
8.4. Physical analysis on the test samples
8.5. Summary
Chapter 9. Reliability tests standards for LEDs
9.1. Introduction
9.2. Necessity for reliability test standards
9.3. Current LED reliability test standards
9.4. Challenges in extrapolation of LED reliability test data to current operating conditions
9.5. Need for additional reliability test standards for extended applications of LEDs
9.6. Summary
Index

Cher Ming Tan

Professor Cher Ming Tan obtained his PhD in Electrical Engineering from the University of Toronto in 1992. He has eight years of working experience in reliability in the electronics industry (both Singapore and Taiwan) before joining Nanyang Technological University (NTU) as a faculty member in 1996 where he stayed until 2014. He is now a Professor at Chang Gung University, Taiwan, and the Director of the Centre of Reliability Science and Technology (CReST). He has published more than 400 international journal and conference papers and holds 14 patents and 1 copyright for reliability software. He has given more than 100 keynote and invited talks at international conferences. He has written 6 books and 4 book chapters in the field of reliability. He is the Series Editor of Springer Briefs in Reliability, Editor of Scientific Reports, Editor of IEEE Transactions on Materials and Device Reliability, Associate Editor of Microelectronics Reliability, and Research Editor of Frontiers in Materials. He is Fellow of the Institute of Engineers, Singapore, Fellow of the Singapore Quality Institute, and an IEEE Electron Devices Distinguished Lecturer. He is also on the technical committee for reviewing IEEE Reliability Standards 1413.1 and 1624.

Affiliations and expertise

Center for Reliability Sciences and Technologies, Chang Gung University, Taiwan; Center for Reliability Engineering, Ming Chi University of Technology, Taiwan

Preetpal Singh

Dr. Preetpal Singh received his BS from the Guru Nanak Engineering College, Hyderabad, India, in 2007, and MS from Amity University, Noida, India, in 2013. He completed his PhD in 2018 with the Department of Electronic Engineering and Center for Reliability Sciences and Technologies (CReST), Chang Gung University in Taoyuan, Taiwan. His research interests include graphene-based high-power LEDs, high-power LED degradation study, and LED reliability. He has published his research in reputed journals like the IEEE-TDMR, Microelectronics Reliability, and Scientific Reports. He holds a US patent for his work on High Power LEDs substrate—GaN thermal and lattice mismatch improvement. He is also the Reviewer for the IEEE-TDMR and microelectronics journals. Presently he is working with Epistar, Taiwan, as Senior Research Engineer and is responsible for development of different types of LEDs.

Affiliations and expertise

Center for Reliability Engineering, Ming Chi University of Technology, Taiwan

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