Materials for Electronics Security and Assurance
- 1st Edition - January 15, 2024
- Imprint: Elsevier
- Authors: Navid Asadizanjani, Chengjie Xi, Mark M. Tehranipoor
- Language: English
- Paperback ISBN:9 7 8 - 0 - 4 4 3 - 1 8 5 4 2 - 7
- eBook ISBN:9 7 8 - 0 - 4 4 3 - 1 8 5 4 3 - 4
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discus… Read more
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Request a sales quoteMaterials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities.
- Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting
- Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions
- Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing
Materials Scientists, Computer Engineers, Electrical Engineers
- Cover image
- Title page
- Table of Contents
- Copyright
- About the authors
- Preface
- Acknowledgment
- Chapter 1: Material for heterogeneous integration: Challenges and opportunities
- Abstract
- 1.1. Introduction
- 1.2. Background
- 1.3. Security threats in heterogeneous integration circuits
- 1.4. Post-packaging assurance: Nondestructive physical inspection for HI
- 1.5. Postpackaging assurance: Destructive physical inspection for HI
- 1.6. Prepackaging assurance: MEMS & NEMS
- 1.7. Discussion & conclusion
- References
- Chapter 2: Packaging encapsulant material for hardware assurance
- Abstract
- 2.1. Introduction
- 2.2. Background of IC encapsulant
- 2.3. Threat models
- 2.4. Encapsulant material characterization for hardware assurance
- 2.5. Summary and discussion
- References
- Chapter 3: Packaging encapsulant material characterization for counterfeit IC detection
- Abstract
- 3.1. Introduction
- 3.2. Background: Material for counterfeit detection
- 3.3. Chemometrics
- 3.4. Experiment material and methods
- 3.5. Conclusion and future work
- References
- Chapter 4: THz for semiconductor assurance
- Abstract
- 4.1. Introduction
- 4.2. THz physical inspection
- 4.3. THz signal and detector hardware
- 4.4. THz applications
- 4.5. THz for material characterization
- 4.6. THz-time domain spectroscopy (TDS) imaging
- 4.7. Conclusion
- References
- Chapter 5: Scanning acoustic microscopy package fingerprint extraction for integrated circuit hardware assurance
- Abstract
- 5.1. Introduction
- 5.2. Fundamental physics
- 5.3. Application to counterfeit detection
- 5.4. Application of failure analysis
- 5.5. Postimaging process
- 5.6. Conclusions
- References
- Chapter 6: Texture analysis of encapsulant packaging materials
- Abstract
- 6.1. Introduction
- 6.2. Package texture analysis for counterfeit defect detection
- 6.3. Imaging modalities for package texture analysis
- 6.4. Image preprocessing for package texture analysis
- 6.5. Challenges
- 6.6. Conclusion
- References
- Chapter 7: MEMS devices in HI packaging
- Abstract
- 7.1. Introduction
- 7.2. Background
- 7.3. Security analysis and vulnerabilities
- 7.4. Existing countermeasures and solutions
- 7.5. Proposed assurance techniques and future directions
- 7.6. Discussion and conclusion
- References
- Chapter 8: Tracking and tracing methods for hardware assurance
- Abstract
- 8.1. Introduction
- 8.2. Hardware security background
- 8.3. Tracking and tracing methods
- 8.4. Vulnerabilities of existing IC T&T methods
- 8.5. Natural inherent T&T methods
- 8.6. Geomagnetic natural inherent (GNI) T&T methods
- 8.7. Terahertz for IC T&T
- 8.8. Conclusion
- References
- Chapter 9: Sample preparation for hardware assurance
- Abstract
- 9.1. Introduction
- 9.2. Background
- 9.3. Sample preparation approaches
- 9.4. IC package structure parameters
- 9.5. Extracting structure parameters
- 9.6. Digital twin aided structure analysis
- 9.7. Discussion and conclusion
- References
- Chapter 10: Silicon photonic packaging: Complexity and challenges for assurance
- Abstract
- 10.1. Introduction
- 10.2. Background
- 10.3. Security vulnerability in SiPH devices
- 10.4. Silicon photonics packaging assurance
- 10.5. Discussion & conclusion
- References
- Chapter 11: Advanced IC packaging design for material inspection
- Abstract
- 11.1. Introduction
- 11.2. Background and motivation
- 11.3. Nondestructive methods for advanced IC packaging characterization
- 11.4. Exploring factors influencing X-ray compatibility
- 11.5. Metric for X-ray inspection compatibility
- 11.6. Formulation of the design metric
- 11.7. Conclusion
- References
- Chapter 12: Electron beam probing for advanced IC packaging assurance
- Abstract
- 12.1. Introduction
- 12.2. Background and motivation
- 12.3. Principle of e-beam probing (EBP)
- 12.4. Probing technique for hardware security vulnerabilities
- 12.5. Optical probing vs EBP
- 12.6. Process and challenges of performing EBP on advanced packaging devices
- 12.7. Experiment and challenges
- 12.8. Discussion and conclusion
- References
- Index
- Edition: 1
- Published: January 15, 2024
- Imprint: Elsevier
- No. of pages: 400
- Language: English
- Paperback ISBN: 9780443185427
- eBook ISBN: 9780443185434
NA
Navid Asadizanjani
Navid Asadi is an assistant professor in the department of electrical and computer engineering at university of Florida. His research is mainly focused on physical inspection of electronics from device to system level. He investigates novel techniques for integrated circuits counterfeit detection/prevention, system and chip level reverse engineering, anti-reverse engineering, invasive and semi-invasive physical attacks, integrity analysis, etc. using advanced inspection methods including but not limited to 3D X-ray microscopy, Optical imaging, scanning electron microscopy (SEM), focused ion beams (FIBs), THz imaging, etc. in combination with image processing and machine learning algorithms to make the inspection process intelligent and independent from human. He has received several best paper awards and is the co-founder of the IEEE-PAINE conference.
Affiliations and expertise
Assistant Professor, University of Florida, USACX
Chengjie Xi
Peter (Chengjie) Xi is currently a Ph.D. student at the University of Florida in the Electrical and Computer Engineering Department. He received an M.S. degree in Materials Science and Engineering from the University of Florida in 2020. His research is focused on developing counterfeit detection and prevention methods for integrated circuit packaging. He investigates various material characterization methods in combination with machine learning algorithms to generate unique fingerprints to make the characterization fast and independent from humans.
Affiliations and expertise
University of Florida,Florida Institute for Cyber Security Research, Gainesville, FL, USAMT
Mark M. Tehranipoor
Mark Tehranipoor is the Intel Charles E. Young Professor in Cybersecurity at the Department of Electrical and Computer Engineering (ECE), University of Florida. Prof. Tehranipoor has published over 300 journal articles and refereed conference papers and has given more than 150 invited talks and keynote addresses since 2006. In addition, he has published six books and ten book chapters. His projects are sponsored by both industry (Semiconductor Research Corporation (SRC), Texas Instruments, Freescale Comcast, Honeywell, LSI, Mentor Graphics, Juniper, R3Logic, Cisco, Qualcomm, MediaTeck, etc.) and the US Government (NSF, ARO, MDA, DOD, AFOSR, DOE, etc.). Prior to joining the University of Florida, Dr. Tehranipoor served as the founding director of the Center for Hardware Assurance, Security, and Engineering (CHASE) and the Comcast Center of Excellence in Security Innovation (CSI) at the University of Connecticut. Prof. Tehranipoor is a Senior Member of the IEEE, Golden Core Member of IEEE Computer Society, and Member of ACM and ACM SIGDA. He is also a member of Connecticut Academy of Science and Engineering (CASE).
Affiliations and expertise
Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USARead Materials for Electronics Security and Assurance on ScienceDirect