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Materials for Electronic Packaging

  • 1st Edition - March 31, 1995
  • Author: Deborah D.L. Chung
  • Language: English
  • Hardback ISBN:
    9 7 8 - 0 - 7 5 0 6 - 9 3 1 4 - 1
  • eBook ISBN:
    9 7 8 - 0 - 0 8 - 0 5 1 1 1 7 - 7

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targe… Read more

Materials for Electronic Packaging

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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.