Materials for Electronic Packaging
- 1st Edition - March 31, 1995
- Imprint: Butterworth-Heinemann
- Author: Deborah D.L. Chung
- Language: English
- Paperback ISBN:9 7 8 - 0 - 1 2 - 3 9 9 2 6 7 - 3
- Hardback ISBN:9 7 8 - 0 - 7 5 0 6 - 9 3 1 4 - 1
- eBook ISBN:9 7 8 - 0 - 0 8 - 0 5 1 1 1 7 - 7
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targe… Read more
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Request a sales quoteAlthough materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
- Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors
- Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science
- Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Professionals and advanced graduate students working in electronic materials and packaging
Overview of materials for electronic packagingSolderability fundamentals: role of microscopic processesDetermining the damaging strains which cause failure in lead tin soldersFluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfacesThe future of advanced composite electronic packagingLow thermal expansion composite materials for electronic packagingElectrically conducting polymer-matrix compositesThick-film technologyElectroless copper for micropackaging and ultra large scale integrated circuit applicationsVacuum metallization for integrated circuit packagesElectrically conducting polymers and organic materialsDiamond filmsMeasurements of properties of materials in electronic packaging
- Edition: 1
- Published: March 31, 1995
- Imprint: Butterworth-Heinemann
- No. of pages: 368
- Language: English
- Paperback ISBN: 9780123992673
- Hardback ISBN: 9780750693141
- eBook ISBN: 9780080511177
DC
Deborah D.L. Chung
Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York
Affiliations and expertise
Composite Materials Research Laboratory, University at Buffalo, State University of New York.