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Intelligent Packaging

Current Technologies and Applications

  • 1st Edition - April 14, 2024
  • Latest edition
  • Editors: Monica Trif, Sneh Punia Bangar
  • Language: English

Intelligent Packaging: Current Technologies and Applications, Volume Six in the Developments in Food Quality and Safety series is the most up-to-date resource on topics such as A… Read more

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Description

Intelligent Packaging: Current Technologies and Applications, Volume Six in the Developments in Food Quality and Safety series is the most up-to-date resource on topics such as Advances in the analysis of toxic compounds and control of food poisoning; Food fraud, traceability and authenticity; Revalorization of agrifood industry; Natural antimicrobial compounds and application to improve the preservation of food; Non-thermal processing technologies in the food industry; Nanotechnology in food production; and Intelligent packaging and sensors. This updated volume covers intelligent packaging by discussing the aspects of emerging technologies and strategies to obtain such packaging relevant to the development of traceable food products.

Topics such as indicators, sensors, tracing devices, and intelligent packaging used in various food products, such as dairy, meat, fruits and vegetables are also explored. The series is edited by Dr. José Manuel Lorenzo and authored by a team of global experts in the fields of Food Quality and Safety, providing comprehensive knowledge to food industry personals and scientists.

Key features

  • Provides fundamentals and the latest developments for emerging technologies in food packaging
  • Covers the main novel and modern intelligent and sensors technologies and strategies to obtain intelligent packaging
  • Explores utilization, optimization, and the development of technologies per se on the developments of intelligent packaging

Readership

Researchers, academics and other professionals actively working, developing research, promoting scientific activities and interested in the development of research, teaching, and lecturing in Food Science and Technology that include the fields of Food Quality and Safety (but not limited to), Microbiology, Chemistry, Physics, Biology, and Engineering.The secondary market is composed of undergraduate, master, PhD and post-doctoral students as well as professionals, technicians, staff members and researchers in related areas with interest in develop professional, research, and lecturing activities related to Food Science and Technology and related knowledge presented in this Book

Table of contents

1. Packaging of the future: smart technologies and food quality and safety

2. Intelligent vs. other packaging

3. Intelligent packaging -history and background

4. Intelligent packaging- Indicators

5. Intelligent packaging- Sensors

6. Intelligent packaging- Tracing devices

7. Legal aspects of intelligent packing

8. Intelligent packaging of fruits and vegetables

9. Intelligent packaging of dairy products

10. Intelligent packaging of meat and meat products

11. Interaction of food and packaging

12. Intelligent Packaging and health

13. Intelligent packaging- challenges and solutions

14. Consumer perceptions of smart packaging technologies for food

15. Future trends in intelligent packaging solution

Product details

  • Edition: 1
  • Latest edition
  • Published: April 18, 2024
  • Language: English

About the editors

MT

Monica Trif

Monica Trif, Ph.D. is Senior Researcher at the Centre for innovative process engineering GmbH (Centiv GmbH, Germany), where she is Principal Investigator at Food Research Department. In the last 10 years involved in successful and fruitful international and national research projects. She serves as Section Topical Advisory Panel Member for 'Biocatalysis'–of Catalysts journal, Topic Editor in Frontiers in Nutrition, Frontiers in Sustainable Food Systems, and Frontiers in Food Science and Technology.
Affiliations and expertise
Senior Researcher, Centre for Innovative Process Engineering, Centiv GmbH, Germany

SB

Sneh Punia Bangar

Sneh Punia Bangar is an assistant professor in the Department of Packaging Science and Graphic Media at Rochester Institute of Technology, New York. Prior to this appointment, she worked as a postdoctoral researcher in the Department of Food, Nutrition, and Packaging Sciences at Clemson University, SC, USA. Her research focuses on the design and development of sustainable biopolymer-based films, coatings, and packaging materials derived from starch, cellulose, lignin, and other natural polymers. A key aspect of her research is adding value to agricultural and food industry waste by extracting functional biopolymers with applications in food and packaging. She has authored or coauthored more than 100 research/review articles, 15 authored/edited books, 35 book chapters, and 20 conference proceedings/seminars. She is also the associate editor of the Journal of Food Measurement and Characterization (Springer), an editorial board member of the International Journal of Food Science and Technology (Wiley), academic editor of the Journal of Food Quality (Hindawi), and a section editor of Current Food Science and Technology Reports (Springer). Her significant contributions to academia and research were acknowledged with the “Award of Honour” in 2019 for her outstanding achievements. She is the recipient of the GSG Outstanding Graduate Research Assistant (2022) and CAFLS Outstanding Graduate Student Research Award (2023) at Clemson University, USA. Dr. Bangar received the “Professor Gurcharan Bains Award” from the Association of Food Scientists & Technologists (India) in 2023 for her incredible contribution to Food Science and Technology. In addition, she has been listed (2023 and 2024) in “World Ranking of Top 2% Scientists,” published by Stanford University, USA. Dr. Bangar was awarded Clemson University’s Distinguished Postdoctoral Fellow Award for 2024. She has an H-index of 72 with ~15000 citations, as per Google Scholar.

Affiliations and expertise
Assistant Professor, Department of Packaging and Graphic Media Science, Rochester Institute of Technology, New York, United States

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