Integrated Photonics for Data Communication Applications
- 1st Edition - July 26, 2023
- Editors: Madeleine Glick, Ling Liao, Katharine Schmidtke
- Language: English
- Paperback ISBN:9 7 8 - 0 - 3 2 3 - 9 1 2 2 4 - 2
- eBook ISBN:9 7 8 - 0 - 3 2 3 - 9 1 8 3 1 - 2
Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic… Read more
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Request a sales quoteIntegrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance.
Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances.
- Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications
- Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes
- Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks
- Cover image
- Title page
- Table of Contents
- Copyright
- List of contributors
- About the editors
- Series foreword
- Guiding principles
- Introduction
- 1. Applications and key performance indicators for data communications
- Abstract
- 1.1 Introduction
- 1.2 Optical network case studies
- 1.3 Optical module form factors
- 1.4 Interconnect figures of merit
- 1.5 Major inflection points and challenges
- 1.6 Considerations for future technology
- References
- 2. Integrated lasers for data center silicon photonic-integrated circuits
- Abstract
- 2.1 Introduction
- 2.2 Integration issues
- 2.3 Performance requirements
- 2.4 State-of-the-art
- 2.5 Outlook
- References
- 3. Optical modulators
- Abstract
- 3.1 Introduction
- 3.2 Modulation mechanisms
- 3.3 Historical review
- 3.4 Group IV modulators
- 3.5 III–V modulators
- 3.6 Heterogeneous integration on silicon
- 3.7 Summary and perspectives
- References
- 4. High-speed photodetectors
- Abstract
- 4.1 Photodetectors in data center architecture
- 4.2 Epitaxy: dislocations and lattice strain in Ge/Si
- 4.3 Advanced Ge photodiode processing on CMOS platform
- 4.4 Avalanche photodetectors
- 4.5 Photodetectors in data centers
- References
- 5. Passive silicon photonic devices
- Abstract
- 5.1 Introduction
- 5.2 Survey of key passive optical devices
- 5.3 Multiplexers/demultiplexers and filters
- 5.4 Future directions
- References
- 6. Coherent interconnects for data centers
- Abstract
- 6.1 Data center interconnect: system requirements
- 6.2 Direct detection and coherent links for DCI
- 6.3 Photonic-integrated circuits for coherent DCI
- 6.4 Development paths for volume deployment
- 6.5 Future directions: outlook beyond 3 years
- References
- 7. Photonic-integrated circuits for switched network interconnects
- Abstract
- 7.1 Data center interconnect: system requirements
- 7.2 Integrated photonic building blocks for data center interconnect
- 7.3 Pluggable transceivers for intradata center interconnects
- 7.4 Photonic integration/copackaging for data center interconnects
- 7.5 Future directions
- References
- 8. Photonic switch fabrics in data center/high-performance computing networks
- Abstract
- 8.1 Introduction
- 8.2 Key figures of merit for optical switching networks
- 8.3 Overview of optical switch fabric architectures
- 8.4 Overview of integrated optical switch technologies
- 8.5 Silicon photonic switch fabric
- 8.6 InP optical switch fabric
- 8.7 Heterogeneous photonic-integrated switch fabric
- 8.8 Data center/high-performance computing optical interconnect architectures based on optical switches
- 8.9 Remaining challenges and future perspectives
- 8.10 Summary
- References
- 9. Photonic-integrated circuits and optical fabrics for heterogeneous computing systems
- Abstract
- 9.1 Problem statement
- 9.2 Applications space with requirements
- 9.3 Interfaces
- 9.4 System level reliability, resiliency, BER, lifetime
- 9.5 Power and cooling
- 9.6 Cost: current costs and path to $0.02/Gbps
- 9.7 Fabric architecture: control and data planes, scheduling
- 9.8 Photonic-integrated circuits for heterogeneous computing systems
- 9.9 Conclusion
- References
- 10. Photonic integrated circuit design methods and tools
- Abstract
- 10.1 Introduction
- 10.2 Photonic device design
- 10.3 Photonic-integrated circuit design
- 10.4 System design
- 10.5 Design for manufacturability
- 10.6 Future photonic-integrated circuit design flow requirements
- References
- 11. Photonic-integrated circuit fabrication and test approaches
- Abstract
- 11.1 Introduction
- 11.2 Relevant industry trends
- 11.3 Photonic-integrated circuit fabrication schemes and methodology
- 11.4 Photonic-integrated circuit in-line and end-of-line testing
- 11.5 Photonic-integrated circuit integration, fabrication, and manufacturing
- 11.6 Photonic-integrated circuit outlook: fully monolithic photonic integration platform
- References
- 12. Packaging and test technologies
- Abstract
- 12.1 Introduction
- 12.2 PIC packaging technologies
- 12.3 Transceiver package design
- 12.4 Optical packaging
- 12.5 Electrical packaging
- 12.6 Hybrid laser-to-PIC packaging
- 12.7 Packaging design rules and standardization
- 12.8 Testing
- 12.9 3D printing of micro-optics for integrated photonics
- 12.10 Conclusion
- References
- 13. Reliability of Photonic-Integrated Circuits for data center and high-performance computing applications
- Abstract
- 13.1 Introduction
- 13.2 Reliability requirements for DC/HPC application environment
- 13.3 Reliability standards for DC and HPC applications
- 13.4 Methodology for PIC reliability
- 13.5 Subsystem and module assembly and integration
- 13.6 Reliability of DCI optical systems and field data
- 13.7 Strategy for robust manufacturing quality
- 13.8 Challenges and opportunities
- References
- Index
- No. of pages: 522
- Language: English
- Edition: 1
- Published: July 26, 2023
- Imprint: Elsevier
- Paperback ISBN: 9780323912242
- eBook ISBN: 9780323918312
MG
Madeleine Glick
LL
Ling Liao
Dr. Liao Ling is an Intel Fellow and chief architect of photonic integration in Intel’s Silicon Photonics Product Division. She joined Intel in 1997 and spearheaded research in high-speed silicon modulation, optical transmitter integration, and co-packaged optics. She currently leads the development of multi terabit per second photonic engines to be co-packaged with switch SOCs and XPUs for future power, cost, and bandwidth density scaling. Ling earned her B.S. and M.S. in materials science and engineering from the Massachusetts Institute of Technology and Ph.D. in electrical engineering from the University of Surrey in the UK.
KS
Katharine Schmidtke
Dr. Katharine Schmidtke is Director of Sourcing for ASICs and Custom Silicon at Facebook. Over the past five years she led Facebook’s Optical Technology strategy and worked closely with OCP to specify the 100G-CWDM4-OCP optical transceiver optimized for data center applications. Katharine obtained a Ph.D. in non-linear optics from Southampton University in the UK and completed post-doctoral research at Stanford University.