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Integrated Photonics for Data Communication Applications

1st Edition - July 26, 2023

Editors: Madeleine Glick, Ling Liao, Katharine Schmidtke

Paperback ISBN:

9 7 8 - 0 - 3 2 3 - 9 1 2 2 4 - 2

eBook ISBN:

9 7 8 - 0 - 3 2 3 - 9 1 8 3 1 - 2

Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic… Read more

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Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance.

Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances.

Cover image
Title page
Table of Contents
Copyright
List of contributors
About the editors
Series foreword
Guiding principles
Introduction
1. Applications and key performance indicators for data communications
Abstract
1.1 Introduction
1.2 Optical network case studies
1.3 Optical module form factors
1.4 Interconnect figures of merit
1.5 Major inflection points and challenges
1.6 Considerations for future technology
References
2. Integrated lasers for data center silicon photonic-integrated circuits
Abstract
2.1 Introduction
2.2 Integration issues
2.3 Performance requirements
2.4 State-of-the-art
2.5 Outlook
References
3. Optical modulators
Abstract
3.1 Introduction
3.2 Modulation mechanisms
3.3 Historical review
3.4 Group IV modulators
3.5 III–V modulators
3.6 Heterogeneous integration on silicon
3.7 Summary and perspectives
References
4. High-speed photodetectors
Abstract
4.1 Photodetectors in data center architecture
4.2 Epitaxy: dislocations and lattice strain in Ge/Si
4.3 Advanced Ge photodiode processing on CMOS platform
4.4 Avalanche photodetectors
4.5 Photodetectors in data centers
References
5. Passive silicon photonic devices
Abstract
5.1 Introduction
5.2 Survey of key passive optical devices
5.3 Multiplexers/demultiplexers and filters
5.4 Future directions
References
6. Coherent interconnects for data centers
Abstract
6.1 Data center interconnect: system requirements
6.2 Direct detection and coherent links for DCI
6.3 Photonic-integrated circuits for coherent DCI
6.4 Development paths for volume deployment
6.5 Future directions: outlook beyond 3 years
References
7. Photonic-integrated circuits for switched network interconnects
Abstract
7.1 Data center interconnect: system requirements
7.2 Integrated photonic building blocks for data center interconnect
7.3 Pluggable transceivers for intradata center interconnects
7.4 Photonic integration/copackaging for data center interconnects
7.5 Future directions
References
8. Photonic switch fabrics in data center/high-performance computing networks
Abstract
8.1 Introduction
8.2 Key figures of merit for optical switching networks
8.3 Overview of optical switch fabric architectures
8.4 Overview of integrated optical switch technologies
8.5 Silicon photonic switch fabric
8.6 InP optical switch fabric
8.7 Heterogeneous photonic-integrated switch fabric
8.8 Data center/high-performance computing optical interconnect architectures based on optical switches
8.9 Remaining challenges and future perspectives
8.10 Summary
References
9. Photonic-integrated circuits and optical fabrics for heterogeneous computing systems
Abstract
9.1 Problem statement
9.2 Applications space with requirements
9.3 Interfaces
9.4 System level reliability, resiliency, BER, lifetime
9.5 Power and cooling
9.6 Cost: current costs and path to $0.02/Gbps
9.7 Fabric architecture: control and data planes, scheduling
9.8 Photonic-integrated circuits for heterogeneous computing systems
9.9 Conclusion
References
10. Photonic integrated circuit design methods and tools
Abstract
10.1 Introduction
10.2 Photonic device design
10.3 Photonic-integrated circuit design
10.4 System design
10.5 Design for manufacturability
10.6 Future photonic-integrated circuit design flow requirements
References
11. Photonic-integrated circuit fabrication and test approaches
Abstract
11.1 Introduction
11.2 Relevant industry trends
11.3 Photonic-integrated circuit fabrication schemes and methodology
11.4 Photonic-integrated circuit in-line and end-of-line testing
11.5 Photonic-integrated circuit integration, fabrication, and manufacturing
11.6 Photonic-integrated circuit outlook: fully monolithic photonic integration platform
References
12. Packaging and test technologies
Abstract
12.1 Introduction
12.2 PIC packaging technologies
12.3 Transceiver package design
12.4 Optical packaging
12.5 Electrical packaging
12.6 Hybrid laser-to-PIC packaging
12.7 Packaging design rules and standardization
12.8 Testing
12.9 3D printing of micro-optics for integrated photonics
12.10 Conclusion
References
13. Reliability of Photonic-Integrated Circuits for data center and high-performance computing applications
Abstract
13.1 Introduction
13.2 Reliability requirements for DC/HPC application environment
13.3 Reliability standards for DC and HPC applications
13.4 Methodology for PIC reliability
13.5 Subsystem and module assembly and integration
13.6 Reliability of DCI optical systems and field data
13.7 Strategy for robust manufacturing quality
13.8 Challenges and opportunities
References
Index

Madeleine Glick

Dr. Madeleine Glick is a Senior Research Scientist at Columbia University where her current research focuses on applications of photonic devices and optical interconnects to bandwidth dense, energy efficient computing systems. Madeleine received her Ph.D. in Physics from Columbia University in 1989. She subsequently conducted research on optical properties of III-V materials at the Department of Physics, Ecole Polytechnique Federale de Lausanne (EPFL) Lausanne, Switzerland. She was also a Research Associate with the European Organization for Nuclear Research, CERN, Geneva, Switzerland. In the early 2000s Madeleine initiated and led research activities on the use of photonics in computer networks. From 2002-2011 she was Principal Engineer at Intel Research leading research on optical interconnects for data centers where she led one of the first research groups to explore optical interconnects and optical switching for computer networks and data centers. While at Intel, she initiated and led projects exploring digital signal processing (DSP) for optical links - an impactful research collaboration with University College London and Carnegie Mellon University. Her work has extended to research and collaborations with industry and universities, including University of Oxford, University of Cambridge, MIT and Lawrence Berkeley National Laboratory. Madeleine’s contributions have been recognized in both the photonics and computing communities. She is one of the few optics researchers to have been published by top-tier computing conferences (Sigcomm 2016, SC19, SC20) and to be invited to the technical committee of the major supercomputing conference (SC18-SC22; Vice Chair of the Networks and Architectures subcommittee SC18). Madeleine is a Fellow of Optica and the Institute of Physics UK (IOP). In 2022 she received the Distinguished Service Award from the IEEE Photonics Society.

Affiliations and expertise

Senior Research Scientist, Columbia University

Ling Liao

Dr. Liao Ling is an Intel Fellow and chief architect of photonic integration in Intel’s Silicon Photonics Product Division. She joined Intel in 1997 and spearheaded research in high-speed silicon modulation, optical transmitter integration, and co-packaged optics. She currently leads the development of multi terabit per second photonic engines to be co-packaged with switch SOCs and XPUs for future power, cost, and bandwidth density scaling. Ling earned her B.S. and M.S. in materials science and engineering from the Massachusetts Institute of Technology and Ph.D. in electrical engineering from the University of Surrey in the UK.

Affiliations and expertise

Intel Fellow and Chief Architect of Photonic Integration, Intel’s Silicon Photonic Product Division, USA

Katharine Schmidtke

Dr. Katharine Schmidtke is Director of Sourcing for ASICs and Custom Silicon at Facebook. Over the past five years she led Facebook’s Optical Technology strategy and worked closely with OCP to specify the 100G-CWDM4-OCP optical transceiver optimized for data center applications. Katharine obtained a Ph.D. in non-linear optics from Southampton University in the UK and completed post-doctoral research at Stanford University.

Affiliations and expertise

Director of Sourcing for ASICs and Custom Silicon, Facebook