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Embedded Hardware: Know It All
- 1st Edition - September 14, 2007
- Authors: Jack Ganssle, Tammy Noergaard, Fred Eady, Lewin Edwards, David J. Katz, Rick Gentile, Ken Arnold, Kamal Hyder, Bob Perrin
- Language: English
- eBook ISBN:9 7 8 - 0 - 0 8 - 0 5 6 0 7 4 - 8
The Newnes Know It All Series takes the best of what our authors have written to create hard-working desk references that will be an engineer's first port of call for key… Read more
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Request a sales quoteThe Newnes Know It All Series takes the best of what our authors have written to create hard-working desk references that will be an engineer's first port of call for key information, design techniques and rules of thumb. Guaranteed not to gather dust on a shelf!Circuit design using microcontrollers is both a science and an art. This book covers it all. It details all of the essential theory and facts to help an engineer design a robust embedded system. Processors, memory, and the hot topic of interconnects (I/O) are completely covered. Our authors bring a wealth of experience and ideas; this is a must-own book for any embedded designer.
*A 360 degree view from best-selling authors including Jack Ganssle, Tammy Noergard, and Fred Eady*Key facts, techniques, and applications fully detailed*The ultimate hard-working desk reference: all the essential information, techniques, and tricks of the trade in one volume
Embedded and hardware engineers; designers, project managers
CHAPTER 1: Embedded Hardware Basics1.1 Lesson One on Hardware: Reading Schematics1.2 The Embedded Board and the von Neumann Model1.3 Powering the Hardware1.4 Basic Electronics 1.4.1 DC Circuits 1.4.2 AC Circuits 1.4.3 Active Devices1.5 Putting It Together: A Power Supply1.6 EndnotesCHAPTER 2: Logic Circuits2.1 Coding 2.1.1 BCD2.2 Combinatorial Logic 2.2.1 NOT Gate 2.2.2 AND and NAND Gates 2.2.3 OR and NOR Gates 2.2.4 XOR 2.2.5 Circuits 2.2.6 Tristate Devices2.3 Sequential Logic 2.3.1 Logic Wrap-Up2.4 Putting It All Together: The Integrated Circuit2.5 EndnotesCHAPTER 3: Embedded Processors3.2 ISA Architecture Models 3.2.1 Operations 3.2.2 Operands 3.2.3 Storage 3.2.4 Addressing Modes 3.2.5 Interrupts and Exception Handling 3.2.6 Application-Specific ISA Models 3.2.7 General-Purpose ISA Models 3.2.8 Instruction-Level Parallelism ISA Models3.3 Internal Processor Design 3.3.1 Central Processing Unit (CPU) 3.3.2 On-Chip Memory 3.3.3 Processor Input/Output (I/O) 3.3.4 Processor Buses3.4 Processor Performance 3.4.1 Benchmarks3.5 EndnotesCHAPTER 4: Embedded Board Buses and I/O4.1 Board I/O4.2 Managing Data: Serial vs. Parallel I/O 4.2.1 Serial I/O Example 1: Networking and Communications: RS-232 4.2.2 Example: Motorola/Freescale MPC823 FADS Board RS-232 System Model 4.2.3 Serial I/O Example 2: Networking and Communications: IEEE 802.11 Wireless LAN 4.2.4 Parallel I/O 4.2.5 Parallel I/O Example 3: “ Parallel” Output and Graphics I/O 4.2.6 Parallel and Serial I/O Example 4: Networking and Communications— Ethernet 4.2.7 Example 1: Motorola/Freescale MPC823 FADS Board Ethernet System Model 4.2.8 Example 2: Net Silicon ARM7 (6127001) Development Board Ethernet System Model 4.2.9 Example 3: Adastra Neptune x86 Board Ethernet System Model4.3 Interfacing the I/O Components 4.3.1 Interfacing the I/O Device with the Embedded Board 4.3.2 Interfacing an I/O Controller and the Master CPU4.4 I/O and Performance4.5 Board Buses4.6 Bus Arbitration and Timing 4.6.1 Nonexpandable Bus: I2C Bus Example 4.6.2 PCI (Peripheral Component Interconnect) Bus Example: Expandable4.7 Integrating the Bus with Other Board Components4.8 Bus Performance4.9 EndnotesCHAPTER 5: Memory Systems5.1 Introduction5.2 Memory Spaces 5.2.1 L1 Instruction Memory 5.2.2 Using L1 Instruction Memory for Data Placement 5.2.3 L1 Data Memory5.3 Cache Overview 5.3.1 What Is Cache? 5.3.2 Direct-Mapped Cache 5.3.3 Fully Associative Cache 5.3.4 N-Way Set-Associative Cache 5.3.5 More Cache Details 5.3.6 Write-Through and Write-Back Data Cache5.4 External Memory 5.4.1 Synchronous Memory 5.4.2 Asynchronous Memory 5.4.3 Nonvolatile Memories5.5 Direct Memory Access 5.5.1 DMA Controller Overview 5.5.2 More on the DMA Controller 5.5.3 Programming the DMA Controller 5.5.4 DMA Classifications 5.5.5 Register-Based DMA 5.5.6 Descriptor-Based DMA 5.5.7 Advanced DMA Features5.6 EndnotesCHAPTER 6: Timing Analysis in Embedded Systems6.1 Introduction6.2 Timing Diagram Notation Conventions 6.2.1 Rise and Fall Times 6.2.2 Propagation Delays 6.2.3 Setup and Hold Time 6.2.4 Tri-State Bus Interfacing6.2.5 Pulse Width and Clock Frequency6.3 Fan-Out and Loading Analysis: DC and AC 6.3.1 Calculating Wiring Capacitance 6.3.2 Fan-Out When CMOS Drives LSTTL 6.3.3 Transmission-Line Effects 6.3.4 Ground Bounce6.4 Logic Family IC Characteristics and Interfacing 6.4.1 Interfacing TTL Compatible Signals to 5 V CMOS6.5 Design Example: Noise Margin Analysis Spreadsheet6.6 Worst-Case Timing Analysis Example6.7 EndnotesCHAPTER 7: Chooosing a Microcontroller and Other Design Decisions7.1 Introduction7.2 Choosing the Right Core7.3 Building Custom Peripherals with FPGAs7.4 Whose Development Hardware to Use—Chicken or Egg?7.5 Recommended Laboratory Equipment7.6 Development Toolchains7.7 Free Embedded Operating Systems7.8 GNU and You: How Using “Free” Software Affects Your ProductCHAPTER 8:The Essence of Microcontroller Networking: RS-2328.1 Introduction8.2 Some History8.3 RS-232 Standard Operating Procedure8.4 RS-232 Voltage Conversion Considerations8.5 Implementing RS-232 with a Microcontroller 8.5.1 Basic RS-232 Hardware 8.5.2 Building a Simple Microcontroller RS-232 Transceiver8.6 Writing RS-232 Microcontroller Routines in BASIC8.7 Building Some RS-232 Communications Hardware 8.7.1 A Few More BASIC RS-232 Instructions8.8 I2C: The Other Serial Protocol 8.8.1 Why Use I²C? 8.8.2 The I²C Bus 8.8.3 I²C ACKS and NAKS 8.8.4 More on Arbitration and Clock Synchronization 8.8.5 I²C Addressing 8.8.6 Some I²C Firmware 8.8.7 The AVR Master I²C Code 8.8.8 The AVR I²C Master-Receiver Mode Code 8.8.9 The PIC I²C Slave-Transmitter Mode Code 8.8.10 The AVR-to-PIC I²C Communications Ball8.9 Communication Options 8.9.1 The Serial Peripheral Interface Port 8.9.2 The Controller Area Network 8.9.3 Acceptance Filters8.10 EndnotesCHAPTER 9: Interfacing to Sensors and Actuators9.1 Introduction9.2 Digital Interfacing 9.2.1 Mixing 3.3 and 5 V Devices 9.2.2 Protecting Digital Inputs 9.2.3 Expanding Digital Inputs 9.2.4 Expanding Digital Outputs9.3 High-Current Outputs 9.3.1 BJT-Based Drivers 9.3.2 MOSFETs 9.3.3 Electromechanical Relays 9.3.4 Solid-State Relays9.4 CPLDs and FPGAs9.5 Analog Interfacing: An Overview 9.5.1 ADCs 9.5.2 Project 1: Characterizing an Analog Channel9.6 Conclusion9.7 EndnotesCHAPTER 10: Other Useful Hardware Design Tips and Techniques10.1 Introduction10.2 Diagnostics10.3 Connecting Tools10.4 Other Thoughts10.5 Construction Methods 10.5.1 Power and Ground Planes 10.5.2 Ground Problems10.6 Electromagnetic Compatibility10.7 Electrostatic Discharge Effects 10.7.1 Fault Tolerance10.8 Hardware Development Tools 10.8.1 Instrumentation Issues10.9 Software Development Tools10.10 Other Specialized Design Considerations 10.10.1 Thermal Analysis and Design 10.10.2 Battery-Powered System Design Considerations10.11 Processor Performance Metrics 10.11.1 IPS 10.11.2 OPS 10.11.3 BenchmarksAPPENDIX A: Schematic Symbols APPENDIX B: Acronyms and AbbreviationsAPPENDIX C: PC Board Design IssuesC.1 IntroductionC.2 Resistance of ConductorsC.3 Voltage Drop in Signal Leads—“Kelvin” FeedbackC.4 Signal Return CurrentsC.5 Grounding in Mixed Analog/Digital SystemsC.6 Ground and Power PlanesC.7 Double-Sided versus Multilayer Printed Circuit BoardsC.8 Multicard Mixed-Signal SystemsC.9 Separating Analog and Digital GroundsC.10 Grounding and Decoupling Mixed-Signal ICs with Low Digital CurrentsC.11 Treat the ADC Digital Outputs with CareC.12 Sampling Clock ConsiderationsC.13 The Origins of the Confusion About Mixed-Signal Grounding: Applying Single-Card Grounding Concepts to Multicard SystemsC.14 Summary: Grounding Mixed-Signal Devices with Low Digital Currents in a Multicard SystemC.15 Summary: Grounding Mixed-Signal Devices with High Digital Currents in a Multicard SystemC.16 Grounding DSPs with Internal Phase-Locked LoopsC.17 Grounding SummaryC.16 Some General PC Board Layout Guidelines for Mixed-Signal SystemsC.19 Skin EffectC.20 Transmission LinesC.21 Be Careful with Ground Plane BreaksC.22 Ground Isolation TechniquesC.23 Static PCB EffectsC.24 Sample MINIDIP and SOIC Op Amp PCB Guard LayoutsC.25 Dynamic PCB EffectsC.26 Stray CapacitanceC.27 Capacitive Noise and Faraday ShieldsC.28 The Floating Shield ProblemC.29 Buffering ADCs Against Logic NoiseC.28 Endnotes
- No. of pages: 544
- Language: English
- Edition: 1
- Published: September 14, 2007
- Imprint: Newnes
- eBook ISBN: 9780080560748
JG
Jack Ganssle
Jack Ganssle has 30 years' experience developing embedded systems. He has authored two books, The Art of Programming Embedded Systems and The Art of Designing Embedded Systems, and writes a regular column in Embedded Systems Programming magazine. Michael Barr is the editor-in-chief of Embedded Systems Programming magazine and the principal of Netrino Consultants Network. He wrote Programming Embedded Systems in C and C++.
Affiliations and expertise
Founder and Principal Consultant, The Ganssle Group, Baltimore,MD, USA;
Technical editor and columnist for Embedded Systems Programming magazineTN
Tammy Noergaard
Tammy Noergaard has many years of professional experience including as a robotics Staff Engineer to Embedded Engineering Director in developing Class III medical devices, Chief Specialist in embedded systems at Terma, as well as independent consultancy in software, systems and field engineering for a few European and California-based corporations. She has also worked as a software engineer with Sony Electronics and Hyundai. Tammy is also an author and co-author of embedded systems books published by Elsevier, including "Embedded Systems Architecture" and "Demystifying Embedded Systems Middleware".
Affiliations and expertise
Chief Specialist, Embedded Systems, Terma, DenmarkFE
Fred Eady
As an engineering consultant, Fred Eady has implemented communications networks for the space program and designed hardware and firmware for the medical, retail and public utility industries. He currently writes a monthly embedded design column for a popular electronics enthusiast magazine. Fred also composes monthly articles for a popular robotics magazine. Fred has been dabbling in electronics for over 30 years. His embedded design expertise spans the spectrum and includes Intel’s 8748 and 8051 microcontrollers, the entire Microchip PIC microcontroller family and the Atmel AVR microcontrollers. Fred recently retired from his consulting work and is focused on writing magazine columns and embedded design books.
Affiliations and expertise
Systems Engineer, EDTP Electronics, FL, USALE
Lewin Edwards
Lewin Edwards is an embedded engineer with over 15 years experience designing embedded systems hardware, firmware, and control software.
Affiliations and expertise
Digi-Frame Inc., Port Chester, NY, USADK
David J. Katz
Affiliations and expertise
Analog Devices, Inc., Norwood, MA, USARG
Rick Gentile
Rick Gentile joined ADI in 2000 as a Senior DSP Applications Engineer, and he currently leads the Processor Applications Group, which is responsible for Blackfin, SHARC and TigerSHARC processors. Prior to joining ADI, Rick was a Member of the Technical Staff at MIT Lincoln Laboratory, where he designed several signal processors used in a wide range of radar sensors. He has authored dozens of articles and presented at multiple technical conferences. He received a B.S. in 1987 from the University of Massachusetts at Amherst and an M.S. in 1994 from Northeastern University, both in Electrical and Computer Engineering.
Affiliations and expertise
Analog Devices, Inc., Norwood, MA, USAKA
Ken Arnold
Ken Arnold is the founder and former president of Paragon Engineering Services, Houston, Texas. He has more that 40 years of experience in the operations and project management. He is actively involved in production facility design. He has served on numerous SPE, API, and government advisory committees as an expert on oil handling, produced-water treating, and safety aspects producing operations.
Affiliations and expertise
Senior Technical Advisor, WorleyParsons Group