Design and Application of Intelligent Thermally Conductive Materials
- 1st Edition - March 14, 2025
- Imprint: Elsevier
- Author: Wei Feng
- Language: English
- Paperback ISBN:9 7 8 - 0 - 4 4 3 - 4 0 4 0 9 - 2
- eBook ISBN:9 7 8 - 0 - 4 4 3 - 4 0 4 1 0 - 8
Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and applic… Read more
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Request a sales quoteDesign and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. It provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity.
For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.
For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.
- Focuses on the newly evolving field of intelligent thermal conductive materials: a new type of functional materials designed for rapid heat diversion and management that enables autonomous response to the thermal environment using intelligent thermal conductivity control
- Covers a broad range of topics relating to these newly-developed materials: from the structure of the basic materials to the design and application of intelligent materials
- Discusses the application capacity for this type of intelligent or smart material
- Provides updates on potential bottlenecks to the development, design, related technology, and production of these materials
Researchers, postgraduates and senior undergraduates in fields related to intelligent heat-conducting materials
- Design and Application of Intelligent Thermally Conductive Materials
- Cover image
- Title page
- Table of Contents
- Copyright
- Preface
- Description of contents
- Chapter 1 Overview of thermal conductivity
- Abstract
- Keywords
- 1.1 Thermally conductive materials
- 1.2 Mechanism of thermal conductivity
- 1.3 Influencing factors
- 1.3.1 Thermally conductive fillers
- 1.3.2 Thermally conductive substrates
- 1.3.3 Thermally conductive interfaces
- 1.4 Test methods
- 1.4.1 Homeostatic approach
- 1.4.2 Dynamic approach
- 1.5 Research status and industry
- 1.6 Summary of this chapter
- References
- Chapter 2 Overview of intelligent thermally conductive materials
- Abstract
- Keywords
- 2.1 Concept of intelligent thermally conductive materials
- 2.2 Heat transfer mechanism of intelligent thermally conductive materials
- 2.2.1 Phonon conduction
- 2.2.2 Phonon conduction in intrinsic intelligent thermally conductive materials
- 2.2.3 Phonon conduction of embedded intelligent thermally conductive materials
- 2.3 Influencing factors
- 2.3.1 Ambient temperature
- 2.3.2 Volume morphology
- 2.3.3 External pressure
- 2.4 Classification of intelligent thermally conductive materials
- 2.4.1 Metal-based intelligent thermally conductive materials
- 2.4.2 Nonmetallic carbon-based intelligent thermally conductive materials
- 2.4.3 Polymer-based intelligent thermally conductive materials
- 2.4.4 Phase-change intelligent thermally conductive materials
- 2.4.5 Thermal-induced shape memory intelligent materials
- 2.4.6 Thermochromic intelligent materials
- 2.4.7 High thermal conductivity intelligent thermal interface composite material
- 2.5 Summary of this chapter
- References
- Chapter 3 Designing for intelligent performance
- Abstract
- Keywords
- 3.1 Temperature perception
- 3.1.1 Shape memory polymer materials
- 3.1.2 Temperature-sensitive hydrogel material
- 3.1.3 Liquid crystal elastomer material
- 3.2 Intelligent thermally conductive control
- 3.2.1 Nanosuspension materials
- 3.2.2 Phase change materials
- 3.2.3 Atomic intercalation materials
- 3.2.4 Soft material
- 3.2.5 Materials regulated by specific external fields
- 3.3 Temperature-responsive thermal switch
- 3.3.1 Solid-liquid phase change thermal switch
- 3.3.2 Soft matter switch
- 3.3.3 Metal or inorganic thermal switches
- 3.4 Integration of multiple intelligent functions
- 3.4.1 Thermal management sensing materials
- 3.4.2 Thermal management—Infrared materials
- 3.4.3 Thermal management—Phase change materials
- 3.4.4 Thermal management—Self-healing materials
- 3.5 Summary of this chapter
- References
- Chapter 4 Design of intelligent thermally conductive materials
- Abstract
- Keywords
- 4.1 Intelligent thermally conductive matrix material design
- 4.1.1 Polymer intelligent thermally conductive matrixes
- 4.1.2 Metal intelligent thermally conductive substrates
- 4.1.3 Inorganic nonmetallic intelligent thermally conductive matrixes
- 4.2 Design of intelligent thermally conductive fillers
- 4.2.1 Metal-based thermally conductive fillers
- 4.2.2 Carbon-based thermally conductive fillers
- 4.2.3 Inorganic thermally conductive fillers
- 4.2.4 Intelligent thermally conductive fillers
- 4.3 Intelligent thermally conductive material composite technology
- 4.3.1 Network construction
- 4.3.2 Interface modificationa
- 4.3.3 Composite technology
- 4.4 Chapter summary
- References
- Chapter 5 Application of intelligent thermally conductive materials
- Abstract
- Keywords
- 5.1 Intelligent temperature control
- 5.1.1 Intelligent textiles for clothing
- 5.1.2 Temperature intelligent sensing
- 5.2 Temperature intelligent response
- 5.2.1 Intelligent robots
- 5.2.2 Thermal response
- 5.2.3 Other applications
- 5.3 Intelligent temperature switches
- 5.3.1 Azo switches
- 5.3.2 Adaptive switch
- 5.4 Other applications
- 5.4.1 Flexible thermal conductive materials
- 5.4.2 Fire warning materials
- 5.4.3 Sensing temperature control device
- 5.4.4 Dynamic color application
- 5.4.5 Intelligent packaging technology
- 5.4.6 Steam plugging material
- 5.4.7 Shape memory intelligent devices
- 5.4.8 Bionic robots
- 5.4.9 Battery safety technology
- 5.4.10 Green building
- 5.5 Chapter summary
- References
- Chapter 6 Application of intelligent thermally conductive materials in advanced chips
- Abstract
- Keywords
- 6.1 Current development status of chip cooling
- 6.1.1 Active cooling
- 6.1.2 Passive cooling
- 6.2 Design of thermal conductive materials for chips
- 6.2.1 Chiplet technology challenges and thermal conductive material design
- 6.2.2 MCM packaging
- 6.2.3 2.5D packaging and thermally conductive material design
- 6.2.4 3D packaging and thermally conductive material design
- 6.2.5 Electric thermal coupling problem and heat dissipation solution
- 6.3 Development status
- 6.3.1 Air cooling and heat dissipation
- 6.3.2 Liquid cooling
- 6.3.3 LED lighting
- 6.3.4 Laser devices
- 6.4 Future development trends of chip cooling materials
- 6.5 Chapter summary
- References
- Chapter 7 Conclusion and prospects
- Abstract
- Keywords
- 7.1 Technical bottleneck of intelligent thermally conductive materials
- 7.1.1 Intelligent material process design
- 7.1.2 Technical bottleneck of intelligent thermally conductivity material preparation
- 7.2 Potential application
- 7.2.1 Variable heat resistor
- 7.2.2 Energy-saving air conditioners
- 7.2.3 Solid-state refrigeration systems
- 7.2.4 Thermal computers
- 7.2.5 Human thermal management
- 7.2.6 Energy conversion and storage
- 7.2.7 Infrared stealth
- 7.2.8 Intelligent battery thermal control
- 7.3 Outlook
- References
- Index
- Edition: 1
- Published: March 14, 2025
- Imprint: Elsevier
- No. of pages: 900
- Language: English
- Paperback ISBN: 9780443404092
- eBook ISBN: 9780443404108
WF
Wei Feng
Professor Wei Feng based at Tianjin University, China. He serves as a member of the 7th and 8th Academic Committee of Science and Technology Commission of the Ministry of Education, an executive director of the Chinese Society for Composite Materials, the first chairman of the Thermal Conductive Composites Committee of the Chinese Society for Composite Materials, and an executive director of the Polymer Materials and Engineering Branch of the Chinese Society for Materials Research. He is mainly engaged in the research of functional organic carbon composites and their applications, including high thermal conductivity materials, high-performance photothermal conversion and storage materials, structural fluorinated carbon materials, and bionic smart materials
Affiliations and expertise
Tianjin University, ChinaRead Design and Application of Intelligent Thermally Conductive Materials on ScienceDirect