Design and Application of Intelligent Thermally Conductive Materials
- 1st Edition - March 21, 2025
- Author: Wei Feng
- Language: English
- Paperback ISBN:9 7 8 - 0 - 4 4 3 - 4 0 4 0 9 - 2
- eBook ISBN:9 7 8 - 0 - 4 4 3 - 4 0 4 1 0 - 8
Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and applic… Read more
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Request a sales quoteDesign and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. It provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity.
For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.
For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.
- Focuses on the newly evolving field of intelligent thermal conductive materials: a new type of functional materials designed for rapid heat diversion and management that enables autonomous response to the thermal environment using intelligent thermal conductivity control
- Covers a broad range of topics relating to these newly-developed materials: from the structure of the basic materials to the design and application of intelligent materials
- Discusses the application capacity for this type of intelligent or smart material
- Provides updates on potential bottlenecks to the development, design, related technology, and production of these materials
Researchers, postgraduates and senior undergraduates in fields related to intelligent heat-conducting materials
1. Overview of thermal conductivity
1.1 Thermal conductive materials
1.2 Thermal conductivity mechanism
1.3 Influencing factors
1.3.1 Thermal conductive filler
1.3.2 Thermal conductive substrate
1.3.3 Thermal conductivity interface
1.4 Testing methods
1.4.1 Steady state method
1.4.2 Dynamic method
1.5 Research status and industry
1.6 Summary of Chapter
1 1.7 References
2. Overview of intelligent thermal conductive materials
2.1 Concept of intelligent thermal conductive materials
2.2 Heat transfer mechanism of intelligent thermal conductive materials
2.2.1 Phonon conduction
2.2.2 Intrinsic intelligent thermal conductive material phonon conduction
2.2.3 Phonon conduction of embedded intelligent thermal conductive materials
2.3 Influencing factors
2.3.1 Environmental temperature
2.3.2 Volume morphology
2.3.3 Other factors
2.4 Classification of intelligent thermal conductive materials
2.4.1 Metal based intelligent thermal conductive materials
2.4.2 Non-metallic carbon based intelligent thermal conductive materials
2.4.3 Polymer based intelligent thermal conductive materials
2.4.4 Phase change intelligent thermal conductive materials
2.4.5 Thermally induced shape memory intelligent materials
2.4.6 Thermochromic smart materials
2.4.7 High thermal conductivity intelligent thermal interface composite materials
2.5 Summary of Chapter
2 2.6 References
3. Design of intelligent performance
3.1 Temperature perception
3.1.1 Shape memory aggregation
3.1.2 Temperature sensitive hydrogel
3.1.3 Liquid crystal elastomers
3.2 Intelligent thermal conductivity control
3.2.1 Nanoparticle suspension
3.2.2 Phase change materials
3.2.3 Atomic intercalation materials
3.2.4 Soft material materials
3.2.5 Materials regulated by specific external fields
3.3 Thermal response switch
3.3.1 Solid liquid phase change thermal switch
3.3.2 Soft matter switch
3.3.3 Metal or inorganic thermal switches
3.4 Integration of multiple intelligent functions
3.4.1 Thermal management - sensing materials
3.4.2 Thermal management - infrared materials
3.4.3 Thermal management - phase change materials
3.4.4 Thermal management - self repairing materials
3.5 Summary of Chapter
3 3.6 References
4. Design of intelligent thermal conductive materials
4.1 Design of intelligent thermal conductive matrix materials
4.1.1 Intelligent thermal conductive polymer matrix
4.1.2 Metal intelligent thermal conductivity substrate
4.1.3 Inorganic non-metallic intelligent thermal conductive matrix
4.2 Design of intelligent thermal conductive filler
4.2.1 Metal based thermal conductive filler
4.2.2 Carbon based thermal conductive filler
4.2.3 Intelligent thermal conductive filler
4.2.4 Other thermal conductive fillers
4.3 Intelligent thermal conductive material composite technology
4.3.1 Network construction
4.3.2 Interface repair
4.3.3 Composite technology
4.4 Summary of Chapter
4 4.5 References
5. Application of intelligent thermal conductive materials
5.1 Intelligent temperature control
5.1.1 Intelligent textiles and clothing
5.1.2 Temperature intelligent perception
5.2 Temperature intelligent response
5.2.1 Intelligent robots
5.2.2 Thermal response
5.2.3 Other applications
5.3 Temperature intelligent switch
5.3.1 Azo type switches
5.3.2 Adaptive switch
5.4 Other applications
5.4.1 Flexible thermal conductive materials
5.4.2 Fire warning materials
5.4.3 Temperature sensing adjustment device
5.4.4 Dynamic color application
5.4.5 Intelligent packaging technology
5.4.6 Steam sealing materials
5.4.7 Shape memory intelligent devices
5.4.8 Biomimetic robots
5.4.9 Battery safety technology
5.4.10 Green Building
5.5 Summary of Chapter
5 5.6 References
6. Application of intelligent thermal conductive materials in advanced chips
6.1 Current development status of chip cooling
6.1.1 Active cooling
6.1.2 Passive heat dissipation
6.2 Design of chip thermal conductive materials
6.2.1 Chiplet technology challenges and thermal conductive material design
6.2.2 MCM packaging
6.2.3 2.5D packaging and thermal conductivity material design
6.2.4 3D packaging and thermal conductive material design
6.2.5 Electrical and thermal coupling problems and heat dissipation solutions
6.3 Development status
6.3.1 Air cooling and heat dissipation
6.3.2 Liquid cooling heat dissipation
6.3.3 LED lighting
6.4 Future development trends of chip cooling materials
6.5 References
7. Conclusions and outlook
7.1 Technical bottlenecks of intelligent thermal conductive materials
7.1.1 Intelligent thermal conductive material process design
7.1.2 Technical bottlenecks in the preparation of intelligent thermal conductive materials
7.2 Potential applications
7.2.1 Variable temperature resistor
7.2.2 Energy saving air conditioning
7.2.3 Solid state refrigeration
7.2.4 Thermal Calculation
7.2.5 Human thermal management
7.2.6 Energy conversion and storage
7.2.7 Infrared stealth
7.2.8 Intelligent thermal regulation of batteries
7.3 Outlook
7.4 References
1.1 Thermal conductive materials
1.2 Thermal conductivity mechanism
1.3 Influencing factors
1.3.1 Thermal conductive filler
1.3.2 Thermal conductive substrate
1.3.3 Thermal conductivity interface
1.4 Testing methods
1.4.1 Steady state method
1.4.2 Dynamic method
1.5 Research status and industry
1.6 Summary of Chapter
1 1.7 References
2. Overview of intelligent thermal conductive materials
2.1 Concept of intelligent thermal conductive materials
2.2 Heat transfer mechanism of intelligent thermal conductive materials
2.2.1 Phonon conduction
2.2.2 Intrinsic intelligent thermal conductive material phonon conduction
2.2.3 Phonon conduction of embedded intelligent thermal conductive materials
2.3 Influencing factors
2.3.1 Environmental temperature
2.3.2 Volume morphology
2.3.3 Other factors
2.4 Classification of intelligent thermal conductive materials
2.4.1 Metal based intelligent thermal conductive materials
2.4.2 Non-metallic carbon based intelligent thermal conductive materials
2.4.3 Polymer based intelligent thermal conductive materials
2.4.4 Phase change intelligent thermal conductive materials
2.4.5 Thermally induced shape memory intelligent materials
2.4.6 Thermochromic smart materials
2.4.7 High thermal conductivity intelligent thermal interface composite materials
2.5 Summary of Chapter
2 2.6 References
3. Design of intelligent performance
3.1 Temperature perception
3.1.1 Shape memory aggregation
3.1.2 Temperature sensitive hydrogel
3.1.3 Liquid crystal elastomers
3.2 Intelligent thermal conductivity control
3.2.1 Nanoparticle suspension
3.2.2 Phase change materials
3.2.3 Atomic intercalation materials
3.2.4 Soft material materials
3.2.5 Materials regulated by specific external fields
3.3 Thermal response switch
3.3.1 Solid liquid phase change thermal switch
3.3.2 Soft matter switch
3.3.3 Metal or inorganic thermal switches
3.4 Integration of multiple intelligent functions
3.4.1 Thermal management - sensing materials
3.4.2 Thermal management - infrared materials
3.4.3 Thermal management - phase change materials
3.4.4 Thermal management - self repairing materials
3.5 Summary of Chapter
3 3.6 References
4. Design of intelligent thermal conductive materials
4.1 Design of intelligent thermal conductive matrix materials
4.1.1 Intelligent thermal conductive polymer matrix
4.1.2 Metal intelligent thermal conductivity substrate
4.1.3 Inorganic non-metallic intelligent thermal conductive matrix
4.2 Design of intelligent thermal conductive filler
4.2.1 Metal based thermal conductive filler
4.2.2 Carbon based thermal conductive filler
4.2.3 Intelligent thermal conductive filler
4.2.4 Other thermal conductive fillers
4.3 Intelligent thermal conductive material composite technology
4.3.1 Network construction
4.3.2 Interface repair
4.3.3 Composite technology
4.4 Summary of Chapter
4 4.5 References
5. Application of intelligent thermal conductive materials
5.1 Intelligent temperature control
5.1.1 Intelligent textiles and clothing
5.1.2 Temperature intelligent perception
5.2 Temperature intelligent response
5.2.1 Intelligent robots
5.2.2 Thermal response
5.2.3 Other applications
5.3 Temperature intelligent switch
5.3.1 Azo type switches
5.3.2 Adaptive switch
5.4 Other applications
5.4.1 Flexible thermal conductive materials
5.4.2 Fire warning materials
5.4.3 Temperature sensing adjustment device
5.4.4 Dynamic color application
5.4.5 Intelligent packaging technology
5.4.6 Steam sealing materials
5.4.7 Shape memory intelligent devices
5.4.8 Biomimetic robots
5.4.9 Battery safety technology
5.4.10 Green Building
5.5 Summary of Chapter
5 5.6 References
6. Application of intelligent thermal conductive materials in advanced chips
6.1 Current development status of chip cooling
6.1.1 Active cooling
6.1.2 Passive heat dissipation
6.2 Design of chip thermal conductive materials
6.2.1 Chiplet technology challenges and thermal conductive material design
6.2.2 MCM packaging
6.2.3 2.5D packaging and thermal conductivity material design
6.2.4 3D packaging and thermal conductive material design
6.2.5 Electrical and thermal coupling problems and heat dissipation solutions
6.3 Development status
6.3.1 Air cooling and heat dissipation
6.3.2 Liquid cooling heat dissipation
6.3.3 LED lighting
6.4 Future development trends of chip cooling materials
6.5 References
7. Conclusions and outlook
7.1 Technical bottlenecks of intelligent thermal conductive materials
7.1.1 Intelligent thermal conductive material process design
7.1.2 Technical bottlenecks in the preparation of intelligent thermal conductive materials
7.2 Potential applications
7.2.1 Variable temperature resistor
7.2.2 Energy saving air conditioning
7.2.3 Solid state refrigeration
7.2.4 Thermal Calculation
7.2.5 Human thermal management
7.2.6 Energy conversion and storage
7.2.7 Infrared stealth
7.2.8 Intelligent thermal regulation of batteries
7.3 Outlook
7.4 References
- No. of pages: 900
- Language: English
- Edition: 1
- Published: March 21, 2025
- Imprint: Elsevier
- Paperback ISBN: 9780443404092
- eBook ISBN: 9780443404108
WF
Wei Feng
Professor Wei Feng based at Tianjin University, China. He serves as a member of the 7th and 8th Academic Committee of Science and Technology Commission of the Ministry of Education, an executive director of the Chinese Society for Composite Materials, the first chairman of the Thermal Conductive Composites Committee of the Chinese Society for Composite Materials, and an executive director of the Polymer Materials and Engineering Branch of the Chinese Society for Materials Research. He is mainly engaged in the research of functional organic carbon composites and their applications, including high thermal conductivity materials, high-performance photothermal conversion and storage materials, structural fluorinated carbon materials, and bionic smart materials
Affiliations and expertise
Tianjin University, China